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Liquid phase substrate deposition metal film separation device

A metal deposition and thin film separation technology, applied in the field of magnetron sputtering, can solve problems affecting the use of metal thin films, wrinkles, metal thin film oxidation, etc., and achieve the effect of shortening the operation time and reducing the probability of thin film wrinkles

Active Publication Date: 2016-06-15
CHINA JILIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Metal thin films are widely used. Common separation methods such as Chinese Invention Patent Publication No. CN1730716A record in detail the preparation technology of new metal thin films on the surface of liquid phase substrates. However, the metal thin films are peeled off in the air for a long time, resulting in oxidation and Wrinkles directly affect the use of metal films

Method used

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  • Liquid phase substrate deposition metal film separation device
  • Liquid phase substrate deposition metal film separation device
  • Liquid phase substrate deposition metal film separation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1) Put the deposited titanium nitride thin film sample into the acetone solution in the vacuum chamber;

[0020] 2) The substrate, simethicone oil, titanium nitride film and acetone solution are kept at a constant temperature;

[0021] 3) After the dimethyl silicone oil is dissolved, the titanium nitride film falls off in the constant temperature acetone solution;

[0022] 4) Turn off the vacuum system quickly, take out the titanium nitride film and the constant temperature acetone solution, and dry the titanium nitride film for storage.

[0023] The stripping of the titanium nitride film is carried out in a short time, preferably less than 2 hours, to prevent wrinkles.

Embodiment 2

[0027] 1) Select a silicon wafer or glass of suitable size as the deposition substrate, clean the surface of the substrate with an organic solvent, and after cleaning, dry it with cold air for later use;

[0028] 2) The target material is a titanium target, the surface of the target is polished and polished with sandpaper, and it is installed at the magnetron sputtering target position;

[0029] 3) Dimethyl silicone oil is evenly coated on the surface of the substrate, and the coated sample is placed in the sputtering position, and the height of the magnetron sputtering target position is adjusted.

[0030] 4) The vacuum chamber is evacuated, and the magnetron sputtering process uses a background vacuum of 1.0-5.0×10 -4 Pa, filled with nitrogen as the reaction gas, nitrogen flow control at 30-105sccm, working vacuum 1.0-8.0×10 -1 Pa, pre-sputtering for 5 minutes, magnetron sputtering source power adjustment range 100-120W, negative bias 0V, sputtering for 10-15 minutes;

[0...

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Abstract

The invention belongs to a magnetron sputtering technology, and particularly relates to a liquid phase substrate deposition metal film separation device.The liquid phase substrate deposition metal film separation device is characterized in that a head cover can conveniently open and seal an opening, a base seals the bottom of a drum, a partition plate with holes is fixed at the middle position of the drum, the middle of the partition plate with the holes is coated with a dimethyl silicone oil thin layer, and the metal film is deposited on the upper portion of the dimethyl silicone oil thin layer.The liquid phase substrate deposition metal film separation device has the advantages that the metal film formed after the magnetron sputtering process can be obtained in a vacuum environment and cannot be oxidized; by means of a constant temperature environment, the action of internal stress of silicon oil on the metal film is reduced, and corrugation of the metal film cannot occur.

Description

technical field [0001] The invention belongs to the magnetron sputtering technology, in particular to a liquid-phase substrate deposition metal film separation device. Background technique [0002] Magnetron sputtering deposition uses sufficiently high-energy particles to bombard the surface of the target, so that the atoms in the target obtain high enough energy, and the high-energy particles emitted on the surface move under the action of the magnetic field and finally deposit on the surface of the substrate to form metal film. Magnetron sputtering has become a mature industrial coating technology. Due to its outstanding advantages, it is widely used in the field of metal surface modification. [0003] Metal thin films are widely used. Common separation methods such as Chinese Invention Patent Publication No. CN1730716A record in detail the preparation technology of new metal thin films on the surface of liquid phase substrates. However, the metal thin films are peeled of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/58
CPCC23C14/0005C23C14/001C23C14/35
Inventor 乔宪武
Owner CHINA JILIANG UNIV
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