A kind of infrared light source material and preparation method thereof
A technology of infrared light source and raw material powder, applied in the field of infrared light source, can solve the problems of high mechanical strength, high resistivity, low high temperature radiation intensity, etc., achieve high strength and thermal conductivity, solve difficult processing, high infrared emissivity problems. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0039] SiC (75wt%), AlN (5wt%) and MoSi 2 (20 wt%) 100 g in total, 1 g of phenolic resin, 200 g of SiC balls as the ball milling medium, and mixed for 24 hours. Then dry and sieve, the obtained powder is molded on a flatbed machine under 5MPa pressure, and then isostatically pressed under 200MPa pressure. After debonding, it was sintered under normal pressure argon atmosphere, the sintering temperature was 1900°C, and the sintering time was 2 hours. The obtained SiC-based composite ceramic material had a bending strength of 130MPa and a thermal conductivity of 42W m -1 ·K -1 . The obtained SiC-based multiphase ceramic material was processed into a Φ12 disc with a thickness of 2mm, coated with silver paste electrodes evenly on both sides, and then placed in a muffle furnace at 750°C for 10min. The obtained electronic components were tested by a Keithley 2450 multi-channel test system, and their resistivity was 110Ω·cm. The thickness of the obtained SiC-based composite ceram...
Embodiment 2
[0041] SiC (65wt%), AlN (5wt%) and MoSi 2 (30wt%) 100g in total, 1g of phenolic resin, 200g of SiC balls as the ball milling medium, and mixed for 24h. Then dry and sieve, the obtained powder is molded on a flatbed machine under 100MPa pressure, and then isostatically pressed under 150MPa pressure. After debonding, it was sintered under normal pressure argon atmosphere, the sintering temperature was 2000°C, and the sintering time was 1 hour. The obtained SiC-based composite ceramic material had a bending strength of 140MPa and a thermal conductivity of 40W m -1 ·K -1 . The obtained SiC-based multiphase ceramic material was processed into a Φ12 disc with a thickness of 2mm, coated with silver paste electrodes evenly on both sides, and then placed in a muffle furnace at 750°C for 10min. The obtained electronic components were tested by a Keithley (Keithley) 2450 multi-channel test system, and their resistivity was 24Ω·cm. The thickness of the obtained SiC-based composite cer...
Embodiment 3
[0043] SiC (55wt%), AlN (5wt%) and MoSi 2 (40wt%) 100g in total, 1g of phenolic resin, 200g of SiC balls as the ball milling medium, and mixed for 24h. Then dry and sieve, the obtained powder is molded on a flatbed machine under 5MPa pressure, and then isostatically pressed under 200MPa pressure. After debonding, it was sintered under normal pressure argon atmosphere, the sintering temperature was 1900°C, and the sintering time was 1 hour. The obtained SiC-based composite ceramic material had a bending strength of 181MPa and a thermal conductivity of 44W m -1 ·K -1 . The obtained SiC-based multiphase ceramic material was processed into a Φ12 disc with a thickness of 2mm, coated with silver paste electrodes evenly on both sides, and then placed in a muffle furnace at 750°C for 10min. The obtained electronic components were tested by a Keithley (Keithley) 2450 multi-channel test system, and their resistivity was 12Ω·cm. The thickness of the obtained SiC-based composite ceram...
PUM
| Property | Measurement | Unit |
|---|---|---|
| electrical resistivity | aaaaa | aaaaa |
| flexural strength | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


