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High-impregnation-resistance enamelled wire and making process thereof

A preparation process and dipping varnish technology, applied in the field of high resistance dipping enameled wire varnish and its preparation process, can solve the problems of human injury, electric leakage, easy to be corroded, etc., and achieve extended service life, simple production process and good dipping resistance. Effect

Inactive Publication Date: 2016-09-07
HENAN BOYE ELECTRIC MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of industry, the fields of electronics, electrical appliances, and electrical engineering have developed rapidly. Almost all kinds of equipment, instruments, and meters related to electricity are inseparable from enameled wires, so enameled wire enamel is an irreplaceable industrial raw material. When the enameled wire paint is used in harsh environments, it is easy to be corroded and impregnated, damaging the internal cables, causing short circuits, leakage, etc., which are likely to cause harm to the human body and cause irreparable losses

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The proportion of ingredients used is: 10 parts of bisphenol A epoxy resin, 12 parts of polyamide resin, 7 parts of butyl rubber, 1 part of isocyanate, 20 parts of hydroxyl resin, 7 parts of polytetrafluoroethylene, and 3 parts of reactive diluent , 10 parts of ultrafine zinc oxide, 12 parts of nano-scale silicon powder, 3 parts of white carbon black, 10 parts of polyacrylate, 2 parts of titanium dioxide, 5 parts of molybdenum titanium powder, 3 parts of dimethylethanolamine and 10 parts of polyimide share.

[0017] In this embodiment, the epoxy content of bisphenol A epoxy resin is 300g / Eq.

[0018] The preparation process of the present embodiment comprises the following steps:

[0019] A. Put ultra-fine zinc oxide, nano-scale silicon powder, white carbon black, titanium dioxide, and molybdenum-titanium powder into a stirring container in sequence, and keep stirring at a stirring rate of 1000 rpm for 10 minutes to obtain a mixture ;

[0020] B. Add bisphenol A type...

Embodiment 2

[0024] The proportion of ingredients used is: 12 parts of bisphenol A epoxy resin, 13 parts of polyamide resin, 8 parts of butyl rubber, 2 parts of isocyanate, 21 parts of hydroxyl resin, 8 parts of polytetrafluoroethylene, and 4 parts of reactive diluent , 11 parts of ultrafine zinc oxide, 13 parts of nano-scale silicon powder, 4 parts of white carbon black, 11 parts of polyacrylate, 3 parts of titanium dioxide, 6 parts of molybdenum titanium powder, 4 parts of dimethylethanolamine and 11 parts of polyimide share.

[0025] In this embodiment, the epoxy content of bisphenol A epoxy resin is 320g / Eq.

[0026] The preparation process of the present embodiment comprises the following steps:

[0027] A. Put ultra-fine zinc oxide, nano-scale silicon powder, white carbon black, titanium dioxide, and molybdenum-titanium powder into a stirring container in sequence, and keep stirring at a stirring rate of 1200 rpm for 11 minutes to obtain a mixture ;

[0028] B. Add bisphenol A typ...

Embodiment 3

[0032] The proportion of ingredients used is: 14 parts of bisphenol A epoxy resin, 14 parts of polyamide resin, 9 parts of butyl rubber, 3 parts of isocyanate, 23 parts of hydroxyl resin, 9 parts of polytetrafluoroethylene, 4 parts of reactive diluent , 12 parts of ultrafine zinc oxide, 15 parts of nano-scale silicon powder, 5 parts of white carbon black, 12 parts of polyacrylate, 4 parts of titanium dioxide, 8 parts of molybdenum titanium powder, 4 parts of dimethylethanolamine and 14 parts of polyimide share.

[0033] In this embodiment, the epoxy content of the bisphenol A epoxy resin is 340 g / Eq.

[0034] The preparation process of this embodiment comprises the following steps:

[0035] A. Put ultra-fine zinc oxide, nano-scale silicon powder, white carbon black, titanium dioxide, and molybdenum-titanium powder into a stirring container in sequence, and keep stirring at a stirring rate of 1400 rpm for 14 minutes to obtain a mixture ;

[0036] B. Add bisphenol A type epox...

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PUM

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Abstract

The invention discloses a high-impregnation-resistance enamelled wire and a making process thereof. The high-impregnation-resistance enamelled wire mainly comprises, by mass, 10-20 parts of bisphenol-A epoxy resin, 12-17 parts of polyamide resin, 7-12 parts of butyl rubber, 1-5 parts of isocyanate, 20-25 parts of hydroxyl resin, 7-12 parts of polytetrafluoroethylene, 3-8 parts of a reactive diluent, 10-15 parts of superfine zinc oxide, 12-17 parts of nanoscale silicon micro powder, 3-6 parts of white carbon black, 10-15 parts of polyacrylate, 2-7 parts of titanium dioxide, 5-12 parts of molybdenum titanium powder, 3-6 parts of dimethylethanolamine and 10-20 parts of polyimide. The making process is simple, environment-friendly and pollution-free, the enamelled wire made by the process is high in impregnation resistance, is resistant to corrosion, high temperature and impact and capable of adapting to severe environment and protecting a cable inside the enamelled wire, and service life of the enamelled wire is prolonged.

Description

technical field [0001] The invention relates to the technical field of wire enamel preparation, in particular to a wire enamel with high impregnation resistance and a preparation process thereof. Background technique [0002] With the rapid development of industry, the fields of electronics, electrical appliances, and electrical engineering have developed rapidly. Almost all kinds of equipment, instruments, and meters related to electricity are inseparable from enameled wires, so enameled wire enamel is an irreplaceable industrial raw material. When enameled wire paint is used in harsh environments, it is easy to be impregnated after being corroded, damaging the internal cables, resulting in short circuit, leakage and other phenomena, which may cause harm to the human body and cause irreparable losses. Contents of the invention [0003] The object of the present invention is to provide a wire enamel with high resistance to dipping and its preparation process, so as to solv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D175/04C09D123/22C09D127/18C09D133/04C09D179/08C09D5/25C09D5/10C09D7/12C08G18/40C08G18/58C08G18/60
CPCC08G18/4054C08G18/58C08G18/603C08K2201/011C08L2201/08C08L2203/202C08L2205/035C09D5/10C09D5/18C09D175/04C09D7/61C08L23/22C08L27/18C08L33/04C08L79/08C08K3/36C08K2003/2296C08K2003/0881C08K3/08
Inventor 张志杰肖红马俊峰张慱张丹李剑
Owner HENAN BOYE ELECTRIC MATERIALS CO LTD
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