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Overhead heightening device skeleton filling type reinforcing method

A filling and skeleton technology, applied in the field of skeleton filling reinforcement of overhead devices, can solve the problems of difficult reinforcement of devices and damage to pipe legs, and achieve the effect of reducing reinforcement weight, strong plasticity, and inhibiting glue flowing and contaminating printed boards.

Inactive Publication Date: 2016-06-29
AVIC NO 631 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem in the background technology that the overhead devices are not easy to be reinforced and are easily damaged by external forces, the invention provides a skeleton-filling reinforcement for the skeleton of the overhead device method

Method used

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  • Overhead heightening device skeleton filling type reinforcing method
  • Overhead heightening device skeleton filling type reinforcing method
  • Overhead heightening device skeleton filling type reinforcing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] see figure 1 , is a schematic diagram of the adhesive reinforcement process for a small overhead device, and the specific reinforcement process is:

[0056] 1. Fill and reinforce the space of the device according to the needs of the skeleton, such as figure 1 a, for measurement, choose 20 times the expansion ratio, and the density is 50KG / m 3 , 6mm thick polyethylene foam, cut out a 6mm high, 4mm wide, and 5mm long filler skeleton that fits the space at the bottom of the capacitor.

[0057] 2. Clamp and compress the foam skeleton with tweezers, and fill the space when it is sent into the device, such as figure 1 b, Confirm that the tailored foam skeleton fills the space at the bottom of the device.

[0058] 3. After filling the space to be filled, select acrylic electronic glue with a viscosity of 1700cps, and use a glue injector to infiltrate the foaming skeleton, such as figure 1 c.

[0059] 4. After soaking, let it stand at room temperature for 12 hours until th...

Embodiment 2

[0061] see figure 2 , is a schematic diagram of the process of bonding and strengthening the memory stick and the ETX module with a foam skeleton. The specific strengthening process is:

[0062] 1. In the CPU assembly of a computer, the memory stick and ETX need to be inserted into the card slot for assembly, and the memory stick is fastened on the computer motherboard by means of a spring; the spring is loose and other unreliable factors in the complex mechanical application environment. At present, there is no solution For such problems, it is generally used to directly bond the memory stick to the motherboard or the circlip with a relatively viscous electronic glue, such as figure 2 a; After this method is directly bonded, the electronic glue will pollute the printed board assembly when bonding, and because the direct bonding uses a more rigid glue, the stress release is large, and the maintenance performance is reduced, which cannot meet the needs of product development....

Embodiment 3

[0067] see image 3 , is a schematic diagram of the structure of a transformer coil filled with a foam skeleton, and the specific reinforcement process is as follows:

[0068] 1. The transformer coil of a certain type of product is a hollow structure, such as image 3 a. To avoid damage to the coil caused by the harsh mechanical environment during the use of the coil, it is generally reinforced by embedding with potting glue. This embedding method is not good for the heat dissipation of the coil, and it is easy to cause the coil to overheat and burn, and the coil has lost maintainability.

[0069] 2. Use the method of foaming skeleton filling, according to the inner diameter of the coil, choose 10 times the foaming multiple, and the density is 100KG / m 3 , Polyethylene foam with a thickness of 6mm, cut out a cylinder with a diameter of 4mm and a height of 6mm. The bottom is filled with the same diameter as the outer diameter of the coil with a 4mm thick foam skeleton.

[00...

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Abstract

An overhead heightening device skeleton filling type reinforcing method is as follows: 1) a space of a device needing skeleton filling reinforcement is measured; 2) an opening foaming skeleton with foaming expansion of 10-30 times and density of 33-100KG / m<3> is selected as a filling material for the space determined in the step 1), and the opening foaming skeleton is cut; 3) the cut opening foaming skeleton is sent into the space of the device needing skeleton filling reinforcement; 4) acrylic-acid-component-containing thermosetting electronic glue with the viscosity of 1500-3000cps is selected, and the selected thermosetting electronic glue is injected into the opening foaming skeleton in the space of the device needing skeleton filling reinforcement; and 5) after the thermosetting electronic glue is cured, the reinforcement is completed. The open space is filled with the foaming skeleton, the reinforcement glue is injected into the foaming skeleton, after the reinforcement glue is cured, the reinforcement glue exhibits reinforcing properties, difficult reinforcement problem of overhead heightening devices can be solved, the reinforcement glue molding method is improved, colloidal internal stress is dispersed by the foaming skeleton, and the cracking risk of the colloid can be reduced.

Description

technical field [0001] The invention belongs to the field of instrument assembly, and relates to a skeleton filling reinforcement method, in particular to a skeleton filling reinforcement method for overhead devices. Background technique [0002] When computers are used in complex and harsh environments, they often encounter harsh mechanical environments, such as shock, vibration, drop, swing, vibration, stress and noise. Especially when the computer is subjected to vibration, it is easy to cause damage to components. The impact of vibration on printed circuit boards is mainly the reciprocating deformation of the circuit board. The greater the reciprocating deformation of the printed circuit board subjected to vibration, the greater the bending stress of the components. When the stress reaches a certain value, it will cause the pins of the original component to break, the solder joints to fall off, the pads to peel off, etc., causing failures to the equipment. [0003] If a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/52
Inventor 刘鑫曲亮何燕春石红崔景新喻少英
Owner AVIC NO 631 RES INST
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