Gas heat power system based on semiconductor condensation

A power system and semiconductor technology, applied in the direction of machines/engines, steam engine devices, mechanical equipment, etc., can solve the problems of large waste of heat energy, small external waste heat absorption rate, unstable gasification temperature of working fluid, etc., and achieve stable gasification temperature and working medium flow rate, improve gasification efficiency and condensation efficiency, and avoid the effect of unstable turbine speed

Inactive Publication Date: 2016-12-21
郭远军
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the common problems of existing thermal power generation equipment are: a. The temperature requirements for high-temperature heat sources are high, generally above 200°C, and the thermal energy conversion efficiency is low, and the thermal energy conversion efficiency is generally 15% to 35%; b. The heat displacement of the condensing device is large, and the waste of heat energy is large. The condensation speed through the natural condensation method is slow, and the active condensation method (fan air cooling or liquid pump water cooling) requires additional power consumption; c. The turbine is prone to leakage of working fluid Problems; d. Turbine speed is unstable, and it is prone to stuck problems; e. The heat collection effect of the heat collector is not good, and the external waste heat absorption rate is small; f. The gasification temperature of the working medium is unstable, and the condensation effect of the working medium is not good , the working medium is easy to deteriorate or appear impurities; g. The existing equipment is relatively large

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Gas heat power system based on semiconductor condensation
  • Gas heat power system based on semiconductor condensation
  • Gas heat power system based on semiconductor condensation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] Embodiment one (such as figure 1 Shown): a gas thermal energy power system based on semiconductor condensation, including a heat collector 1, a gasification device 2, a turbine 3, a gas heating furnace 4, a condensing device 5, a circulation pipeline 6, a circulation medium 7 and a one-way The hydraulic pump 9, the gasification device 2, the turbine 3, the condensing device 5 and the one-way hydraulic pump 9 realize circulation communication through the circulation pipeline 6 in sequence. External, used for gasification heating of the working fluid in the gasification device 2;

[0082] (Such as figure 2 As shown), the gas heating furnace 4 includes a gas inlet 41, an air inlet 42, a mixed gas combustion chamber 43 and an igniter 44, the hot gas outlet of the mixed gas combustion chamber 43 is connected to the heat collector 1, and the gas inlet 41 and the air inlet 42 are both A flow rate regulator 45 is provided;

[0083] (Such as image 3 As shown), the condensi...

Embodiment 2

[0093] Embodiment two (such as Figure 6 Shown): The difference from Embodiment 1 is that the heat collecting device 1 includes an upper cover 11 and a lower cover 12, a heating port 13 is provided in the middle of the lower cover 12, and the upper cover 11 and the lower cover 12 are respectively located on the upper and lower sides. Between 11 and the lower cover 12 is a heat collecting chamber 14, two layers of upper cover protruding rings 111 are distributed on the lower part of the upper cover 11 of the heat collecting device 1, and two layers of lower cover protruding rings 121 are distributed on the upper part of the lower cover 12 of the heat collecting device 1, The protruding ring 111 of the upper cover and the protruding ring 121 of the lower cover are staggered.

[0094] By conducting experiments on the gas thermal power system based on semiconductor condensation in the above-mentioned embodiment 2, gas is introduced into the gas heating furnace 4, and the combusti...

Embodiment 3

[0095] Embodiment three (such as Figure 7 Shown): The difference from Embodiment 1 is that the lower part of the upper cover 11 of the heat collecting device 1 is provided with a three-layer upper cover protruding ring 111, and the upper part of the lower cover 12 of the heat collecting device 1 is distributed with a three-layer lower cover protruding ring 121 , the upper cover protruding ring 111 and the lower cover protruding ring 121 are staggered.

[0096] By conducting experiments on the gas thermal power system based on semiconductor condensation in the above-mentioned embodiment three, gas is introduced into the gas heating furnace 4, and the combustion temperatures in the gas heating furnace 4 are respectively 120°C, 150°C, 200°C, and 250°C. °C, 300 °C, 400 °C, the flow rate of the working medium in the circulation pipe is adjusted according to the operation stability of the gas thermal power system based on semiconductor condensation; the experimental results are: t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a gas heat power system based on semiconductor condensation. The gas heat power system comprises a gasification device, a turbomachine, a condensation device and a one-way hydraulic pump that are circularly communicated in sequence via a circulating pipeline, wherein the circulating pipeline contains cycle fluid; a heat collection device is mounted outside the gasification device and communicated with a gas heat supply furnace; the gas heat supply furnace comprises a gas inlet, an air inlet, a gas-mixing burning cavity and an igniter; the condensation device comprises a condensation pipe and a heat dissipation fan; and the condensation pipe is manufactured from a temperature difference power generation sheet. The gas heat power system based on the semiconductor condensation has a relatively high condensation rate, can reduce condensation energy discharge, improves heat energy conversion efficiency, runs stably and is adjustable in power.

Description

technical field [0001] The invention belongs to the field of energy utilization equipment, in particular to a gas thermal energy power system based on semiconductor condensation. Background technique [0002] Energy is an important material basis for the survival and development of human society. Throughout the history of the development of human society, every major progress of human civilization is accompanied by the improvement and replacement of energy. The development and utilization of energy has greatly promoted the development of the world economy and human society. [0003] However, with the continuous development and consumption of energy, non-renewable energy sources such as petroleum, coal mines, and natural gas are gradually reduced, and energy conservation and recycling are gradually being valued. The basic content of my country's current energy strategy is: adhere to the priority of conservation, based on domestic, diversified development, rely on science an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F01K11/02F01K27/02
CPCF01K11/02F01K27/02
Inventor 郭远军
Owner 郭远军
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap