Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate

Abstract

The invention discloses a method for manufacturing a heat-pipe-parallel-structure-like vapor plate by using stepped foamy copper as wicks. The vapor plate is characterized in that an upper copper covering plate, a lower copper covering plate and a stepped or flat foamy copper are sintered, a heat-pipe-structure-like vapor chambers are formed according a geometrical shape, and a liquid phase working medium is injected to the heat-pipe-structure-like vapor chambers; foamy copper steps are rectangle-shaped or trapezoid-shaped, and the foamy copper steps and the flat or stepped foamy copper are sintered on the upper copper covering plate and the lower copper covering plate according to a geometrical structure; a boss portion of the stepped foamy copper has a support effect; after the upper copper covering plate and the lower copper covering plate are combined through copper silver brazing or diffusion welding, vacuum pumping and liquid phase working medium injection are performed. The stepped foamy copper has high porosity and a good capillary character, the vapor chambers mutually communicates, rapid and high-efficient liquid-vapor conversion and gas phase rapid diffusion of in the liquid phase working medium in the vapor end can be ensured, and rapid backflow resistance of a condensation end can be reduced after the liquid-vapor conversion. The manufactured heat-pipe-parallel-structure-like vapor plate can meet the demands of semiconductor electronic devices for rapid and high-efficient heat conduction and heat dissipation.

Description

technical field [0001] The invention relates to a manufacturing method of a heat transfer device for rapid heat conduction and heat dissipation, in particular to a heat pipe-like parallel structure heat soaker formed by rectangular or trapezoidal stepped copper foam according to the structural design requirements. The manufacturing method belongs to the category of electronic devices. Background technique [0002] With the continuous development of communication information and equipment, people's requirements for electronic integrated systems and products are getting higher and higher, mainly in the aspects of thinness, lightness, smallness, high efficiency, and beauty. However, with the improvement of electronic integrated systems and functions, and the limited space size, the power and heat of chips and systems will increase significantly. For example, the CPU or GPU heat generation of some computers has exceeded 100W / cm 2 , Then the heat dissipation rate of the product...

AI Technical Summary

Problems solved by technology

The key to determining the thermal performance of the vapor chamber is its internal structure, that is, the material and structure of the liquid-absorbing core. The current wire mesh weaving structure has poor capillary properties, and the porosity of the copper powder sintered structure is only 38-45%, which causes thermal cycles during application. The thermal reflow resistance is relatively large

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