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Formaldehyde-free electroless metal plating compositions and methods

An electrodeless and composite technology, applied in metal material coating process, printed circuit, electrical components, etc., can solve the problems of high operation cost and decrease

Inactive Publication Date: 2019-03-15
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it can be seen that the concentration of glyoxylic acid drops sharply in the bath and leads to the termination of electroless copper plating unless more reducing agent is added
Therefore, the operating cost is very high

Method used

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  • Formaldehyde-free electroless metal plating compositions and methods
  • Formaldehyde-free electroless metal plating compositions and methods
  • Formaldehyde-free electroless metal plating compositions and methods

Examples

Experimental program
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Effect test

example 1

[0089] Glyoxylic acid reduced copper plating compositions were prepared as indicated below. The composition comprises copper ions, glyoxylic acid as a reducing agent, potassium tartrate as a copper complexing agent, potassium hydroxide as a pH regulator, an inhibitor of glyoxylic acid decomposition and 2,2'-linked pyridine. The electroless copper composition is formaldehyde free. It was tested for the quality of its copper deposits and the stability of glyoxylic acid.

[0090] Table 1

[0091]

[0092]

example 2

[0094] The temperature of the composition of Formulation 1 of Table 1 was maintained at 40°C and the pH of the composition was 13 during the electroless copper deposition. Copper was deposited on the substrate for 5 minutes. The substrates used were a non-clad S1141 epoxy / glass laminate measuring 5 cm x 5 cm and a copper clad S1141 ring measuring 2 cm x 3.5 cm obtained from Shengyi Technology Co., Ltd. Oxygen resin / glass multi-layer laminate (six layers). The former is used to measure the deposition rate, and the latter is used to evaluate the backlight performance of the vias. Drill smear and other impurities from the through-holes in each board are then removed in a vertical desmear line process as follows:

[0095] 1. Plate at 75°C with 12.5% ​​CIRCUPOSIT containing TM Solvent expander treatment of MLB Conditioner 211 solution for 5 minutes.

[0096] 2. Each plate was then rinsed with cold water for 3 minutes.

[0097] 3. Plates are subsequently incubated at 80°C with ...

example 3

[0124] Formulations 2 to 4 of Table 1 were treated in the same manner as Example 1. The temperature of the composition was maintained at 40°C and the pH was 13 during the electroless copper deposition. Copper was deposited on the substrate for 5 minutes.

[0125] When nitrilotriacetic acid, Formulation 2 was used as an inhibitor of glyoxylate decomposition, the copper deposit was found to be orange-red, smooth and without observable miss plating. The highest deposition rate achieved was 0.21 microns / 5 minutes. The S1141 copper plated panel had an average backlight value of 4.25. After 6 hours of idling, 41% glyoxylic acid remained and no copper oxide was observed. Therefore, the electroless copper composition is stable.

[0126] When triisopropanolamine, Formulation 3 was used as an inhibitor of glyoxylate decomposition, the copper deposits were found to be red and smooth. Missing plating was not observed. The deposition rate was 0.33 microns / 5 minutes. The S1141 copper...

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Abstract

The formaldehyde-free electroless metal plating solution includes glyoxylic acid or a salt thereof in combination with a tertiary amine which stabilizes the glyoxylic acid and salt. The electroless metal plating solution is environmentally friendly, stable and deposits bright metal deposits on substrates.

Description

technical field [0001] The present invention relates to environmentally friendly, formaldehyde-free electroless metal plating compositions and methods comprising glyoxylic acid and its salts and tertiary amines. More specifically, the present invention relates to environmentally friendly, formaldehyde-free electroless metal plating compositions and methods comprising glyoxylic acid and its salts and tertiary amines that inhibit the decomposition of glyoxylic acid and its salts. Background technique [0002] Electroless metal plating compositions, such as electroless copper plating compositions, are widely used in the metallization industry to deposit copper and other metals on different types of substrates. For example, in the manufacture of printed wiring boards, electroless copper baths are used to deposit copper into vias and circuit paths as a substrate for subsequent electrolytic copper plating. Electroless copper and other electroless metal plating compositions are al...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/31C23C18/40
CPCC23C18/31C23C18/40C23C18/34C23C18/44C23C18/50C23C18/52C23C18/1893C23C18/48H05K3/187C23C30/00
Inventor W·吴C·P·L·李Z·梁
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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