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A 3t CMOS pixel unit structure and its signal acquisition method

A pixel unit and unit structure technology, applied in image communication, electrical components, radiation control devices, etc., can solve the problem of limiting the improvement of the linearity of the dynamic range of the pixel unit, affecting the improvement of the filling factor of the pixel unit, and occupying the peripheral circuit of the transistor. Achieve effective quality management, reduce production costs, and improve dynamic range

Active Publication Date: 2018-12-18
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1
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  • Summary
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  • Claims
  • Application Information

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Problems solved by technology

In this structural design, the peripheral circuit of the transistor occupies a large unit area, which affects the further improvement of the fill factor of the pixel unit.
At the same time, the transistor is used as the source follower of the output signal, which also limits the dynamic range of the entire pixel unit and the improvement of linearity

Method used

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  • A 3t CMOS pixel unit structure and its signal acquisition method
  • A 3t CMOS pixel unit structure and its signal acquisition method
  • A 3t CMOS pixel unit structure and its signal acquisition method

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Embodiment Construction

[0039] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0040] Secondly, the present invention is described in detail by means of schematic diagrams. When describing the examples of the present invention in detail, for the convenience of explanation, the schematic diagrams are not partially enlarged according to the general scale, which should not be used as a limitation of the present invention.

[0041]The present invention provides a 3T CMOS pixel unit. The unit structure includes a pinned photodiode PPD, a reset switch M1, a photoelectric signal transmission tube M2 and a floating gate transistor M3, wherein the floa...

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Abstract

The invention proposes a 3T CMOS pixel unit structure and a method for signal acquisition and output thereof. The pixel unit is composed of a pinned photodiode PPD, a level reset transistor M1, a signal transmission transistor M2 and a floating gate transistor M3. After M1 completes the reset of the unit structure, PPD converts the collected optical signal into an electrical signal, transmits it to the FD point connected to M3 through M2, and outputs it through M3. The floating gate transistor of the present invention can not only serve as an output signal buffer, but also control the output of the pixel unit by writing and erasing the floating gate, thereby reducing the number of unit transistors to three without affecting the unit function. The fill factor of the pixel unit is greatly improved. Since the threshold voltage of the floating gate transistor in the gate state is much smaller than the source follower used as the output signal buffer in the traditional pixel unit, its dynamic range and linearity are significantly improved on the basis of the traditional pixel unit.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a novel structure of a 3T CMOS image sensor pixel unit structure and a signal collection method thereof. Background technique [0002] The image sensor is an important part of the camera, which is realized by a CMOS or CCD image sensor. [0003] The pixel unit of a conventional CMOS image sensor is the core device of the image sensor to realize light sensing. It usually includes: a photosensitive unit photodiode for photoelectric conversion and a series of peripheral circuits for transmission, signal conversion, amplification and control. [0004] Key specifications for CMOS image sensor design include: fill factor and output voltage magnitude. The size of the fill factor directly determines the photosensitive ability of the pixel. The larger the area of ​​the photodiode and the smaller the area of ​​the readout transistor, the higher the photosensitive sensitivity. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/374H04N5/353H01L27/146
CPCH01L27/14614H04N25/53H04N25/76
Inventor 温建新
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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