GeSn-GeSi material based heterogeneous phototransistor and fabrication method thereof

A technology of phototransistor and manufacturing method, applied in the field of optoelectronics, can solve the problems of low light sensitivity and photocurrent, low light absorption coefficient, bias voltage, etc., and achieve high light absorption efficiency, high absorption coefficient, high detection photocurrent and light sensitivity. Effect

Inactive Publication Date: 2016-07-20
XIDIAN UNIV
View PDF4 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The GeSnp-i-n type photodetector has solved its difficulty in silicon photodetector compared with the near-mid-infrared devices of III-V materials produced by the prior art due to the adoption of a new material of group IV GeSn with a narrower band gap and a higher light absorption coefficient. Based on the difficulty of integration, it can be compatible with the metal complementary oxide semiconductor CMOS (ComplementaryMetalOxideSemiconductor) standard process; at the same time, compared with the shortcomings of the narrow detection range and low light absorption coefficient of Ge detectors used today, GeSn photodetectors It has the advantages of wider detection wavelength and higher light absorption efficiency, but the GeSnp-i-n photodetector has the disadvantages of low light sensitivity and photocurrent
However, the disadvantages of this GeSn avalanche diode photodetector are that due to the fact that the noise is amplified and the additional noise generated during the multiplication process seriously interferes with the optical signal, and the bias voltage required for multiplication is extremely high. GeSn avalanche diode-type photodetectors are severely limited in practical applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • GeSn-GeSi material based heterogeneous phototransistor and fabrication method thereof
  • GeSn-GeSi material based heterogeneous phototransistor and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1: making Ge 0.935 sn 0.065 -Genpn heterogeneous phototransistor and its fabrication method.

[0045] Step 1: Prepare a Ge layer.

[0046] Using low-temperature solid-source molecular beam epitaxy, on an undoped (100) Ge substrate 1, at a temperature of 150° C., epitaxially grow an undoped pure Ge layer with a thickness of 800 nm, such as figure 2 (a).

[0047] Step 2: Phosphorus ion implantation.

[0048] At an energy of 50KeV and an implant dose of 10 15 cm -2 , The implanted ions are P(31) under the condition that the substrate is tilted at an angle of 7° + Phosphorus ion implantation process to form GeN + Type collector area 2.

[0049] Step 3: Prepare GeSn light absorption region.

[0050] Using low-temperature solid-source molecular beam epitaxy, the GeN + Intrinsic Ge with a thickness of 100nm was epitaxially grown on the collector region at 150°C with high-purity Ge and Sn sources 0.935 sn 0.065 The epitaxial layer serves as the GeSn ligh...

Embodiment 2

[0070] Embodiment 2: making Ge 0.97 sn 0.03 -Ge 0.9 Si 0.1 An npn heterogeneous phototransistor and a fabrication method thereof.

[0071] Step 1: Prepare GeSi.

[0072] Using the low-temperature solid-source molecular beam epitaxy process, epitaxially grow undoped Ge with a thickness of 800 nm on the undoped (100) Si substrate 1 at a temperature of 150 ° C. 0.9 Si 0.1 layer.

[0073] Step 2: Phosphorus ion implantation.

[0074] At an energy of 50KeV and an implant dose of 10 15 cm -2 , The implanted ions are P(31) under the condition that the substrate is tilted at an angle of 7° + Phosphorus ion implantation process to form GeSiN + type collector area 2, such as figure 2 (a).

[0075] Step 3: preparing a GeSn light absorption region.

[0076] Using low-temperature solid-source molecular beam epitaxy, the GeSiN + Intrinsic Ge with a thickness of 100nm was epitaxially grown on the collector region at 150°C with high-purity Ge and Sn sources 0.97 sn 0.03 The e...

Embodiment 3

[0096] Embodiment 3: making Ge0.9 sn 0.1 -Ge 0.6 Si 0.4 A pnp heterogeneous phototransistor and a fabrication method thereof.

[0097] Step A: preparing a GeSi layer.

[0098] Using the low-temperature solid-source molecular beam epitaxy process, epitaxially grow undoped Ge with a thickness of 800 nm on the undoped (100) Si substrate 1 at a temperature of 150 ° C. 0.6 Si 0.4 layer, such as figure 2 (a).

[0099] Step B: boron ion implantation.

[0100] At an energy of 50KeV and an implant dose of 10 15 cm -2 , The implanted ions are BF under the condition that the substrate is tilted at an angle of 7° 2 + boron ion implantation process to form GeSiP + Type collector area 2.

[0101] Step C: preparing a GeSn light absorption region.

[0102] Using low temperature solid source molecular beam epitaxy, in GeSiP + Intrinsic Ge with a thickness of 100nm was epitaxially grown on the collector region at 150°C with high-purity Ge and Sn sources 0.9 sn 0.1 The epitaxial...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a GeSn-GeSi material based heterogeneous phototransistor and a fabrication method thereof. A collector and an emitter of the transistor both adopt a GeSi material, a light absorption region and a base region both adopt a GeSn material, an emitter region, the base region, the light absorption region and a collector region are sequentially and vertically arranged, and a passivation layer encircles the peripheries of the emitter region, the base region, the light absorption region and the collector region. According to the fabrication method of the transistor, the GeSn material is grown by a low-temperature solid-source molecular beam epitaxial process, and the fabrication method is a standard complementary metal oxide semiconductor (CMOS) fabrication method. The GeSn material with a high light absorption coefficient forms heterojunctions in the light absorption region, the GeSi emitter region and the collector region, the light sensitivity and light current during detection of an infrared light signal by the transistor are improved, and the GeSn-GeSi material based heterogeneous phototransistor has high light absorption rate.

Description

technical field [0001] The invention belongs to the field of optoelectronic technology, and further relates to a GeSn-GeSi material-based heterogeneous phototransistor and a manufacturing method thereof in the field of semiconductor infrared detection. The invention can detect near-middle-infrared light signals in the field of photoelectric near-middle-infrared detection. Background technique [0002] With the rapid development of integrated circuit technology and continuous advancement of technology, rapid processing and transmission of large-scale information data has become a bottleneck in the development of large-scale electronic devices today, and the effective integration of microelectronics technology and optoelectronics technology has become an effective way to solve this problem. [0003] Authors such as MOehme disclosed a GeSnp-i-n photodetector in their paper "GeSn-on-Sinormalincidence photodetectors with bandwidths more than 40GHz" (Opticsexpress, vol.22, pp.839-...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/028H01L31/0288H01L31/11H01L31/18
CPCH01L31/028H01L31/0288H01L31/1105H01L31/1812Y02P70/50
Inventor 韩根全王轶博张春福汪银花张进成郝跃
Owner XIDIAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap