Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Preparation method of soldering paste for laser reflow soldering

A reflow soldering and solder paste technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as vulnerability, product quality, splashing, affecting work efficiency, etc., to avoid local high temperature, concise process steps, The effect of improving thermal conductivity

Inactive Publication Date: 2016-12-07
SUZHOU SOLDER FORCE INC
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Not limited to the solder paste disclosed in the patents listed above, there is a disadvantage of spattering due to lack of thermal conductivity. On the one hand, it is easy to damage the quality of the product, and on the other hand, it affects the working efficiency.
[0006] In particular, as known in the industry, solder paste is usually composed of alloy solder powder and flux. In existing technologies, flux is generally prepared first, and then alloy solder powder is added to the flux and stirred evenly to form a solder paste. Solder paste is often difficult to meet the stringent requirements of laser applications in the field of electronic packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A) To prepare the intermediate, first put 2% triethylene glycol butyl ether and 2% 2-ethyl-2,6-pentanediol into a container equipped with a heater and a stirring device, Then the mass % ratio is 4.5% film forming agent KE604 and the mass % ratio is 2% succinic acid, 2% adipic acid and 0.1% glutaric acid are dropped into the container and heated and stirred, so that the KE604, succinic acid, adipic acid and glutaric acid are fully dissolved in triethylene glycol butyl ether and 2-ethyl-2,6-pentanediol, and the heating temperature of the heater is 170°C to obtain intermediate body;

[0024] B) To prepare the mixture, add flaky silver powder with a mass % ratio of 3% and a particle size of 1-10 μm, hydrogenated castor oil (HCO) with a mass % ratio of 0.5% and ethylene bis-stearin of 0.5% The acid amide (EBS) is slowly added to the intermediate obtained in step A) and placed in a constant temperature magnetic dispersion stirrer in a water bath for dispersion and stirring. ...

Embodiment 2

[0027] A) To prepare the intermediate, first put 2% triethylene glycol butyl ether, 1% 2-ethyl-2,6-pentanediol and 1% tetrahydrofurfuryl alcohol into the heater equipped with And in the container of the stirring device, the film-forming agent KE604 and the mass % ratio of 0.25% succinic acid, 0.25% adipic acid, 0.25% glutaric acid and 0.25% Cyclohexylamine hydrobromide is put into the container and heated and stirred, and described KE604, succinic acid, adipic acid, glutaric acid and cyclohexylamine hydrobromide are fully dissolved in triethylene glycol butyl ether, 2 - In ethyl-2,6-pentanediol and tetrahydrofurfuryl alcohol, the heating temperature of the heater is 190°C to obtain the intermediate;

[0028] B) To prepare the mixture, the flake silver powder with a mass % ratio of 2% and a particle size of 1-10 μm, hydrogenated castor oil (HCO) with a mass % ratio of 0.25%, and 0.25% ethylene bis-stearin The acid amide (EBS) is slowly added to the constant temperature magneti...

Embodiment 3

[0031] A) To prepare the intermediate, first put 2% triethylene glycol butyl ether and 2% tetrahydrofurfuryl alcohol into a container equipped with a heater and a stirring device, and then put 3% The film-forming agent KE604 and mass % ratio are 0.1% succinic acid, 0.1% adipic acid and 0.3% glutaric acid and put them into the container for heating and stirring, so that the KE604, succinic acid, adipic acid And glutaric acid is fully dissolved in triethylene glycol butyl ether and tetrahydrofurfuryl alcohol, and the heating temperature of the heater is 180°C to obtain the intermediate;

[0032] B) To prepare the mixture, add flaky silver powder with a mass % ratio of 4% and a particle size of 1-10 μm, hydrogenated castor oil (HCO) with a mass % ratio of 0.4%, and 0.1% ethylene bis-stearic acid Add amide (EBS) slowly to the constant temperature magnetic dispersing stirrer containing the intermediate obtained in step A) and place it in a water bath for dispersing and stirring. Th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

A method for preparing solder paste for laser reflow soldering, which belongs to the technical field of electronic packaging material preparation, comprises putting a solvent with a mass % ratio of 3-4% into a container equipped with a heater and a stirring device, and then putting the mass % ratio 3-4.5% film-forming agent and 0.5-1.5% active agent are put into a container and heated and stirred to obtain an intermediate; the mass % ratio is 2-5% silver powder and 0.5-1.5% 1% of the thixotropic agent is slowly added to the dispersing mixer containing the intermediate to disperse and stir to obtain the mixture; transfer the mixture into the stirring tank equipped with a stirrer for pre-stirring, and then mix the mass % ratio to 87- 90% of the Sn-Bi alloy solder powder is added to the stirred tank and stirred intermittently, discharged and filled to obtain the finished product. The process steps are concise; the thermal conductivity of the solder paste is improved, and the quality of electronic products is prevented from being affected by the spatter of solder paste.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic packaging materials, and in particular relates to a preparation method of solder paste for laser reflow soldering. Background technique [0002] In the field of packaging of electronic products, the welding test piece is small in size and precise in structure, requiring small solder joints, high welding strength, and narrow welding heat-affected zone. For this, traditional welding methods are often difficult or even unable to meet this requirement, while laser welding With its unique advantages, it can meet the aforementioned stringent requirements of the electronic packaging industry. [0003] Although the laser has the advantages of local heating, small heat-affected zone, non-contact heating, high welding quality, and easy automation, but using laser as a heat source, the solder paste temperature is prone to be too high, and the laser heating speed is extremely fast, so in So...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/26
CPCB23K35/40B23K35/262
Inventor 屠富强许文斌周健王肇
Owner SUZHOU SOLDER FORCE INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com