9results about How to "Avoid cooling effect" patented technology

This invention discloses a method for purifying metallic selenium through continuous multi-stage vacuum distillation: S1: Crude selenium powder is placed in a graphite crucible, the temperature of the crucible heater is set to 350-500℃, the temperature of the temperature-controlled heater is set to 250-350℃, and the vacuum degree of the distillation apparatus is controlled to 0.1-10 Pa for first-stage vacuum distillation; S2: The temperature of the crucible heater is set to 200-300℃, the temperature of the temperature-controlled heater is set to 600-900℃, and the vacuum degree of the distillation apparatus is controlled to 0.1-10 Pa for second-stage vacuum distillation. This invention, by selecting and controlling the temperatures of the crucible heater and the temperature-controlled heater during the purification process, enables continuous multi-stage vacuum distillation to purify metallic selenium. This avoids the need for multiple heating and cooling cycles and multiple material handling processes required in traditional methods, reducing energy consumption and pollution caused during handling. The process steps are simple, and the overall process time is significantly shortened.

This application discloses a liquid level control device and a liquid cooling cabinet for automatically adjusting the liquid level inside the liquid cooling cabinet to prevent the liquid level from being too high or too low. The liquid level control device is applied to a liquid cooling cabinet, which includes a cabinet body, a first inlet pipe connected to a liquid supply pipe, and a first outlet pipe connected to a return pipe. The device includes: a liquid level monitoring device installed inside the cabinet body, a control valve installed on at least one of the first inlet pipe and the first outlet pipe, and a controller. The controller is used to acquire liquid level detection data from the liquid level monitoring device and adjust the opening of the control valve according to the liquid level detection data.

The application discloses an air conditioner control method and device, an air conditioner and a readable storage medium, comprising: obtaining a target working condition temperature, a historical frequency modulation temperature difference corresponding to the target working condition temperature, and a candidate frequency modulation temperature difference corresponding to the target working condition temperature; performing phased frequency adjustment based on the candidate frequency modulation temperature difference and the target working condition temperature, and counting to obtain target power consumed by the phased frequency adjustment; selecting a target frequency modulation temperature difference from the candidate frequency modulation temperature difference and the historical frequency modulation temperature difference according to target power corresponding to the candidate frequency modulation temperature difference and historical power corresponding to the historical frequency modulation temperature difference; and setting the target frequency modulation temperature difference as a frequency modulation temperature difference used for phased frequency adjustment when the air conditioner is started and operated at the target working condition temperature. The method can reduce energy consumption of the air conditioner, and can avoid excessive cooling and excessive dehumidification caused by excessively high compressor operating frequency.

This invention relates to the field of intelligent cockpit and vehicle thermal management technology, specifically to a multi-sensor fusion in-vehicle adaptive temperature control method and system. The method includes: synchronously acquiring multi-source heterogeneous signals within the vehicle; preprocessing them through filtering and format standardization; using Kalman filtering to perform time synchronization and state estimation, generating a fused feature vector; identifying the current operating condition label, calculating the predicted average voting value, and outputting the target predicted average voting value; calculating the basic control quantity through a feedback controller and the disturbance compensation control quantity through a feedforward controller, and adding them to obtain the total control quantity; decomposing the total control quantity into compressor speed commands, fan airflow commands, damper position commands, and expansion valve opening commands, driving actuator actions, and outputting the temperature control execution result. This invention solves the problems of air conditioning control lag, large temperature fluctuations, and unintelligent mode switching, achieving high-precision temperature control and seamless adaptive adjustment, significantly improving driving and passenger thermal comfort.

This invention discloses a heat dissipation control method and device based on the synergistic coupling of piezoelectric jet and thermoelectric cooling. The heat dissipation control method includes: controlling a piezoelectric ceramic driving plate to drive an intake flexible valve plate to generate periodic bending deformation, thereby changing the volume of the compression chamber, so that the compression chamber alternately performs the intake process and the compression process; during the compression process, when the pressure difference between the compression chamber and the external environment pressure reaches the opening threshold determined by the pre-tightening force and effective pressure area of ​​the outlet flexible valve plate, the outlet flexible valve plate passively generates an opening deformation, so that the cooling fluid in the compression chamber is injected into the air inlet of the heat exchange module in the form of a jet through the air outlet; the heat from the heat source is absorbed by the cold end of the thermoelectric cooling module, and the heat is transferred to the hot end of the thermoelectric cooling module, and then transferred to the heat exchange module, and carried away by the cooling fluid injected from the air inlet of the heat exchange module, fundamentally avoiding the risk of fatigue failure of traditional mechanical valve plates.

This invention discloses an integrated digital PCR system and its usage method. The system comprises a high-density microcavity array digital PCR chip with an integrated cavity, an optical detection module, a hot water circulation temperature control module, a fluid control module, and a central control module. When applied to nucleic acid sample detection, the digital PCR chip is first fixed on the stage of the optical detection module, and connecting tubes for the sample tubes and hot water tank are installed at each chip interface. Then, the central control module is activated, and relevant parameters of the control program are set. The control program then controls the fluid control module, hot water circulation temperature control module, and optical detection module to sequentially perform operations such as sample filling, sample discretization, hot water circulation amplification, chip scanning and recording, and data analysis. Based on the combination of the microcavity array and integrated cavity structure of the digital PCR chip, this system allows the entire digital PCR detection process to be completed on a single instrument, improving detection efficiency and result reliability.

This invention relates to the field of temperature-controlled clothing technology, solving the problem in existing technologies where the lack of an effective linkage control mechanism between thermoelectric elements and cooling fans affects the overall cooling effect. It provides a protective suit with temperature regulation function and its temperature control method. The protective suit includes: a garment body comprising an inner layer facing the body and an outer layer away from the body; a semiconductor refrigeration component disposed on the garment body; a power module electrically connected to and supplying power to the semiconductor refrigeration component; a cooling fan disposed on the outer layer of the garment body and electrically connected to the power module; and a control module for controlling the start / stop and power adjustment of the semiconductor refrigeration component and the cooling fan to achieve an adjustable cooling effect on the body.

This invention discloses an elevator control method based on duty cycle, comprising the following steps: the elevator initiates random operation according to a set number of runs and a duty cycle; after the elevator completes one running cycle, the actual duty cycle of the elevator is calculated and compared with a set value. If the actual duty cycle is not greater than the set value, the next running cycle is directly initiated; if the actual duty cycle is greater than the set value, the elevator's delay time is calculated and the elevator is controlled to standby for the specified delay time before the next running cycle is initiated. After completing the set number of running cycles according to the above steps, the random operation ends. This invention can adjust the duty cycle of the elevator during random operation, thereby improving the testing effect of the elevator and preventing abnormal wear and tear.

This invention discloses a solder resist baking device and method for printed circuit boards (PCBs), relating to the technical field of PCB manufacturing. The solder resist baking device includes a housing, a carrier, a feeding device, and a transmission device. The housing has a baking channel and a cooling channel. The transmission device includes a first rack and a linkage mechanism. The linkage mechanism includes a first rotating shaft and a first gear. A first bevel gear is mounted on the first rotating shaft, and a second bevel gear is mounted on the rotating shaft of the rotating frame. The first and second bevel gears mesh, and the first rack meshes with the first gear. This solder resist baking device allows the PCB to be transferred to the cooling channel to cool to room temperature after baking in the baking channel. This ensures that baking and cooling operations do not interfere with each other, avoiding frequent heating and cooling, improving baking efficiency, and ensuring uniform heating of the PCB. Furthermore, it eliminates the need for additional external space for cooling the PCB, saving space resources.