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Adhesive and applications thereof, large power LED bulb lamp, and preparation method thereof

A technology for LED bulbs and adhesives, applied in the directions of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of difficulty in increasing power and poor heat dissipation, and improve vacuum force and heat dissipation effect. , the effect of delaying curing time

Active Publication Date: 2016-10-19
CHANGZHOU INST OF TECH RES FOR SOLID STATE LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide an adhesive and its application, a high-power LED bulb lamp and its preparation method, so as to solve the problem that the power of LED bulb lamps in the prior art is difficult to increase due to poor heat dissipation

Method used

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Examples

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Effect test

preparation example Construction

[0029] In addition, the present invention also provides a method for preparing a high-power LED bulb lamp, including the step of fixing the substrate on the heat sink, wherein the step of fixing the substrate on the heat sink includes: coating the above-mentioned adhesive Overlaying the substrate and / or the surface to be bonded of the heat sink; placing the substrate over the heat sink; and, after curing, securing the heat sink to the substrate. The curing process here is the process of ignition without cover. During the aging process, the heat generated by the light source is transferred to the adhesive. The process of bonding allows volatile substances to escape into the air instead of being attached to the light shield of the lamp due to the mask. Those skilled in the art can select a specific curing process according to the above teachings of the present invention, which will not be repeated here.

[0030] During actual operation, it is preferable to bond the heat sink an...

Embodiment 1

[0037] The LED A60 bulb lamp is selected, the difference is that the following adhesive is used to bond and fix the substrate and the heat sink.

[0038] a fixed way:

[0039] Configure the adhesive, and the raw materials of the adhesive components are as follows: The raw materials for configuring component A include 50g of α, ω-hydroxyl-terminated polydimethylsiloxane, 30g of aluminum oxide and 20g of zinc oxide. The viscosity is 18mpa s; the raw materials for configuring component B include 27g of polydimethylsiloxane, 2.4g of γ-methacryloxypropyltrimethoxysilane, 2.4g of aminopropyltriethoxy 1.6g of 3-glycidyloxypropyltrimethoxysilane, 0.8g of octamethylcyclotetrasiloxane, 0.8g of hexamethylcyclotrisiloxane, 63g of zinc oxide, 1g Aluminum oxide and 1g of silicon dioxide, the viscosity of component B is 11mpa s; the volatile agent is cyclopentasiloxane; when configuring the adhesive, the mass ratio of component A, component B and volatile agent is 80 :5:15, the viscosity o...

Embodiment 2

[0042] The LED A60 bulb lamp is selected, the difference is that the following adhesive is used to bond and fix the substrate and the heat sink.

[0043] a fixed way:

[0044] Configure the adhesive, and the raw materials of the adhesive components are as follows: The raw materials for configuring component A include 70g of α, ω-hydroxyl-terminated polydimethylsiloxane, 10g of aluminum oxide and 20g of zinc oxide. The viscosity is 13mpa s; the raw materials for configuring component B include 18g of polydimethylsiloxane, 1.2g of γ-methacryloxypropyltrimethoxysilane, 1.2g of aminopropyltriethoxy silane, 0.8g of 3-glycidyloxypropyltrimethoxysilane, 0.4g of octamethylcyclotetrasiloxane, 0.4g of hexamethylcyclotrisiloxane, 75g of zinc oxide, 1g of alumina, 1g of silicon dioxide, 0.5g of aluminum carbide and 0.5g of aluminum nitride, the viscosity of component B is 9mpa s; the volatile agent is cyclohexasiloxane; when configuring the adhesive, group A The mass ratio of component,...

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Abstract

The invention provides an adhesive and applications thereof, a large power LED bulb lamp, and a preparation method thereof. The adhesive comprises the following components in parts by weight: 70 to 80 parts of component A, 5 to 15 parts of component B, and 10 to 15 parts of volatilizing agent. The component A comprises the following components in percentage by weight: 50 to 70% of alpha,omega-hydroxyl terminated dimethyl siloxane, 10 to 30% of first thermal conductive particles, and 20 to 40% of second thermal conductive particles. The component B comprises the following components in percentage by weight: 18 to 27% of polydimethyl siloxane, 4 to 8% of monomer fusing agent, 63 to 75% of third thermal conductive particles, and 2 to 7% of thermal conductivity aid. During the curing process of the adhesive, the volatilizing agent can form a vacuum force between the substrate where the adhesive is painted and a heat radiator, thus the substrate and the heat radiator can be bonded more tightly, the effective contact area is increased, and the heat radiating effect of the large power LED bulb lamp is effectively improved, so that the LED bulb lamp can sustain larger power.

Description

technical field [0001] The invention relates to the field of manufacturing LED bulb lamps, in particular to an adhesive and its application, a high-power LED bulb lamp and a preparation method thereof. Background technique [0002] Lighting lamps that use LEDs as light sources are becoming more and more common. In the process of using such lighting lamps, not only relatively high light efficiency but also good heat dissipation must be considered. This is the key point in the design process of LED lighting lamps. Among LED lighting fixtures, LED bulb lamps occupy a relatively high market proportion. Therefore, it is more important to solve the power and heat dissipation problems of LED bulb lamps. [0003] Most of the existing LED bulb lamps are composed of lamp caps, lamp housings, substrates, radiators, light shields and LED lamps, wherein the radiators are connected to the substrates so as to transfer the heat generated by the LED lamps to achieve a heat dissipation effect...

Claims

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Application Information

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IPC IPC(8): C09J183/06C09J183/04C09J11/06C09J11/04F21S2/00F21V17/00F21Y101/02
Inventor 杨彤周详郑成龙
Owner CHANGZHOU INST OF TECH RES FOR SOLID STATE LIGHTING
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