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Anisotropic conductive film composition harmless to human body, anisotropic conductive film, and semiconductor device connected by film

An anisotropic conductive film and composition technology, applied to the conductive layer on the insulating carrier, conductive materials dispersed in non-conductive inorganic materials, semiconductor devices, etc., can solve problems such as removal and achieve good solution stability or the effect of solubility

Active Publication Date: 2016-05-18
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, despite the increasing demand for products that do not contain toxic substances, few attempts have been made to remove the toxic components from existing anisotropic conductive films, and conversely, for the purpose of improving product characteristics, Add some toxic components in large amounts

Method used

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  • Anisotropic conductive film composition harmless to human body, anisotropic conductive film, and semiconductor device connected by film
  • Anisotropic conductive film composition harmless to human body, anisotropic conductive film, and semiconductor device connected by film
  • Anisotropic conductive film composition harmless to human body, anisotropic conductive film, and semiconductor device connected by film

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0065] Example 1: Preparation of anisotropic conductive film composition harmless to human body

[0066] 10% by weight of NBR resin (N-34, Nippon Zeon) based on the total composition of the solid content; 30% by weight of polyurethane adhesive (NPC7007T, Nynex); 20% by weight Urethane acrylate (NPC7000, Nynex); and 10% by weight acrylic adhesive (AOF-7003, Aekyung Chemical) dissolved in ethyl acetate / butyl acetate (ethyl acetate: Hansen solubility parameter: 18.2; boiling point: 77°C, butyl acetate: Hansen solubility parameter; 17.4; boiling point: 125°C to 127°C) as a binder system resin serving as a matrix for film formation.

[0067] 2% by weight of pentaerythritol tri(meth)acrylate, which is a radically polymerized (meth)acrylate monomer; 10% by weight of 4-hydroxybutyl (meth)acrylate; and 7.5% by weight of dimethylol tri Cyclodecane diacrylate was dissolved in ethyl acetate / butyl acetate as the reactive monomer, and 2.5% by weight lauroyl peroxide was dissolved in ethyl ...

example 2

[0068] Example 2: Preparation of an anisotropic conductive film composition that is harmless to the human body

[0069] A composition for an anisotropic conductive film of Example 2 was prepared in the same manner as in Example 1 except that 2.5% by weight of cumene hydroperoxide was used as a curing agent instead of lauroyl peroxide.

example 3

[0070] Example 3: Preparation of anisotropic conductive film composition harmless to human body

[0071] The composition for the anisotropic conductive film of Example 3 was prepared in the same manner as in Example 1, except that ethyl acetate was used alone as a solvent instead of ethyl acetate / butyl acetate of Example 1.

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Abstract

The present invention relates to: an anisotropic conductive film composition comprising a binder part, a hardening part, a hardening agent, conductive particles, and a solvent having Hansen solubility parameters of 17 to 20; an anisotropic conductive film; and a semiconductor device connected by the film.

Description

technical field [0001] The present invention relates to an anisotropic conductive film composition harmless to human body, an anisotropic conductive film and a semiconductor device connected by the anisotropic conductive film. Background technique [0002] Anisotropic conductive film (Anisotropic conductive film, ACF) refers to a film-like adhesive in which conductive particles such as metal particles or metal-coated plastic particles are dispersed in resin, and is widely used in circuit connections of flat-panel displays and assembly of semiconductor components and the like. When the anisotropic conductive film is disposed between circuit boards to be connected and subjected to heating and compression under certain conditions, the circuit terminals of the circuit boards are electrically connected via conductive particles, and the insulating adhesive resin fills the space between adjacent circuit terminals (space) to isolate conductive particles from each other, thereby pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/20H01B5/14C09J9/02C09J7/02C09J7/20
CPCC09J9/02H01B1/20H01L2224/2939H01L2224/29455H01L2224/29439H01L2224/29447H01L24/29H01L2224/16238H01L2224/2929H01L2224/29298H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/73204H01L2924/00014H01L2224/29444C09J7/20H01L2924/207H01L2224/13099C09J7/22H01B5/14H01L21/02008H01L21/02013H01L21/6836H01L2221/68327C09J2203/326C09J2301/314C09J2301/408
Inventor 高连助姜炅求金奎峰金二柱
Owner KUKDO ADVANCED MATERIALS CO LTD
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