Large power LED structure adopting COB packaging
An LED structure, high-power technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as poor heat transfer, low thermal conductivity of insulating layers, etc., to improve heat dissipation performance, reduce chip junction temperature, and improve heat dissipation performance. Effect
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[0040]A high-power LED structure adopting COB packaging, including a radiator 2, an LED chip structure 3 and an encapsulation layer 1 located on the radiator; the encapsulation layer 1 is a mixture of epoxy resin and phosphor powder; the heat dissipation The radiator 2 is a ceramic radiator, the size of the radiator is 10mm*10mm*1.5mm, the spacing of the fins of the radiator will affect the convection with the air, the thickness of the fins will affect the contact area with the air, and then affect the performance of the radiator and chip junction temperature, this embodiment is optimized in many ways to set the thickness of the radiator fins to 0.5mm, the height to 8mm, and the spacing to 1mm; the spacing of the LED chips will affect the temperature gradient on the surface of the radiator and the junction temperature of each chip The distribution will also affect the maximum value and average value of the illuminance. In this embodiment, after multiple optimizations, the horiz...
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