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Selective plasma melting rapid prototyping equipment and rapid prototyping method

A molding equipment, plasma technology, applied in the field of ion melting rapid prototyping equipment and rapid prototyping, can solve the problems of complex structure, low power, small laser spot diameter, etc.

Active Publication Date: 2016-09-07
中研碧诚(北京)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This makes the structure of the selective laser melting rapid prototyping equipment complex, and the size of the molded parts is limited
[0007] Second, the laser spot diameter is small, the power is low, and the efficiency of forming large parts is low
Lasers are expensive and expensive to maintain
This makes the equipment cost of selective laser melting rapid prototyping technology very high

Method used

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  • Selective plasma melting rapid prototyping equipment and rapid prototyping method
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  • Selective plasma melting rapid prototyping equipment and rapid prototyping method

Examples

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Embodiment 2

[0196] In this example, if Figure 7 As shown, the difference between the selected area plasma melting rapid prototyping equipment used and the embodiment 1 is that the angle between the nozzle 13-5 and the central axis of the gun body 13-1 is 30°-45°.

[0197] In this way, after changing the direction of the plasma beam through the nozzle 13-5, the thermal load impact of the plasma jet on the anode nozzle 13-2 can be effectively reduced, and the anode ablation condition is improved.

[0198] In this embodiment, the structure, connection relationship and working principle of the rest of the selected area plasma melting rapid prototyping equipment are the same as those in Embodiment 1.

[0199] In this embodiment, the selected area plasma melting rapid prototyping method adopted is the same as that in Embodiment 1.

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Abstract

The invention discloses selective plasma melting rapid prototyping equipment and a rapid prototyping method. The equipment comprises a monitoring system, a plasma beam processing system, a level printing table and a powder sending and spreading device. The plasma beam processing system includes a plurality of plasma beam processing devices; each plasma beam processing device is composed of a plasma generator, a printing position adjusting device and a gas supply device; the monitoring system includes a plurality of plasma beam processing monitoring devices; each plasma beam processing monitoring device includes a temperature detection unit, a horizontal movement controller, a distance detecting unit and a printing distance adjusting controller. The method comprises the following steps: 1, acquisition of a 3D model of a workpiece to be molded, and hierarchical slicing processing; 2, scanning path filling; 3, printing path acquisition; and 4, printing layer by layer from top to bottom. The invention has the advantages of reasonable design, simple operation, high molding efficiency, good usage effect, no need of protective atmosphere or the vacuum environment, and direct operation in atmosphere environment.

Description

technical field [0001] The invention belongs to the technical field of rapid prototyping, and in particular relates to a selective area plasma melting rapid prototyping equipment and a rapid prototyping method. Background technique [0002] At present, the rapid prototyping technology of metal parts at home and abroad includes the selective laser melting rapid prototyping technology (Selective laser melting, SLM). For example, the U.S. patent "PROCESS AND DEVICE FOR PRODUCTING A SHAPED BODY BY SELECTIVE LASERMELTING" with the patent number US7047098 describes in detail a selective laser melting forming method and equipment for manufacturing dense parts using a three-dimensional digital model. The Chinese invention patent with the publication number CN1603031A "A Method and Device for Selective Laser Melting Rapid Prototyping of Metal Parts" discloses a method and device for selective laser melting rapid prototyping of metal parts. The device includes semiconductor pumped YA...

Claims

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Application Information

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IPC IPC(8): B29C67/00B22F3/105B28B1/00B33Y10/00B33Y30/00
CPCB28B1/001B22F10/00B22F12/55B22F12/46B22F12/45B22F12/90B22F10/28B22F12/70B22F10/322B22F12/50B22F12/33B22F10/73Y02P10/25
Inventor 华云峰
Owner 中研碧诚(北京)科技有限公司
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