A kind of laser encapsulation equipment

Abstract

The invention provides a laser packaging device including a light source used for generating laser beams used for packaging; optical fibers used for transmitting the laser beams; a light intensity control device used for adjusting the light intensity of the laser beams entering an optical imaging module; the optical imaging module used for generating light spots with ideal light intensity distribution and having a telecentric feature; an optical path conveying module including at least one optical path conveying unit and used for enabling packaging units to bond with each other through heating glass powder with light spot radiation; a substrate bearing table used for bearing the packaging units. The optical path conveying unit includes a phase modulator with phase delay of 1 / 2 wavelength, and polarization beam splitter prism, a phase modulator with phase delay of 1.4 wavelength and a 0-degree total reflector. Laser output from a light source enters the light intensity control device through the optical fibers and passes through the optical imaging module and the optical path conveying module and hits on the glass powder.

Description

Technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a laser packaging equipment. Background technique [0002] In recent years, in view of the excellent performance of OLED (Organic Light-Emitting Diode) in the main indicators of color gamut, viewing angle, energy consumption, thin and light appearance, and response speed, it has become more and more widely used in the field of flat panel display and lighting, so it has been rapidly development of. However, the electrodes and organic layers in the OLED display are very sensitive to oxygen and moisture, which will seriously affect the performance of the OLED device and shorten the life of the OLED device. Therefore, it is very important to provide effective airtight sealing for OLED devices, and the requirements for airtightness are very high. To encapsulate OLEDs, in addition to enhancing the mechanical strength of the device, it is more important to isolate ...

AI Technical Summary

Problems solved by technology

[0005] After investigating the current multi-laser head laser glass powder packaging equipment, it is found that there are the following shortcomings: first, the structure is not compact, and due to the limitation of the size of the optical imaging system at the laser head exit position, it is impossible to achieve dense placement of multi-laser heads; second, The energy utilization rate is not high, and the reflected light on the upper surface of the unit to be packaged is not effectively managed; third, the control is complicated, and each laser head needs to be controlled

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