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Photovoltaic solder strip and tin coating process

A photovoltaic welding ribbon and process technology, applied in metal material coating process, photovoltaic power generation, hot-dip plating process, etc., can solve the problems of small proportion of sunlight, uneven solder layer, no processing, etc., to meet welding requirements, Effect of improving reflection efficiency and increasing actual power

Inactive Publication Date: 2016-11-23
徐九生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the pit-shaped body only produces diffuse reflection, and the proportion of sunlight reflected back to the cell is very small. In addition to the limited conversion rate, the pits are prepared in the process of tin coating, which will produce uneven solder layers. There will be a phenomenon that the welding with the battery sheet is not strong, and there will be false welding
[0006] Chinese patent ZL201320463993.7 discloses a photovoltaic ribbon, which introduces the embossing on the surface of the ribbon, but does not explain the subsequent processing, that is, how to form an effective welding method.
The characteristic of tin-lead or tin is that at a certain thickness, high temperature forms natural hanging or shrinkage of tin, but too thin can not guarantee the normal progress of welding
Therefore, the contradiction between solder and reflection cannot be completely resolved

Method used

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  • Photovoltaic solder strip and tin coating process
  • Photovoltaic solder strip and tin coating process
  • Photovoltaic solder strip and tin coating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] like Figure 2 to Figure 4 As shown, it is disclosed that a roller is used to coat the technological process of the photovoltaic ribbon, which includes:

[0057] (1) Substrate selection: choose an oxygen-free copper strip as the substrate, and the oxygen-free copper strip is a double-plane welding strip or a heterogeneous copper strip.

[0058] (2) Electroplating:

[0059] 21) Place the selected substrate in the tin-lead alloy bath; there are 7% additives and brighteners in the alloy bath;

[0060] 22) In an environment with a temperature of 30°C and a current density of 26ASD, electroplating for 60s to 70s;

[0061] 23) Cover the surface of the substrate with a dense tin-lead alloy coating, the thickness of the coating is 6 μm, and the surface is bright;

[0062] 24) After electroplating, clean and dry the solder strips for later use.

[0063] (3) Coating and printing of solder paste: Coating and printing the solder paste on the substrate of the bottom solderable l...

Embodiment 2

[0068] like Figure 5 to Figure 6 As shown, what is disclosed is a process flow for coating photovoltaic ribbons by printing, which includes:

[0069] (1) Substrate selection: The oxygen-free copper strip is selected as the substrate, and the oxygen-free copper strip is a heterogeneous copper strip.

[0070] (2) Electroplating:

[0071] 21) Place the selected substrate in the tin-lead alloy bath; there are 7% additives and brighteners in the alloy bath;

[0072] 22) Electroplating for 60s at a temperature of 30°C and a current density of 26ASD;

[0073] 23) Cover the surface of the substrate with a dense tin-lead alloy coating, the thickness of the coating is 6 μm, and the surface is bright;

[0074] 24) After electroplating, clean and dry the solder strips for later use.

[0075] (3) Coating and printing of solder paste: Coating and printing the solder paste on the substrate of the bottom solderable layer electroplated in step (2), the specific process is:

[0076] 31) P...

Embodiment 3

[0080] like Figure 7 to Figure 8 As shown, what is disclosed is a process flow for coating photovoltaic ribbons by spraying, which includes:

[0081] (1) Substrate selection: choose an oxygen-free copper strip as the substrate, and the oxygen-free copper strip is a double-plane welding strip or a heterogeneous copper strip, and the slope is pressed on a wide surface of the substrate by mechanical means, so that the substrate can be seen from the cross-section It is a trapezoidal section, and the upper base of the trapezoid is half of the width of the entire welding strip.

[0082] (2) Electroplating:

[0083] 21) Place the selected substrate in the pure tin plating solution; there are 7% additives and brighteners in the plating solution;

[0084] 22) Tin plating, in an environment with a temperature of 30°C and a current density of 26ASD, electroplating for 90s;

[0085] 23) Cover the surface of the substrate with a dense pure tin coating, the thickness of the coating is 5...

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Abstract

The invention discloses a photovoltaic solder strip. The photovoltaic solder strip comprises a substrate which is a metal elementary substance or an alloy material, a plurality of grooves are formed in the upper surface of the substrate by embossing, a substrate plane is formed between every two adjacent grooves, a bottom solderable layer is formed by continuous plating of the surface of the substrate, and each substrate plane is coated with soldering paste to form a solderable layer. A coating process includes: firstly, selecting the substrate; secondly, plating; thirdly, performing soldering paste coating and printing after plating is finished; finally, making solder joints. The photovoltaic solder strip prepared according to the tin coating process is superior in manual soldering and machine soldering process; due to a novel material formed by twice processing, power of solar products can be improved after application of the photovoltaic solder strip, and material saving and material soldering performance improvement are realized.

Description

technical field [0001] The invention relates to a photovoltaic welding strip and a tin-coating process thereof, belonging to the technical field of photovoltaic welding strip processing. Background technique [0002] The traditional tin-lead-plated copper ribbon is an indispensable part of solar components. The quality of the solder ribbon directly affects the current collection efficiency of photovoltaic modules and has a great impact on the economic benefits of photovoltaic modules. Traditional tin-plated or tin-lead, silver-plated copper strip, also known as tin-coated strip, bus bar, interconnection bar. The following documents refer to all referred to as welding strips. [0003] The process used in the traditional soldering strip is to use the copper strip to quickly pass through the molten solder-tin 63 lead 37, and form a 30um coating layer on the surface of the copper strip, so that the soldering strip has welding ability, which is traditional hot-dip plating. Such...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/05C23C2/08C23C2/40
CPCY02E10/50H01L31/0508C23C2/08C23C2/40H01L31/0512
Inventor 徐九生
Owner 徐九生