Unlock instant, AI-driven research and patent intelligence for your innovation.

Temperature-sensitive adhesive sheet for dicing ceramic electronic parts and method for producing ceramic electronic parts

An electronic component and temperature-sensitive technology, which is applied in the field of temperature-sensitive adhesive sheets for cutting, can solve problems such as insufficient adhesion, damage to electronic components, and low anchoring effect, and achieve the effects of improved manufacturing efficiency and easy peeling

Active Publication Date: 2019-11-19
NITTA CORP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In addition, in a general adhesive tape having an adhesive layer containing a polymer capable of side chain crystallization, if the adhesive layer is hard above the melting point, the anchoring effect at the time of bonding is low, and if the adhesive layer is hard at room temperature If the adhesive layer is also hard, the adhesive force at room temperature is insufficient, and the workpiece is prone to float during cutting.
In addition, since the adhesive force is exerted in a state where the adhesive layer is hard even if it is above the melting point, there is a possibility of damage to the electronic component during peeling.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temperature-sensitive adhesive sheet for dicing ceramic electronic parts and method for producing ceramic electronic parts
  • Temperature-sensitive adhesive sheet for dicing ceramic electronic parts and method for producing ceramic electronic parts

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0055] Mix 45 parts of behenyl acrylate (manufactured by NOF Corporation), 50 parts of butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts of acrylic acid, and 0.5 parts of PERBUTYL ND (manufactured by NOF Corporation) to ethyl acetate After stirring at 55° C. for 4 hours to 230 parts of ester, the temperature was raised to 80° C., and then 0.5 parts of PERHEXYL PV (manufactured by NOF Corporation) was added and stirred for 2 hours to polymerize these monomers. The weight average molecular weight of the obtained copolymer was 65 Ten thousand, the melting point is 43°C.

Synthetic example 2

[0057] 45 parts of behenyl acrylate (manufactured by NOF Corporation), 50 parts of butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts of 2-ethylhexyl acrylate (2HEA, manufactured by Nippon Shokubai Co., Ltd.), and PERBUTYL ND (NOF Corporation) 0.5 parts were mixed in 230 parts of ethyl acetate in this proportion, stirred at 55°C for 4 hours and then heated to 80°C, then 0.5 parts of PERHEXYLPV (NOF Corporation) was added and stirred for 2 hours to make these monomer polymerization. The obtained copolymer had a weight average molecular weight of 650,000 and a melting point of 42°C.

Synthetic example 3

[0059] Mix 45 parts of behenyl acrylate (manufactured by NOF Corporation), 50 parts of methyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts of acrylic acid, and 0.5 parts of PERBUTYL ND (manufactured by NOF Corporation) to acetic acid After stirring at 55°C for 4 hours to 230 parts of ethyl ester, the temperature was raised to 80°C, and then 0.5 parts of PERHEXYL PV (manufactured by NOF Corporation) was added and stirred for 2 hours to polymerize these monomers. The obtained copolymer had a weight average molecular weight of 650,000 and a melting point of 54°C.

[0060] Table 1 shows the copolymers of Synthesis Examples 1-4.

[0061] 【Table 1】

[0062]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
thicknessaaaaaaaaaa
adhesion strengthaaaaaaaaaa
Login to View More

Abstract

A temperature-sensitive adhesive sheet for cutting a ceramic electronic component, wherein a temperature-sensitive adhesive layer containing a side chain crystalline polymer is provided on at least one side of a substrate film, and the side chain crystalline polymer has 30 to 70 parts by mass of a (meth) acrylate having a linear alkyl group having 18 or more carbon atoms, 30 to 70 parts by mass of a (meth) acrylate having an alkyl group having 2 to 8 carbon atoms, and a polar monomer 0 The polymer obtained by polymerizing to 10 parts by mass has a weight average molecular weight of 400,000 to 800,000 and a melting point of 35 ° C or more.

Description

technical field [0001] The present invention relates to a temperature-sensitive adhesive sheet for dicing used in a dicing process of a ceramic electronic component and a method for producing a ceramic electronic component using the same. Background technique [0002] Ceramic capacitors are generally produced by printing predetermined internal electrodes on a ceramic green sheet (ceramic molded sheet) obtained by molding a mixture of ceramic powder, a binder, and a solvent, and laminating and pressing it to a base Then (lamination step), the obtained laminate is cut into chips by a cutter (cutting step), the cut piece is peeled off (peeling step), fired, and finally external electrodes are formed on the end faces of the cut piece. [0003] In the cutting step after the above-mentioned stacking step, the laminated body needs to be firmly fixed to the base so that the cut pieces do not scatter. Therefore, in the cutting step, the laminate is fixed to the base using an adhesiv...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/30C09J7/25C09J133/08B28B11/14H01G13/00H01G4/30H01G4/12
CPCH01G13/00C09J7/22C09J7/35C09J133/08B28B11/14C09J2203/326C09J2433/00C09J2301/122H01G4/1227H01G4/30C09J5/06C09J7/20C09J133/10
Inventor 山本正芳河原伸一郎
Owner NITTA CORP