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Adhesive-agent composition and adhesive film using the same

A technology of adhesives and compositions, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of inability to achieve peelability, achieve excellent peelability, reduce pollution, stick The effect of low combined force

Inactive Publication Date: 2016-08-24
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has not been possible to realize an adhesive that does not cause loosening or peeling, has good peelability, and does not increase the adhesive force when the adhesive is placed in a high-temperature environment such as heat treatment, and an adhesive having such characteristics is expected. adhesive composition

Method used

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  • Adhesive-agent composition and adhesive film using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069]

[0070] The acrylic copolymer resin ( The mass average molecular weight is 200,000, and the glass transition temperature is 6°C). 100 parts by mass of ethyl acetate solution (35% by mass of solid content) of this acrylic copolymer resin, 2.4 parts by mass of isocyanate (trade name: CORONET L, manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent, and 2.4 parts by mass as a photocurable resin 7 parts by mass of 10-functional urethane acrylate (trade name: U-10PPA, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 0.21 parts by mass of photoinitiator (trade name: Irgcure819, manufactured by BASF Corporation) were dissolved in toluene and methyl ethyl ketone In a mixed solvent (trade name: KT-11, mass ratio 1:1, manufactured by DICGRAPHICS Co., Ltd.), stir with a disperser at a rotation speed of 500 rpm for 30 minutes so that the solid content reaches 25%, and then leave it at room temperature until there are no bubbles. , thus obtaining an adhesi...

Embodiment 2

[0074] The pressure-sensitive adhesive sheet 2 was obtained in the same manner as in Example 1 except that 7 parts by mass of bifunctional urethane acrylate (trade name: BEAM SET502H, manufactured by Arakawa Chemical Co., Ltd.) was further added as a photocurable resin.

Embodiment 3

[0076] Instead of the acrylic copolymer resin used in Example 1, an acrylic copolymer resin (trade name: Teisan Resin SG-700AS, manufactured by Nagase ChemteX Co., Ltd.) obtained by copolymerizing acrylonitrile and (meth)acrylate was used, except Otherwise, it carried out similarly to Example 1, and obtained the adhesive sheet 3.

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Abstract

[Problem] To provide an adhesive-agent composition which can be easily restuck, in which floating or peeling do not occur after bonding to the body for adhesion, and which has superior peel properties without a variation in adhesive power even when left in a high temperature environment, and thus is able to reduce contamination of the body for adhesion caused by adhesive deposit, etc. [Solution] An adhesive-agent composition containing an alkali resin, a cross-linking agent for cross-linking the alkali resin, a photocurable resin, and a photocuring agent for curing the photocurable resin.

Description

technical field [0001] The present invention relates to an adhesive composition, and more specifically, the present invention relates to an adhesive composition and an adhesive film using the adhesive composition: it can be easily reattached without producing Loose, floating, peeling off, even if it is peeled off after being placed in a high temperature environment, there will be no adhesive residue. Background technique [0002] Electronic boards and wiring boards used in various electronic devices are manufactured through various processes such as mounting electronic components on the board, making lead frames, soldering, and heating. In these processes, a peelable protective film is attached to the surface of the substrate in advance and the protective film is peeled off after the operation to protect the mounted electrical components, or to prevent paint or solder from forming during lead frame processing or soldering. will attach to a location other than the one expect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/00B05D3/06B05D7/24B32B27/00B32B27/16B32B27/30C09J4/02C09J7/02C09J11/06
CPCB32B7/06B32B7/12B32B27/16B32B27/308B32B2307/718B32B2307/748B32B2405/00B32B2457/00C08G18/6229C08G18/8029C08L75/16C09J133/066C09J175/16C09J7/385C09J2301/416C08F220/14C08F220/1808C08F220/20C08F220/06C09J2301/40
Inventor 村上由夏谷口贵久
Owner DAI NIPPON PRINTING CO LTD