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Foam diamond skeleton reinforced aluminum-based composite material and preparation method thereof

A composite material and enhanced aluminum-based technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the difficulty of fine control of three-dimensional porous skeleton connectivity, many processing steps, and three-dimensional pores contain gaps And other issues

Active Publication Date: 2016-06-15
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional mechanical processing method is multi-dimensional processing, with many processing steps and high cost
In addition, mechanical processing is restricted by traditional mechanical processing methods and equipment, and it is difficult to finely control the internal pore size and connectivity of the three-dimensional porous framework.
Using the method of metal wire weaving, there are gaps in the three-dimensional pores, and the process is complicated.

Method used

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  • Foam diamond skeleton reinforced aluminum-based composite material and preparation method thereof
  • Foam diamond skeleton reinforced aluminum-based composite material and preparation method thereof
  • Foam diamond skeleton reinforced aluminum-based composite material and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0046] Foamed diamond skeleton reinforced aluminum matrix composite material. In this example, foamed copper with a pore size of 0.2mm is used as the substrate. The foamed diamond reinforcement accounts for 20% of the volume fraction of the composite material. Firstly, clean the foamed copper three-dimensional network substrate according to step (1). , followed by step (2) using magnetron sputtering technology to deposit a tungsten film with a thickness of 150nm on the surface of the copper foam three-dimensional network skeleton as an intermediate transition layer; Particle foam skeleton substrate; step (4) adopts hot wire CVD to deposit diamond film, deposition process parameters: hot wire distance 6mm, substrate temperature 800°C, hot wire temperature 2200°C, deposition pressure 3KPa, CH 4 / H 2 The volume flow ratio is 1:99, and the deposition time is adjusted to obtain a diamond film thickness of 60 μm, that is, the three-dimensional network skeleton of the foamed copper s...

Embodiment 2

[0048] Foamed diamond / graphene skeleton reinforced aluminum alloy composite material. In this example, nickel foam with a pore size of 0.3 mm is used as the lining. The foamed diamond reinforcement accounts for 30% of the volume fraction of the composite material. First, the foamed nickel three-dimensional network substrate Carry out cleaning, adopt the method for evaporation to deposit thickness be the chromium film of 300nm as the intermediate transition layer on the surface of nickel foam three-dimensional network framework by step (2) afterwards; Foam skeleton substrate of diamond particles; according to step (2) adopt hot wire CVD to deposit diamond film, deposition process parameters: hot wire distance 6mm, substrate temperature 900°C, hot wire temperature 2200°C, deposition pressure 3KPa, CH 4 / H 2 The volume flow ratio is 1:99, and the deposition time is controlled to obtain a diamond film thickness of 200 μm, and a three-dimensional diamond network skeleton is obtaine...

Embodiment 3

[0050] The surface has a graphene / carbon nanotube-coated foamed diamond skeleton reinforced aluminum alloy composite material. In this example, copper foam with a pore size of 2mm is used as the substrate. The foamed diamond reinforcement accounts for 70% of the volume fraction of the composite material. First, follow the steps (1) The copper foam three-dimensional network substrate is cleaned, and then a tungsten film with a thickness of 100 nm is deposited on the surface of the foam copper three-dimensional network skeleton by sputtering according to step (2) as an intermediate transition layer; according to step (3), the middle of the mesh is inlaid Foam skeleton substrate with a large number of nanocrystalline and microcrystalline diamond particles; according to step (4), directly adopt hot wire CVD to deposit diamond film, deposition process parameters: hot wire distance 6mm, substrate temperature 800°C, hot wire temperature 2300°C, deposition pressure 3KPa, CH 4 / H 2The...

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Abstract

The invention provides a foam diamond skeleton reinforced aluminum-based composite material and a preparation method thereof. The composite material is prepared from a foam substrate, a diamond reinforcing layer and a base material. The foam substrate is made of foam metal or foam ceramics or foam carbon. The base material is aluminum and aluminum alloy. The diamond reinforcing layer is made of diamond or a mixture of diamond and graphene or / and carbon nanotubes. A reinforced phase and a matrix phase of the composite material prepared through the method are kept to be continuously distributed in three-dimensional space, so that diamond and a matrix form a network interpenetrating configuration. Influences of a compound interface on thermal properties of the material are effectively weakened, good ductility and toughness of the metal matrix are not reduced, the reinforced phase can become a whole, heat conducting efficiency of a reinforced body is achieved to the largest extent, and accordingly compared with a traditional composite material, heat conductivity, electric conductivity and mechanical strength of the composite material are greatly improved. The composite material is very potential and multifunctional.

Description

technical field [0001] The invention discloses a foamed diamond skeleton reinforced aluminum matrix composite material and a preparation method thereof, belonging to the technical field of metal composite materials. Background technique [0002] With the rapid development of information technology, the integration of electronic and semiconductor devices continues to increase (for example, the Intel quad-core processor i7 integrates about 371 million transistors on a 270mm2 chip), which makes the power density of the device larger and larger. The heat rises rapidly, and the temperature rise caused by the heat not dissipating in time will seriously affect the working efficiency and service life of the device. If the thermal expansion coefficient does not match between the electronic packaging material and the semiconductor chip, the thermal stress generated during the cyclic operation of the device will easily lead to thermal fatigue failure of the device. In addition, the ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/10C22C21/00C22C26/00C23C16/27C23C16/26C23C16/513
CPCC22C1/1015C22C1/1036C22C21/00C22C26/00C23C16/26C23C16/276C23C16/513C22C2026/002C22C1/1021C22C1/1073
Inventor 魏秋平周科朝马莉余志明李志友
Owner CENT SOUTH UNIV