Aluminum alloy plate for molding

A technology of aluminum alloy plate and compound, which is applied in the field of Al-Mg-Si aluminum alloy plate for forming, can solve the problems of lower BH property and difficulty in improving yield strength, and achieve the effect of improving BH property

Inactive Publication Date: 2016-08-03
KOBE STEEL LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0008] In addition, there is also a problem that when the room temperature aging is large, the BH property is lowered, and the yield strength is difficult to increase due to heating during relatively low-temperature artificial aging (hardening) treatment such as coating and baking treatment of the formed panel. to the strength required as a panel

Method used

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  • Aluminum alloy plate for molding
  • Aluminum alloy plate for molding

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Experimental program
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Embodiment

[0091] Next, examples of the present invention will be described. 6000-series aluminum alloy plates having different solid-solution amounts of Sn were produced separately according to the above-mentioned intermediate annealing conditions, and the solid-solution amounts of Sn specified in the present invention were investigated. Furthermore, the BH property (coating bake hardenability) and hemming workability of this board after maintaining it at room temperature for 100 days were also evaluated. The results are shown in Table 2.

[0092] The specific production conditions of these aluminum alloy plates are as follows. Aluminum alloy ingots having the respective compositions shown in Table 1 were melted together by the DC casting method. At this time, the average cooling rate at the time of casting was common to each example, and the liquidus temperature to the solidus temperature was 50° C. / min. It should be noted that, in the display of the content of each element in Table...

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Abstract

The present invention relates to an Al-Mg-Si-based aluminum alloy plate for molding which contains, in mass%, Mg 0.3-1.3%, Si 0.5-1.5% and Sn 0.005-0.2%, the remainder being Al and unavoidable impurities, wherein when the Sn content in the residue compound separated by a hot phenol residue extraction method and having a particle size exceeding 0.1 mu m is subtracted from the Sn content in the aluminum alloy plate, the resulting difference is a 0.005 mass% or greater quantity of Sn. The aluminum alloy plate for molding combines moldability and BH properties after long-term aging at room temperature.

Description

technical field [0001] The present invention relates to an Al-Mg-Si based aluminum alloy plate for forming. The aluminum alloy sheet referred to in the present invention is a rolled sheet such as a hot-rolled sheet or a cold-rolled sheet, and refers to an aluminum alloy sheet that has been subjected to quenching and tempering such as solution treatment and quenching treatment, and before baking, coating and hardening treatment. alloy plate. In addition, in the following description, aluminum is also called Alumi or Al. Background technique [0002] In recent years, social demands for weight reduction of vehicles such as automobiles have been increasing from the viewpoint of the global environment and the like. In order to meet this requirement, as a material for automotive panels, especially large body panels (outer panels, inner panels) such as hoods, doors, and roofs, in addition to steel materials such as steel sheets, formability and bake coating hardenability The use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22C21/06C22F1/00C22F1/05
CPCC22C21/02C22C21/08C22F1/043C22F1/05
Inventor 有贺康博宍户久郎松本克史
Owner KOBE STEEL LTD
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