Photovoltaic solder strip and tin coating process
A photovoltaic welding ribbon and process technology, applied in metal material coating process, photovoltaic power generation, hot-dip plating process, etc., can solve the problems of small proportion of sunlight, uneven solder layer, no processing, etc., to meet welding requirements, Effect of improving reflection efficiency and increasing actual power
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Embodiment 1
[0056] like Figure 2 to Figure 4 As shown, it is disclosed that a roller is used to coat the technological process of the photovoltaic ribbon, which includes:
[0057] (1) Substrate selection: choose an oxygen-free copper strip as the substrate, and the oxygen-free copper strip is a double-plane welding strip or a heterogeneous copper strip.
[0058] (2) Electroplating:
[0059] 21) Place the selected substrate in the tin-lead alloy bath; there are 7% additives and brighteners in the alloy bath;
[0060] 22) In an environment with a temperature of 30°C and a current density of 26ASD, electroplating for 60s to 70s;
[0061] 23) Cover the surface of the substrate with a dense tin-lead alloy coating, the thickness of the coating is 6 μm, and the surface is bright;
[0062] 24) After electroplating, clean and dry the solder strips for later use.
[0063] (3) Coating and printing of solder paste: Coating and printing the solder paste on the substrate of the bottom solderable l...
Embodiment 2
[0068] like Figure 5 to Figure 6 As shown, what is disclosed is a process flow for coating photovoltaic ribbons by printing, which includes:
[0069] (1) Substrate selection: The oxygen-free copper strip is selected as the substrate, and the oxygen-free copper strip is a heterogeneous copper strip.
[0070] (2) Electroplating:
[0071] 21) Place the selected substrate in the tin-lead alloy bath; there are 7% additives and brighteners in the alloy bath;
[0072] 22) Electroplating for 60s at a temperature of 30°C and a current density of 26ASD;
[0073] 23) Cover the surface of the substrate with a dense tin-lead alloy coating, the thickness of the coating is 6 μm, and the surface is bright;
[0074] 24) After electroplating, clean and dry the solder strips for later use.
[0075] (3) Coating and printing of solder paste: Coating and printing the solder paste on the substrate of the bottom solderable layer electroplated in step (2), the specific process is:
[0076] 31) P...
Embodiment 3
[0080] like Figure 7 to Figure 8 As shown, what is disclosed is a process flow for coating photovoltaic ribbons by spraying, which includes:
[0081] (1) Substrate selection: choose an oxygen-free copper strip as the substrate, and the oxygen-free copper strip is a double-plane welding strip or a heterogeneous copper strip, and the slope is pressed on a wide surface of the substrate by mechanical means, so that the substrate can be seen from the cross-section It is a trapezoidal section, and the upper base of the trapezoid is half of the width of the entire welding strip.
[0082] (2) Electroplating:
[0083] 21) Place the selected substrate in the pure tin plating solution; there are 7% additives and brighteners in the plating solution;
[0084] 22) Tin plating, in an environment with a temperature of 30°C and a current density of 26ASD, electroplating for 90s;
[0085] 23) Cover the surface of the substrate with a dense pure tin coating, the thickness of the coating is 5...
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Abstract
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