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Adhesive composition using polyamide-imide resin

A polyamide-imide resin and composition technology, applied in the direction of film/sheet adhesive, adhesive type, non-polymer adhesive additive, etc., can solve the problem of not being able to obtain heat resistance, Issues such as flexible adhesiveness, insulating solvent solubility, etc.

Active Publication Date: 2016-11-09
日本旗胜株式会社 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as described above, the existing technology cannot obtain a product that satisfies heat resistance, flexibility, adhesiveness, insulation, and solvent solubility at the same time, and is suitable as a heat-resistant adhesive that can be used for flexible printed circuit boards and the like. resin

Method used

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  • Adhesive composition using polyamide-imide resin
  • Adhesive composition using polyamide-imide resin
  • Adhesive composition using polyamide-imide resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0088] Hereinafter, the effects of the present invention will be demonstrated through examples, but the present invention is not limited thereto. In addition, the characteristic evaluation in an Example was performed by the following method.

[0089] adhesiveness

[0090] Apply the adhesive composition solution to a polyimide film (Apicar 12.5NPI manufactured by Kaneka Co., Ltd.) to a thickness of 20 μm after drying, and dry it with a hot air dryer at 140°C for 3 minutes to obtain a B-stage state sample. Using a vacuum pressure laminator at 160° C., 3 MPa, and 30 seconds under reduced pressure, the adhesive-coated surface of the B-stage sample and the glossy surface of the copper foil (BHY thickness 18 μm manufactured by JX Nippon Mining Co., Ltd.) were heated. Crimp. Then, it heat-cured at 150 degreeC for 4 hours. Using a tensile tester (Shimadzu Autograph AG-X plus), the cured sample was peeled off the polyimide film at a speed of 50 mm / min in a direction of 90° under an...

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Abstract

Provided is an adhesive composition using a polyamide-imide resin which is suitable for uses such as flexible printed wiring boards. This adhesive composition in which a polyamide-imide resin and an epoxy resin are combined is characterised in that: (A) 15-40 parts by mass of the epoxy resin is added relative to 85-60 parts by mass of the polyamide-imide resin; (B) a phosphorus-containing epoxy resin is not used as the epoxy resin, or if used, the amount of phosphorus-containing epoxy resin added is extremely small; and (C) the polyamide-imide resin comprises constituent units derived from specific acid components, and a constituent unit derived from a diisocyanate component having an aromatic ring or from a diamine component having an aromatic ring, wherein if the constituent units derived from all of the acid components of the polyamide-imide resin are 100 mol%, the constituent units respectively derived from the acid components have a specific ratio.

Description

technical field [0001] The present invention relates to an adhesive composition using a polyamide-imide resin, and more specifically relates to an adhesive composition excellent in insulation, flexibility, flame retardancy, and fluidity, and suitable for use in cover films, adhesive films, and three-layer copper-clad laminates, etc. Adhesive composition. Background technique [0002] Polyamide-imide resin is polymerized from aromatic monomers, and exhibits high heat resistance, chemical resistance, and abrasion resistance, and also exhibits high resistance to N-methyl-2-pyrrolidone, etc. The solubility of boiling point amide solvents makes it used in molding materials or heat-resistant insulating coatings. However, aromatic polyamide-imide resins generally have a high modulus of elasticity, are hard and brittle, and lack solubility in low-boiling solvents, making them difficult to use in applications requiring flexibility and solvent-drying properties such as adhesives. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C09J7/02C09J11/06C09J163/00H05K1/03H05K3/28
CPCC09J163/00C08G81/028C08G18/6262C08G73/1035C08G73/1039C08G73/14C09J2203/326C09J2463/00C08G18/7671C08G18/341C08G18/343C08K5/0066C08L63/00C08L79/08H05K3/281H05K3/386C08K2201/014C08K5/5313C09J2477/00C09J2479/08H05K2201/012C09J179/08C09J7/28C09J11/06H05K1/0393H05K1/0373
Inventor 家根武久小柳英之浜野荣美大庭久惠冈野高治海老原智
Owner 日本旗胜株式会社
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