Non-contact heating tin-lead soldering method for metallic structural part and PCB (Printed Circuit Board)

A metal structure, non-contact technology, used in metal processing equipment, welding equipment, electric heating devices, etc., can solve the problem of inability to solve the heat absorption effect of metal structures, improve welding efficiency, fully infiltrate, and ensure welding quality. Effect

Active Publication Date: 2016-12-21
COMBA TELECOM TECH (GUANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The industry has also made some attempts, that is, using a three-dimensional manipulator to drive a soldering iron for positioning welding, which can solve the quantitative control of tin feeding and welding time to a certain extent, but it still cannot solve the heat absorption effect of metal structural parts in principle. Resulting Solder Joint Reliability Issues

Method used

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  • Non-contact heating tin-lead soldering method for metallic structural part and PCB (Printed Circuit Board)
  • Non-contact heating tin-lead soldering method for metallic structural part and PCB (Printed Circuit Board)

Examples

Experimental program
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Effect test

Embodiment 1

[0029] The preset workpiece step specifically includes:

[0030] Take out the metal structural parts from the turnover box and put them on the turnover fixture with the function of limiting and positioning, so that the metal structural parts can be placed according to the predetermined position.

[0031] Carry out plug-in gap assembly between the PCB and the metal structure; ensure that after the assembly is in place, a platform-like support is used around the PCB to smoothly fix the PCB on the metal structure. This kind of support adopts a multi-array overall structure fixing method, which can ensure the assembled state of each PCB and metal structural parts, and provide effective and reliable fixation in multiple directions to ensure the consistency of the welding effect. The support has the characteristics of high temperature resistance, which prevents the supporting failure during the overall heating process due to the thermal expansion and contraction effect of the object...

Embodiment 2

[0041] Such as figure 2 As shown, the soldering method of the first embodiment is similar to that of the first embodiment, the difference lies in the preset process of the workpiece. Specifically reflected in:

[0042] In this embodiment, the PCB is first taken out from the turnover box, and the corresponding front and back sides are separated. Then put the side of the PCB that needs to be soldered into the turnover fixture with pre-positioning function. At the same time, corresponding overall positioning of all PCB boards is carried out through the die tooling. The overall pre-positioned structural tooling of the die tooling can ensure the effective and reliable fixation of multiple PCBs, and at the same time ensure that the mutual position between the PCBs does not exceed ±0.1mm to ensure the consistency of the welding effect. The mold tooling with pre-positioning function has high temperature resistance, which prevents the deformation of the positioned PCB due to the th...

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PUM

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Abstract

The invention provides a non-contact heating tin-lead soldering method for a metallic structural part and a PCB (Printed Circuit Board). The non-contact heating tin-lead soldering method comprises the following steps: putting a workpiece on a drive system, and conveying the workpiece to a heating system through the drive system, wherein the workpiece is a combination body consisting of the metallic structural part, the PCB, soldering flux and a turnover fixture; performing non-contact thermal radiation overall heating on the workpiece to melt the soldering flux on the workpiece; cooling the workpiece after heating soldering to enable the molten soldering flux to be solidified into a required soldering point rapidly. By fixing a soldering device, adding the soldering flux and splitting heating soldering, and different processes are set up, and all the processes are helped to be automated through elaborate division of work, and therefore, modularized management is realized; non-contact heating is performed on the workpiece in the heating system of the overall heating soldering device, and the soldering flux fully absorbs heat to melt, wet and flow at the soldering point, and is rapidly cooled in a cooling system to form the required soldering point, so that soldering efficiency is increased, and soldering quality is ensured.

Description

technical field [0001] The invention relates to the field of processing technology, in particular to welding-related technologies in the field of communication technology, and in particular to a non-contact integral heating tin brazing method for metal structural parts and PCBs. Background technique [0002] The base station antenna is a key component of mobile communication network coverage. The base station antenna is composed of the main feeder and many terminal components. The metal structure and PCB components are the middle bridge between the main feeder and the terminal components. The metal structure The connection to the PCB is typically soldered. The combination of PCB and metal structural parts belongs to the grounding effect, and the grounding effect is a very important indicator in the communication industry. Grounding technology is an important technology that must be adopted when any electronic and electrical equipment or system works normally. It is not only...

Claims

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Application Information

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IPC IPC(8): B23K1/005B23K3/04B23K3/08B23K101/42
CPCB23K1/005B23K3/04B23K3/085B23K1/00B23K1/008
Inventor 吕晓胜郭林波王文长孙善球刘海滨朱龙翔岳德周
Owner COMBA TELECOM TECH (GUANGZHOU) CO LTD
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