Method for acquiring crack propagation three-dimensional profile of brittle materials by polishing and etching lateral surface layer by layer

Abstract

A method for acquiring crack propagation three-dimensional profile of brittle materials by polishing and etching lateral surface layer by layer comprises the following steps: (1) creating indentations or scratches on the surface of a material by using an indenter or a scratch tester; (2) polishing the lateral face with indentations or scratches of the material surface, so as to form surface cracks; (3) performing etching on the polished lateral face obtained in step (2) by using an etching solution, so as to remove polishing residual impurities and a micro thin polishing sedimentary layer covering surface damages; (4)cleaning and drying the brittle material surface subjected to etching in step (3), and observing, analyzing and detecting cracks from the onset boundary; (5) repeating polishing, etching and detecting in step (2), (3) and (4) until indentations or scratches created in step (1) are completely detected; and (6) fitting layer-by-layer image information obtained in step (4), so as to obtain comprehensive information about the crack propagation three-dimensional profile of brittle material. The method is wide in applicable materials and low in testing equipment requirement.

Description

technical field [0001] The invention relates to a method for researching crack growth of materials, in particular to a method for researching crack growth of brittle materials by polishing and corrosion, specifically a method for obtaining three-dimensional crack growth morphology of brittle materials by layer-by-layer polishing and corrosion on the side. Background technique [0002] Brittle materials, such as glass materials, optical crystal materials, engineering ceramics and semiconductor materials, have the characteristics of high strength, high hardness, high brittleness, heat insulation, low density, good expansion coefficient and good chemical stability. They are general metal materials. incomparable. And it mainly involves high-end fields such as energy, space, national defense equipment, integrated circuits and MEMS. With the development of optics, microelectronics, MEMS and related technologies, the requirements for the surface quality of the materials involved i...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing methods cannot effectively obtain the three-dimensional shape characteristics of brittle materials, which makes it difficult to accurately determine the processing parameters of brittle materials. The surface method is used to accurately obtain the surface damage crack morphology of brittle materials, optimize the processing parameters, and improve the surface quality of materials.