Gas heat power system based on semiconductor condensation
A power system and semiconductor technology, applied in the direction of machines/engines, steam engine devices, mechanical equipment, etc., can solve the problems of large waste of heat energy, small external waste heat absorption rate, unstable gasification temperature of working fluid, etc., and achieve stable gasification temperature and working medium flow rate, improve gasification efficiency and condensation efficiency, and avoid the effect of unstable turbine speed
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Embodiment 1
[0081] Embodiment one (such as figure 1 Shown): a gas thermal energy power system based on semiconductor condensation, including a heat collector 1, a gasification device 2, a turbine 3, a gas heating furnace 4, a condensing device 5, a circulation pipeline 6, a circulation medium 7 and a one-way The hydraulic pump 9, the gasification device 2, the turbine 3, the condensing device 5 and the one-way hydraulic pump 9 realize circulation communication through the circulation pipeline 6 in sequence. External, used for gasification heating of the working fluid in the gasification device 2;
[0082] (Such as figure 2 As shown), the gas heating furnace 4 includes a gas inlet 41, an air inlet 42, a mixed gas combustion chamber 43 and an igniter 44, the hot gas outlet of the mixed gas combustion chamber 43 is connected to the heat collector 1, and the gas inlet 41 and the air inlet 42 are both A flow rate regulator 45 is provided;
[0083] (Such as image 3 As shown), the condensi...
Embodiment 2
[0093] Embodiment two (such as Figure 6 Shown): The difference from Embodiment 1 is that the heat collecting device 1 includes an upper cover 11 and a lower cover 12, a heating port 13 is provided in the middle of the lower cover 12, and the upper cover 11 and the lower cover 12 are respectively located on the upper and lower sides. Between 11 and the lower cover 12 is a heat collecting chamber 14, two layers of upper cover protruding rings 111 are distributed on the lower part of the upper cover 11 of the heat collecting device 1, and two layers of lower cover protruding rings 121 are distributed on the upper part of the lower cover 12 of the heat collecting device 1, The protruding ring 111 of the upper cover and the protruding ring 121 of the lower cover are staggered.
[0094] By conducting experiments on the gas thermal power system based on semiconductor condensation in the above-mentioned embodiment 2, gas is introduced into the gas heating furnace 4, and the combusti...
Embodiment 3
[0095] Embodiment three (such as Figure 7 Shown): The difference from Embodiment 1 is that the lower part of the upper cover 11 of the heat collecting device 1 is provided with a three-layer upper cover protruding ring 111, and the upper part of the lower cover 12 of the heat collecting device 1 is distributed with a three-layer lower cover protruding ring 121 , the upper cover protruding ring 111 and the lower cover protruding ring 121 are staggered.
[0096] By conducting experiments on the gas thermal power system based on semiconductor condensation in the above-mentioned embodiment three, gas is introduced into the gas heating furnace 4, and the combustion temperatures in the gas heating furnace 4 are respectively 120°C, 150°C, 200°C, and 250°C. °C, 300 °C, 400 °C, the flow rate of the working medium in the circulation pipe is adjusted according to the operation stability of the gas thermal power system based on semiconductor condensation; the experimental results are: t...
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