Photoetching method and device of roll to roll flexible substrate

A flexible substrate and roll flexible technology, which is applied in photolithography exposure devices, microlithography exposure equipment, optics, etc., can solve the problems of inability to realize the patterning process of TFT array substrates and high precision of patterning alignment, and achieve Save process equipment costs, improve yield and production tact, and improve the effect of production tact

Active Publication Date: 2016-05-04
SHANGHAI UNIV
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Problems solved by technology

[0005] The production of flexible TFT array substrates requires more than 4 photolithography processes, and the more general photolithography process requires 5 photolithography processes. The display line width is small, reaching several microns, and the pattern alignment accuracy is high. It needs to be less than or equal to 1 micron, so the above-mentioned method cannot realize the patterning process of the TFT array substrate based on the roll-to-roll flexible substrate at present, so it is urgent to study a new photolithography method to realize the patterning process requirements

Method used

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  • Photoetching method and device of roll to roll flexible substrate
  • Photoetching method and device of roll to roll flexible substrate
  • Photoetching method and device of roll to roll flexible substrate

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Embodiment Construction

[0025] Preferred embodiments of the present invention are described in detail as follows:

[0026] In this example, see figure 2 and image 3 , a roll-to-roll flexible substrate lithography device, mainly composed of an ultraviolet light source 50, a flexible substrate conveying system and a photoresist coating device, the photoresist coating device coats photoresist on the flexible substrate 10 80. The flexible substrate transfer system is mainly composed of the first directional transmission shaft 20, the second directional transmission shaft 21 and the corresponding transmission shaft drivers. After the photoresist 80 is coated on the flexible substrate 10, the photoresist 80 will be coated One side of the flexible substrate 10 is wound onto the surface of the first orientation transmission shaft 20, and the flexible substrate 10 part coated with photoresist 80 is transported to the substrate film pattern manufacturing position by driving the first orientation transmissio...

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Abstract

The invention discloses a photoetching method and device of a roll to roll flexible substrate. By designing an exposure infrared transmission path and an exposure mode, photoetching of the flexible substrate is achieved, and process steps of attaching a traditional flexible substrate onto a glass substrate, final substrate stripping and the like are not needed; and on one hand, the process device cost is saved, and on the other hand, the production yield and the production rate are improved. The fabrication process is simple, the production rate can be effectively improved, and rapid and high-quality etching on the flexible substrate can be achieved on the condition of lower production cost. The device disclosed by the invention mainly comprises an infrared light source, a flexible substrate transfer system and a photoresist coating device. The device is simple in structure, and is convenient to use, maintain and fabricate.

Description

technical field [0001] The invention relates to a method and device for manufacturing a TFT array substrate in the display field, in particular to a photolithography method and device for a TFT array, which are applied in the technical field of thin film transistor preparation based on roll-to-roll flexible substrate photolithography. Background technique [0002] The English full name of the thin film transistor is ThinFilmTransistor, abbreviated as TFT. [0003] The English full name of roll-to-roll is RolltoRoll, abbreviated as R2R. The traditional R2R substrate film pattern manufacturing method is as follows: [0004] Use screen printing, laser patterning, inkjet printing and other methods to realize the transfer of single-layer film patterning to flexible substrates, but the patterning achieved by the above methods can generally only realize the film layer with a large pattern line width , the line width of the lithography pattern of the film layer is usually tens of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/2004G03F7/2022
Inventor 陈龙龙张建华李喜峰张帅黄霏
Owner SHANGHAI UNIV
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