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Preparation method of laboratory BGA nanometer reinforced solder balls and heat fatigue-resistance BGA packing devices

A solder ball and laboratory technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of poor fatigue resistance and achieve the effect of low cost and convenient method

Active Publication Date: 2016-12-07
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the lead-free solder ball of SAC305 is widely used in the market. It has relatively the best solderability among lead-free solders, but its fatigue resistance is poor.

Method used

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  • Preparation method of laboratory BGA nanometer reinforced solder balls and heat fatigue-resistance BGA packing devices
  • Preparation method of laboratory BGA nanometer reinforced solder balls and heat fatigue-resistance BGA packing devices
  • Preparation method of laboratory BGA nanometer reinforced solder balls and heat fatigue-resistance BGA packing devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034]A preparation of BGA reinforced solder balls with nanoparticles (POSS particles), base material SAC305 lead-free eutectic powder, adding 3% POSS nanoparticles, mechanical stirring and mixing for half an hour, and then mixing with 60 rpm The powder was high-energy ball milled for 10 hours to obtain a certain physical combination.

[0035] Mix the composite powder and rosin-type soldering paste at a mass ratio of 88:12, add in grades, stir mechanically for half an hour, mix evenly, and store in the refrigerator. Then use the next figure 2 The diameter is 0.48mm, the thickness is 0.1mm steel mesh round hole, and the glass plate is bonded to form an integrated device (as shown figure 1 ), apply a small amount of compound solder paste on the steel plate, and brush it on the glass plate through the mesh holes of a specific area with a scraper, and then put the steel mesh-glass plate on a heating plate with a temperature of 240°C and keep it warm for 10s , Then take it off t...

Embodiment 2

[0042] In order to observe the good connection effect and weldability, SEM microscopic morphology observation was carried out on the solder joint section. Figure 4 (a) is the package solder joint prepared by using standard commercially available SAC305 solder balls, (b) is the package solder joint prepared by this patent using solder balls added with 3% POSS in SAC305, (c) is the package solder joint prepared in SAC305 The packaging solder joints prepared by adding 0.05% CNTs solder balls in the package have a multiple of 300 times, which is 50 times smaller than the previous two multiples. It is found that the solderability is good and the size is not much different.

Embodiment 3

[0044] The BGA solder ball developed by the present invention is prepared by mesh printing with composite solder paste. Since the effect of adding nanoparticles in the composite solder paste directly determines the effect of adding nanoparticles in BGA solder joints, it is therefore used in lapped Cu Apply a small amount of solder paste on the chip to prepare simulated solder joints, and conduct electron microscope observation at 2000 times. Figure 5 Among them, (a) is the unadded SAC305 solder joint, (b) is the composite solder joint with 3% POSS added, and (c) is the composite solder joint with 0.05% CNTs added. It can be seen that the microstructure is refined, And the effect of adding nanoparticles is good.

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Abstract

The invention discloses a preparation method of laboratory BGA nanometer reinforced solder balls and heat fatigue-resistance BGA packing devices, and belongs to the technical field of welding materials. The preparation method comprises the following steps: SAC305 eutectic powder and nanometer particles are mechanically mixed and grinded in proportions; the obtained composite powder and rosin flux paste are mixed according to a certain ratio for classified adding and stirring; the paste is printed on a glass plate through meshes of a silk screen or a printing steel screen by a scraper; steel screen-glass plate integrated equipment printed with the paste with a certain volume is put in a vacuum thermal insulation box or a heating plate for melting and ball production; and then, the molding, the scraping, the cleaning, the drying and the screening are performed. The screened tin balls are selected for BGA welding ball planting; and the fatigue resistance of the packing containers under nanometer reinforcement is researched.

Description

technical field [0001] The invention relates to a method for preparing BGA nano-reinforced solder balls used in laboratories, which uses graded stirring and screen printing to prepare nano-particle-reinforced solder balls, and further prepares them into BGA packaging devices with thermal fatigue resistance properties, belonging to the technical field of soldering materials , specifically electronic packaging technology. Background technique [0002] Solder balls are an important industrial raw material for the packaging and connection of electronic components. They are widely used in the electronics industry, manufacturing industry, automobile manufacturing industry, and maintenance industry. They exist in various BGA structures and provide a reference for soldering solder research. . [0003] At present, the traditional lead-free solder ball preparation process includes gas atomization method, centrifugal atomization method, wire cutting remelting method and swing molding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K1/00
CPCB23K1/0008B23K35/40B23K2101/42
Inventor 谷朋浩汉晶郭福
Owner BEIJING UNIV OF TECH
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