Preparing method of antioxidant silvering copper powder

A silver-plated copper powder and anti-oxidation technology, which is applied in liquid chemical plating, metal processing equipment, coating, etc., can solve the problems of high cost, non-dense and uneven silver coating layer, and easy agglomeration of powder, etc. Achieve excellent high temperature oxidation resistance, improve silver ion release too fast, and improve stability

Inactive Publication Date: 2016-11-09
JINLING INST OF TECH
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

In contrast, the silver-coated copper powder prepared by the mixed ball milling method is actually a mixture of silver and copper; the melt atomization method has problems such as complicated preparation process and high cost; the electroless plating method has the advantages of simple process and low preparation cost. It is considered to be one of the most suitable methods for preparing silver-coated copper powder
However, the current method fails to effectively solve the problem of non-denseness and inhomogeneity of the silver coating layer, so it is difficult to greatly improve the high-temperature oxidation resistance of copper powder
In addition, there are still problems such as easy powder agglomeration in the silver coating of ultrafine copper powder, which also limits the promotion of this method.

Method used

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  • Preparing method of antioxidant silvering copper powder

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Experimental program
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Effect test

Embodiment 1

[0024] Add 100g of copper powder, 10.3g of sodium hypophosphite, and 10g of PVP into 500mL of deionized water to prepare a reducing solution containing copper substrates, add ammonia water to adjust its pH value to be stable at 11; add 15.9g of silver nitrate, 0.5g of EDTA- 2Na was added to 500mL deionized water to prepare an oxidation solution; the oxidation solution was slowly added to the reduction solution, the temperature was raised to 30°C, and after 20 minutes of reaction, the primary silver-plated copper powder was separated by a centrifuge; the primary silver-plated copper powder was used as the base material to repeat The silver-plated copper powder was prepared three times through the above silver-plated steps twice, washed three times with deionized water, washed once with absolute ethanol, and the silver-plated copper powder after centrifugation was vacuum-dried at 60° C., and the obtained silver-plated copper powder was placed in a horse. Heating in a furnace at 3...

Embodiment 2

[0026] Add 100g of copper powder, 10.3g of sodium hypophosphite, and 10g of PVP into 500mL of deionized water to prepare a reducing solution containing copper substrates, add ammonia water to adjust its pH value to be stable at 11; add 15.9g of silver nitrate, 2g of EDTA-2Na Add 500mL of deionized water to prepare an oxidation solution; slowly add the oxidation solution to the reducing solution, raise the temperature to 30°C, react for 20 minutes, and separate the primary silver-plated copper powder with a centrifuge; repeat the above with the primary silver-plated copper powder as the base material The silver-plated copper powder is prepared twice, and the silver-plated copper powder is prepared three times, washed three times with deionized water, washed once with absolute ethanol, and the silver-plated copper powder after centrifugation is vacuum-dried at 60°C. Heating in the furnace at 300°C for 20 minutes, the mass weight gain rate reaches 2.3%.

Embodiment 3

[0028] Add 100g of copper powder, 10.3g of sodium hypophosphite, and 10g of PVP into 500mL of deionized water to prepare a reducing solution containing copper substrates, add ammonia water to adjust its pH value to be stable at 11; add 15.9g of silver nitrate, 2g of EDTA-2Na Add 500mL of deionized water to prepare an oxidation solution; slowly add the oxidation solution to the reducing solution, raise the temperature to 50°C, react for 20 minutes, and separate the primary silver-plated copper powder with a centrifuge; repeat the above with the primary silver-plated copper powder as the base material The silver-plated copper powder is prepared twice, and the silver-plated copper powder is prepared three times, washed three times with deionized water, washed once with absolute ethanol, and the silver-plated copper powder after centrifugation is vacuum-dried at 60°C. Heating in a furnace at 300°C for 20 minutes, the mass weight gain rate reaches 0.5%. The obtained silver-plated c...

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Abstract

The invention relates to a preparing method of antioxidant silvering copper powder. Sodium hypophosphite is adopted to serve as a reducing agent, deionized water is adopted to serve as a solvent, sodium hypophosphite reduction liquid is prepared, copper powder is adopted to serve as a base material to be added into the reduction liquid, PVP is added, ammonium hydroxide is added to adjust the pH value, and the pH value is stabilized to 11; silver nitrate serves as a silver source, the deionized water serve as a solvent to prepare oxidation liquid, an EDTA-2Na complexing agent is added, stability of plating liquid is improved, and the problem that in the silvering process, silver ions are released too fast is obviously solved; solutions are mixed, meanwhile, magnetic stirring is carried out, the adding temperature is kept to range from 30 DEG C to 80 DEG C, reaction is carried out for 20 min, centrifuging is carried out, and one-time-silvering copper powder is obtained; the one-time-silvering copper powder serves as the base material, the above steps are repeated twice, and third-time-silvering copper powder is obtained. High-temperature oxidation resistance of silver plated copper powder prepared through the method is excellent, and the method is suitable for replacing conductive phase silver powder of electronic paste.

Description

technical field [0001] The invention relates to a preparation method of anti-oxidation silver-plated copper powder, in particular to a chemical silver-plating method for preparing high-temperature anti-oxidation silver-coated copper powder. Background technique [0002] Conductive paste is the basic material for the development of electronic components, and also the key material for making chip components and printed circuits. In the preparation technology of electronic paste, the preparation of conductive phase metal powder is the key. Without excellent metal powder, there will be no excellent electronic paste. Metal powder and electronic paste have always promoted and restricted each other. For conductive pastes, the conductive phases are mostly noble metal powders such as platinum, palladium, gold and silver, among which silver conductive pastes are the most widely used and the largest amount used. In recent years, due to the soaring price of precious metals, the cost of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44B22F1/02
CPCC23C18/44B22F1/145
Inventor 张小敏王昆彦
Owner JINLING INST OF TECH
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