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Photosensitive composition of urethanized modified phenolic resin

The technology of a phenolic resin and a composition is applied in the field of printing supplies, which can solve the problems of poor solvent resistance and printing resistance, and achieve the effects of improving printing resistance and guaranteeing aging performance.

Active Publication Date: 2020-02-21
LUCKY HUAGUANG GRAPHICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Aiming at the shortcomings of poor solvent resistance and printing resistance of heat-sensitive plates in the existing heat-sensitive plate technology, the present invention provides a photosensitive composition of urethane-modified phenolic resin, which is used for heat-sensitive CTP plates It has the advantages of good film-forming property, solvent resistance and high printing force, and the alkali solubility of the plate is not affected

Method used

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  • Photosensitive composition of urethanized modified phenolic resin
  • Photosensitive composition of urethanized modified phenolic resin
  • Photosensitive composition of urethanized modified phenolic resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Preparation of lithographic plates

[0034] ⑴ Preparation of aluminum plate base:

[0035] An aluminum plate with a thickness of 0.28mm is degreased in a 7wt% sodium hydroxide aqueous solution at a temperature of 55°C for 40 seconds. Use sine wave alternating current for electrolytic treatment, 50HZ alternating current, current 50A / dm 2 , The electrolysis time is 60 seconds, control Ra=0.3-0.6um, preferably 0.4-0.6μm, Rz(H) value is 2-3μm. Then, at a temperature of 60°C, remove slag in a 50wt% sodium hydroxide aqueous solution for 10 seconds, and then treat it in a sulfuric acid solution with a current density of 5A / d㎡ and a concentration of 20wt% at a temperature of 25°C for 40 seconds. Control oxide film=2.5~3.5g / m 2 . Finally, at 60° C., NaH2PO4-NaF solution is used for sealing treatment for 30 seconds to obtain an aluminum base suitable for a lithographic printing plate.

[0036] (2) Formulate the photosensitive composition into a heat-sensitive CTP coating sol...

Embodiment 2

[0053] Sample preparation method is the same as embodiment 1

[0054] The photosensitive composition is shown in Table 4:

[0055] Table four

[0056]

[0057] BTB-225 modified phenolic resin synthetic method in the table: synthetic method is the same as embodiment 1

Embodiment 3

[0059] Sample preparation method is the same as embodiment 1

[0060] The photosensitive composition is shown in Table 5:

[0061] Table five

[0062]

[0063] Synthesis method of BTB-25H modified phenolic resin in the table: Add 571 g of DMAC (N, N -Dimethylacetamide) and 200.0g phenolic resin BTB-25H (Weihai Tiancheng Chemical Co., Ltd.), heated and stirred at 60°C under nitrogen protection until the solid dissolved, then added 1.0g dibutyltin dilaurate, and then slowly dripped 28.4gMOI (formaldehyde Acryloyloxyethyl isocyanate) was reacted for 4 hours until the peak at 2275 of the active isocyanate group detected by infrared spectroscopy disappeared.

[0064] Add 19.2g of MI (maleimide), 48g of dried DMAC, and 1.23g of AIBN (azobisisobutyronitrile) to the above reaction solution, and react at 70°C for 23 hours to complete the reaction. The reactant was precipitated in deionized water, washed, and vacuum-dried at 40°C to obtain a copolymerized modified phenolic resin. ...

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Abstract

The present invention relates to an ammonia esterification-modified phenolic resin photosensitive composition comprising alkali-soluble resin, a dissolution inhibitor, a development accelerator, an infrared absorbing dye and a background dye, the ammonia esterification-modified phenolic resin photosensitive composition is characterized in that: the alkali-soluble resin is ammonia esterification-modified phenolic resin. The ammonia esterification-modified phenolic resin photosensitive composition has good film-forming properties, solvent resistance, printing resistance and other advantages when being used in a thermosensitive CTP.

Description

technical field [0001] The invention belongs to the technical field of printing supplies, and in particular relates to a photosensitive composition of urethane-modified phenolic resin. Background technique [0002] Since the PS plate was applied to offset printing in the 1960s, the offset printing plate making process has always used the prepress process of photosensitive film making, imposition, printing, and PS plate printing. However, the shortcomings of this plate-making method are gradually exposed. This plate-making method has a long process, large dot loss, and low printing quality, especially for environmental pollution. In order to change this situation, in the 1980s, the United States, Some Japanese companies have begun to develop computer-to-plate (CTP) technology. At present, CTP technology has developed rapidly and is in the stage of promotion and application. CTP technology is divided into photosensitive CTP plate-making technology and thermal CTP plate-making...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/09C08F290/14
Inventor 栗更新张刚宋小伟冯磊
Owner LUCKY HUAGUANG GRAPHICS