Etchant composition, method for forming metal wire patterns and method for manufacturing array substrate

Abstract

The invention discloses an etchant composition used for copper layers and titanium layers and a method for manufacturing an array substrate of a liquid crystal display using the etchant composition. The etchant composition comprises 0.5 wt.% to 20 wt.% of persulfate, 0.01 wt.% to 2 wt.% of a fluorine compound, 1 wt.% to 10 wt.% of inorganic acid (salt), 5 wt.% to 20 wt.% of organic acid (salt), 0.1 wt.% to 5 wt.% of a cyclamine compound containing alkyl (containing 1 to 5 carbon atoms) tetrazole, 0.1 wt.% to 10 wt.% of a sulfonic acid compound and the balance of water. Thus, the copper layers and the titanium layers can be evenly etched in batches at a high etching speed, and even when the number of treated sheets is increased, the inclination angles of etched patterns are reduced.

Description

technical field [0001] The invention relates to an etchant composition for a copper layer and a titanium layer, and a method for manufacturing an array substrate of a liquid crystal display using the etchant composition. Background technique [0002] A representative electronic circuit for driving semiconductor devices and flat panel displays is a thin film transistor (TFT). A method of manufacturing a TFT-LCD generally includes forming a metal layer on a substrate as a wire material for a gate electrode and a source / drain electrode, forming a photoresist on a selected area of ​​the metal layer, and then using The photoresist acts as a mask to etch the metal layer. [0003] Conventionally, as the wiring material of the gate electrode and the source / drain electrodes, metal layers in which aluminum or its alloy and other metals are sequentially laminated have been used. Aluminum is cheaper and has low electrical resistance, but has poor chemical resistance and can cause prob...

AI Technical Summary

Problems solved by technology

However, this hydrogen peroxide etchant has disadvantages such as a 'disproportionation reaction' to cause self-decomposition of the composition, or instability due to rapid changes in the composition of the composition over time

In addition, potassium persulfate etchant has disadvantages such as low etch rate and instability over time

[0007] In addition, commonly, the inclination angle of the etching pattern changes with the number of films processed by the etchant, and therefore, there is a problem that the lifetime of the etchant cannot be extended

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