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Two-component heat conducting silicon grease capable of being prepared in a gelatinization mode under normal temperature or heating condition and preparing method thereof

A heat-conducting silicone grease and heat-conducting filler technology, applied in chemical instruments and methods, heat exchange materials, coatings, etc., can solve the problems of reduced heat conduction effect, powdery, cracks, etc.

Active Publication Date: 2016-12-14
深圳市金无曼工业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing heat-conducting silicone grease has a certain lifespan, and the base oil inside it will gradually decrease with time, and cracks will gradually appear or even become powdery, resulting in the decline or failure of its heat-conducting effect, which will further cause electronic components. Or the life of the LED lamp is shortened

Method used

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  • Two-component heat conducting silicon grease capable of being prepared in a gelatinization mode under normal temperature or heating condition and preparing method thereof
  • Two-component heat conducting silicon grease capable of being prepared in a gelatinization mode under normal temperature or heating condition and preparing method thereof
  • Two-component heat conducting silicon grease capable of being prepared in a gelatinization mode under normal temperature or heating condition and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] This embodiment provides a thermally conductive silicone grease prepared from component A and component B, wherein the weight ratio of component A to component B is 0.5:1.

[0104] The A component was prepared from the following weights of raw materials:

[0105]

[0106] The above vinyl phenyl silicone resin was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., the model is RH-SP606, and it has the following structural formula:

[0107] The above-mentioned methyl hydrogen-containing silicone oil was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., the model is RH-H503, and it has the following molecular formula: Si(CH 3 ) 3 -[OSi(H)(CH 3 )] 10 -[OSi(CH 3 ) 2 ] 30 -OSi(CH 3 ) 2 .

[0108] The above-mentioned phenyl hydrogen-containing silicone resin was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., the model is RH-SH309, and it has the following molecular formula: Si(CH 3 ) 3 -[OSi(H)(CH 3 )] 35 -[OSi(C 6 h ...

Embodiment 2

[0129] This example provides a thermally conductive silicone grease, which is prepared from component A and component B, wherein the weight ratio of component A to component B is 0.5:1, except for the base material, component A and component B The preparation raw materials of part are all with embodiment 1, and the base material in A component and B component is prepared by the raw material of following weight:

[0130]

[0131]

[0132] The above-mentioned vinyl silicone oil was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., the model is RH-Vi322, and it has the following molecular formula:

[0133] CH 2 =CHSiO(CH 3 ) 2 -[SiO(CH 3 ) 2 )] 60 -[SiO(CH 3 )(CH=CH 2 )] 40 -Si(CH 3 ) 2 CH=CH 2 .

[0134] The above-mentioned methyl silicone oil was purchased from Jiangxi Xinghuo Organic Silicon Co., Ltd., with a viscosity of 100cs and the following molecular formula: (CH 3 ) 3 SiO-[SiO(CH 3 ) 2 ] 50 -Si(CH 3 ) 3 .

[0135] The above-mentione...

Embodiment 3

[0141] This embodiment provides a thermally conductive silicone grease, which is prepared from component A and component B, wherein the weight ratio of component A to component B is 0.5:1, except for the base material, the component B Preparation of raw materials is the same as in Example 1.

[0142] The A component was prepared from the following weights of raw materials:

[0143]

[0144] The above vinyl phenyl silicone resin was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., the model is RH-SP606, and it has the following structural formula:

[0145] The above-mentioned methyl hydrogen-containing silicone oil was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., the model is RH-H503, and it has the following molecular formula: Si(CH 3 ) 3 -[OSi(H)(CH 3 )] 10 -[OSi(CH 3 ) 2 ] 30 -OSi(CH 3 ) 2 .

[0146] The above-mentioned phenyl hydrogen-containing silicone resin was purchased from Zhejiang Runhe Silicone New Material Co., Ltd., t...

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Abstract

The invention provides heat conducting silicon grease comprising a component A and a component B. The component A is prepared from binder, vinyl phenyl silicon resin, methyl hydrogen silicon oil, phenyl hydrogen silicon resin and inhibitor; the component B is prepared from binder, vinyl phenyl silicon resin and a catalyst; the binder is prepared from vinyl silicon oil, methyl silicon oil, heat conducting filler, gas-phase white carbon black and a silane coupling agent. The heat conducting silicon grease is high in lubricity, compressibility and adhesivity, wide in heat resisting range and high in heat conducting performance and capable of effectively reducing contact thermal resistance of the contact interface and being applied to an electronic / communication product with high requirement for heat dissipation. Vinyl groups in the preparing raw materials of the heat conducing silicon grease and hydrogen groups crosslink to a certain degree, the structure can improve the heat conducting capacity, and the heat conducting effect is durable and stable. The heat conducting silicon grease can be prepared at the normal temperature, and the preparing method is simple, easy to operate, capable of being mixed manually or mechanically and suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat-conducting silicone grease and a preparation method thereof. Background technique [0002] With the continuous advancement of miniaturization and ultra-thinning of equipment in the electronic industry, the shrinking structure and design space limit the application of large heat dissipation components, so the requirements for thermal conductivity materials are also increasing. At present, thermal interface materials are composed of thermal grease, thermal pad, thermal adhesive, thermal phase change paste, graphite sheet and so on. Among them, the heat-conducting silicone grease is widely used due to its advantages of convenient implementation, good heat-conducting effect, and compressibility. However, the existing heat-conducting silicone grease has a certain lifespan, and the base oil inside it will gradually decrease with time, and cracks will gradually...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/04C08L83/05C08K13/02C08K13/04C08K7/18C08K7/00C08K7/04C08K3/22C08K3/36C08K5/5425C08K3/28C08K5/5419C08K3/04C08J3/24C09D183/07C09D183/04C09D7/12C09K5/08
Inventor 陈博捷时镜镜
Owner 深圳市金无曼工业新材料有限公司
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