Measurement and processing integrated laser leveling polishing method

Abstract

The invention provides a measurement and processing integrated laser leveling polishing method which comprises the steps that a workpiece is clamped; a two-dimensional laser displacement sensor and the workpiece are controlled to make relative translation movement, and a coordinate matrix of uniform measurement points is obtained; a galvanometer scanning system is controlled to scan a to-be-polished part of the surface of the workpiece according to the set scanning speed, and a new coordinate matrix of the uniform measurement points of the to-be-polished part of the surface of the workpiece is obtained after laser scanning; delta is calculated according to the function that delta is equal to z'max-z'min, if delta is less than or equal to the target smoothness of the workpiece, the operation is completed; otherwise, a laser scanning grid chart of the surface of the workpiece is constructed, and each grid in the laser scanning grid chart is endowed with a weight number k; the galvanometer scanning system is controlled to carry out k times of scanning processing on each grid in the laser scanning grid chart according to weight number k. Dynamic adjustment of processing parameters is realized and different processing parameters are used in different stages, so that the thickness of a material removed by laser scanning at every time can be increased, the leveling speed can be increased, and the processing efficiency and the processing precision can be improved.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser flattening and polishing method integrating measurement and processing. Background technique [0002] With the development of material surface technology, surface polishing technology has become an increasingly important technology. Polishing technology, also known as mirror processing technology, is a surface processing technology that produces a flat surface with a small processing deformation layer and no scratches. In industrial applications, the requirements for the surface roughness of materials are getting higher and higher, and have gradually developed from micron, submicron, nanometer to subnanometer. In order to meet the needs of the application, a variety of polishing techniques have been applied in industrial production. Polishing techniques include: mechanical polishing, ultrasonic polishing, chemical polishing, ion beam polishing, elec...

AI Technical Summary

Problems solved by technology

However, in the current practical industrial application field, whether the principle of hot polishing or cold polishing is adopted, the polishing process control in the existing laser polishing technology is basically an open-loop method

Although Zhang Fenglie of Tianjin University and others have proposed a real-time control scheme of laser energy density in the laser polishing process based on CCD image detection, relying on CCD image acquisition and subsequent image processing to obtain surface relief topography is obviously low in accuracy and is affected by the uniformity of illumination. , laser radiation, and many restrictions on the uniformity of light reflectivity of the workpiece itself

Further, how to integrate real-time measurement and processing, seamlessly integrate, and improve processing efficiency, there is no better solution

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