High-impregnation-resistance enamelled wire and making process thereof
A preparation process and dipping varnish technology, applied in the field of high resistance dipping enameled wire varnish and its preparation process, can solve the problems of human injury, electric leakage, easy to be corroded, etc., and achieve extended service life, simple production process and good dipping resistance. Effect
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Embodiment 1
[0016] The proportion of ingredients used is: 10 parts of bisphenol A epoxy resin, 12 parts of polyamide resin, 7 parts of butyl rubber, 1 part of isocyanate, 20 parts of hydroxyl resin, 7 parts of polytetrafluoroethylene, and 3 parts of reactive diluent , 10 parts of ultrafine zinc oxide, 12 parts of nano-scale silicon powder, 3 parts of white carbon black, 10 parts of polyacrylate, 2 parts of titanium dioxide, 5 parts of molybdenum titanium powder, 3 parts of dimethylethanolamine and 10 parts of polyimide share.
[0017] In this embodiment, the epoxy content of bisphenol A epoxy resin is 300g / Eq.
[0018] The preparation process of the present embodiment comprises the following steps:
[0019] A. Put ultra-fine zinc oxide, nano-scale silicon powder, white carbon black, titanium dioxide, and molybdenum-titanium powder into a stirring container in sequence, and keep stirring at a stirring rate of 1000 rpm for 10 minutes to obtain a mixture ;
[0020] B. Add bisphenol A type...
Embodiment 2
[0024] The proportion of ingredients used is: 12 parts of bisphenol A epoxy resin, 13 parts of polyamide resin, 8 parts of butyl rubber, 2 parts of isocyanate, 21 parts of hydroxyl resin, 8 parts of polytetrafluoroethylene, and 4 parts of reactive diluent , 11 parts of ultrafine zinc oxide, 13 parts of nano-scale silicon powder, 4 parts of white carbon black, 11 parts of polyacrylate, 3 parts of titanium dioxide, 6 parts of molybdenum titanium powder, 4 parts of dimethylethanolamine and 11 parts of polyimide share.
[0025] In this embodiment, the epoxy content of bisphenol A epoxy resin is 320g / Eq.
[0026] The preparation process of the present embodiment comprises the following steps:
[0027] A. Put ultra-fine zinc oxide, nano-scale silicon powder, white carbon black, titanium dioxide, and molybdenum-titanium powder into a stirring container in sequence, and keep stirring at a stirring rate of 1200 rpm for 11 minutes to obtain a mixture ;
[0028] B. Add bisphenol A typ...
Embodiment 3
[0032] The proportion of ingredients used is: 14 parts of bisphenol A epoxy resin, 14 parts of polyamide resin, 9 parts of butyl rubber, 3 parts of isocyanate, 23 parts of hydroxyl resin, 9 parts of polytetrafluoroethylene, 4 parts of reactive diluent , 12 parts of ultrafine zinc oxide, 15 parts of nano-scale silicon powder, 5 parts of white carbon black, 12 parts of polyacrylate, 4 parts of titanium dioxide, 8 parts of molybdenum titanium powder, 4 parts of dimethylethanolamine and 14 parts of polyimide share.
[0033] In this embodiment, the epoxy content of the bisphenol A epoxy resin is 340 g / Eq.
[0034] The preparation process of this embodiment comprises the following steps:
[0035] A. Put ultra-fine zinc oxide, nano-scale silicon powder, white carbon black, titanium dioxide, and molybdenum-titanium powder into a stirring container in sequence, and keep stirring at a stirring rate of 1400 rpm for 14 minutes to obtain a mixture ;
[0036] B. Add bisphenol A type epox...
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