A fine grinding superhard grinding wheel for micro-drilling and preparation method thereof
A fine grinding and micro-drilling technology, which is applied in the direction of bonded grinding wheels, grinding/polishing equipment, abrasives, etc., can solve the problems of low bonding force between the abrasive layer and the substrate, inability to fine-grind the drill tip of micro-drilling, and low toughness of the grinding wheel. , to achieve the effect of reducing the frequency of trimming, increasing the yield and improving the quality
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Embodiment 1
[0034] Such as figure 1 As shown, the fine grinding superhard grinding wheel for micro-drilling of the present embodiment comprises a substrate 2 and an abrasive layer 1, the substrate is aluminum, and the abrasive layer is made up of components of the following weight: 30.15g polyamide PA1012, 30.15g polyimide, The polyimide uses thermosetting polyimide resin powder as shown in Table 1, 44g of diamond with a particle size of M4 / 8, 80g of silicon carbide with a particle size of M1 / 2, and 6g of polytetrafluoroethylene with a particle size of ≤10 μm (PTFE), 56g of cerium oxide with particle size ≤10μm.
[0035] The preparation method of the fine grinding superhard emery wheel for above-mentioned micro-drilling comprises the following steps:
[0036] 1) Weigh the binder thermoplastic polyamide resin powder PA1012 and thermosetting polyimide resin powder, abrasive diamond powder, silicon carbide powder, and cerium oxide powder according to the above weight; mix the weighed raw ma...
Embodiment 2
[0042] Such as figure 2 As shown, the microdrilling of the present embodiment includes a substrate 4 and an abrasive layer 3 for fine grinding superhard grinding wheel, the substrate is aluminum, and the abrasive layer is made up of components of the following weight: 29.3g polyamide PA1012, 58.6g polyimide, The polyimide uses thermosetting polyimide resin powder as shown in Table 1, 88g of diamond with a particle size of M2 / 4, 51.2g of silicon carbide with a particle size of M0 / 1, and 4.8g of diamond with a particle size of ≤10 μm. Polytetrafluoroethylene (PTFE), 44.8g of cerium oxide with particle size ≤10μm.
[0043] The preparation method of the fine grinding superhard emery wheel for above-mentioned micro-drilling comprises the following steps:
[0044] 1) Take the binder thermoplastic polyamide resin powder PA1012 and thermosetting polyimide resin powder, abrasive diamond powder, silicon carbide powder, and cerium oxide powder according to the above weight; mix the wei...
Embodiment 3
[0050] The fine grinding superhard grinding wheel for micro-drilling of the present embodiment comprises a substrate and an abrasive layer, the substrate is aluminum, and the abrasive layer is made up of the following components by weight: 15.2g polyamide PA1012, 45.6g polyimide, the polyimide Adopt the thermosetting polyimide resin powder as shown in table 1, the diamond that 66g particle size is M1 / 2, the silicon carbide that 67.2g particle size is M0 / 1, the polytetrafluoroethylene (PTFE) of 4.8g particle diameter≤10 μm, 33.6 g of cerium oxide with a particle size of ≤10 μm.
[0051] The preparation method of the fine grinding superhard emery wheel for above-mentioned micro-drilling comprises the following steps:
[0052] 1) Weigh the binder thermoplastic polyamide resin powder PA1012 and thermosetting polyimide resin powder, abrasive diamond powder, silicon carbide powder, and cerium oxide powder according to the above weight; mix the weighed raw materials, stir them evenly...
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