A kind of silicon carbide-based composite phase ceramic material and preparation method thereof
A complex-phase ceramic, silicon carbide-based technology, applied in the field of SiC ceramics, can solve problems such as nonlinear volt-ampere characteristics, and achieve the effects of good thermal conductivity and electrical conductivity, high strength and hardness, and low density
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Embodiment 1
[0034] SiC, ZrB 2 (20wt%) 100g in total, sintering aid B 4 C 0.6g, phenolic resin 10g, the powder was made into a slurry with a solid content of 45wt%, and 200g of SiC balls were used as the ball milling medium, and mixed for 24h. Then dry and sieve, the obtained powder is molded on a flatbed machine under 15MPa pressure, and then isostatically pressed under 200MPa pressure. After debonding, it was sintered under normal pressure Ar atmosphere, the sintering temperature was 2100°C, and the holding time was 1h. The obtained SiC-based composite ceramics had a density of 3.48g cm -3 , Bending strength 313MPa. The obtained ceramics were made into small discs of Φ12mm and thickness 2mm, coated with silver paste electrodes on both ends, and then kept in a muffle furnace at 750°C for 10min. The obtained electronic components were tested by Keithley 2450 multi-channel System test, its resistivity ρ is 220.13Ω·cm.
Embodiment 2
[0036] SiC, ZrB 2 (24wt%) 100g in total, sintering aid B 4 C 0.6g, binder phenolic resin 8g, the powder was made into a slurry with a solid content of 45wt%, and 200g of SiC balls were used as a ball milling medium, and mixed for 24 hours. Then dry and sieve, the obtained powder is molded on a flatbed machine under 15MPa pressure, and then isostatically pressed under 200MPa pressure. After debonding, it was sintered under normal pressure Ar atmosphere, the sintering temperature was 1900°C, and the holding time was 2h. The obtained SiC-based composite ceramic material had a density of 3.55g cm -3 , The bending strength is 310MPa. The obtained ceramics were made into small discs of Φ12mm and thickness 2mm, coated with silver paste electrodes on both ends, and then kept in a muffle furnace at 750°C for 10min. The obtained electronic components were tested by Keithley 2450 multi-channel System test, its resistivity ρ is 15.37Ω·cm.
Embodiment 3
[0038] SiC, ZrB 2 (28wt%) 100g in total, sintering aid B 4 C 0.6g, binder phenolic resin 5g, the powder was formulated into a slurry with a solid content of 45wt%, and 200g of SiC balls were used as a ball milling medium, and mixed for 24 hours. Then dry and sieve, the obtained powder is molded on a flatbed machine under 15MPa pressure, and then isostatically pressed under 200MPa pressure. After debonding, it was sintered in Ar atmosphere at normal pressure, the sintering temperature was 2200 ° C, and the holding time was 1 h. The obtained SiC-based composite ceramic material had a density of 3.64 g cm -3 , The flexural strength is 316MPa. The obtained ceramics were made into small discs of Φ12mm and thickness 2mm, coated with silver paste electrodes on both ends, and then kept in a muffle furnace at 750°C for 10min. The obtained electronic components were tested by Keithley 2450 multi-channel System test, its resistivity ρ is 6.89Ω·cm.
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