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Preparation method of ordered metal nano/micro ring

A metal ring, metal technology, applied in nanotechnology, metal material coating process, ion implantation plating and other directions, can solve the problems of disordered distribution of products and the inability to artificially control the geometric parameters of nanorings, and achieve the scientific preparation method. Effect

Active Publication Date: 2018-02-06
YUHUAN ZHONGKE APPL TECH ACCOMPLISHMENT CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this preparation method has the advantages of simple process and low cost, the products obtained are in a disordered distribution state, and the geometric parameters of the nanorings cannot be controlled artificially.

Method used

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  • Preparation method of ordered metal nano/micro ring
  • Preparation method of ordered metal nano/micro ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The concrete steps of preparation are:

[0028] Step 1, first use magnetron sputtering (or electroplating or thermal evaporation) technology to deposit a metal film on the substrate; wherein, the substrate is a highly doped silicon substrate, and the metal film is an aluminum film (or iron film, or gold film) with a thickness of 1nm , or silver film, or nickel film, or titanium film). After using argon plasma to clean the substrate covered with the metal film for 1 min, arrange the colloidal balls in a single layer on the metal film and then heat the substrate; wherein, the colloidal balls are polystyrene colloidal balls with a diameter of 100nm, and the temperature when heating the substrate 110° C. for 8 s to obtain a substrate covered with a metal thin film and colloidal balls adhered to the film.

[0029] Step 2, first use oxygen plasma to etch the colloidal spheres for 1 s to obtain a substrate covered with a metal thin film and loosely arranged colloidal spheres ...

Embodiment 2

[0032] The concrete steps of preparation are:

[0033] Step 1, first use magnetron sputtering (or electroplating or thermal evaporation) technology to deposit a metal film on the substrate; wherein, the substrate is a highly doped silicon substrate, and the metal film is an aluminum film (or iron film, or gold film) with a thickness of 25nm , or silver film, or nickel film, or titanium film). After using argon plasma to clean the substrate covered with the metal film for 1.5 min, arrange the colloidal balls in a single layer on the metal film and then heat the substrate; wherein, the colloidal balls are polystyrene colloidal balls with a ball diameter of 500nm, and the heating time of the substrate is The temperature is 115° C. and the time is 7.5 s to obtain a substrate covered with a metal thin film and colloidal balls adhered to the film.

[0034] Step 2, first use oxygen plasma to etch the colloidal spheres for 15s to obtain a substrate covered with a metal thin film and ...

Embodiment 3

[0037] The concrete steps of preparation are:

[0038] Step 1, first use magnetron sputtering (or electroplating or thermal evaporation) technology to deposit a metal film on the substrate; wherein, the substrate is a highly doped silicon substrate, and the metal film is an aluminum film (or iron film, or gold film) with a thickness of 50nm , or silver film, or nickel film, or titanium film). Then use argon plasma to clean the substrate covered with the metal film for 2 minutes, arrange the colloidal balls in a single layer on the metal film and then heat the substrate; wherein, the colloidal balls are polystyrene colloidal balls with a diameter of 50 μm, and the temperature when heating the substrate at 120°C for 7s to obtain a substrate covered with a metal thin film and colloidal balls adhered to the film.

[0039] Step 2, first use oxygen plasma to etch the colloidal spheres for 30 seconds to obtain a substrate covered with a metal thin film and loosely arranged colloidal...

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Abstract

The invention discloses a preparing method for orderly metal nano / micron rings. The electroplating or magnetron sputtering or thermal evaporation technology is used firstly for depositing a metal film on a substrate, then after colloidal spheres are densely arranged on the metal film in a single-layer manner, the substrate is heated, and the substrate covered with the metal film to which the colloidal spheres are attached is obtained; then, oxygen plasma is used for etching the colloidal spheres, the substrate covered with the metal film to which the loose colloidal spheres arranged in order are attached is placed at the position of a target in a magnetron sputtering instrument, argon sputtering is used for the substrate, and a substrate with a metal ring with the upper portion connected with bowl-shaped metal is obtained; then the substrate is subjected to ultrasonic treatment for at least 3 min in ethyl alcohol, and the orderly metal nano / micron rings arranged in order on the substrate in a hexagonal manner are prepared, wherein the ring inner diameter of the orderly metal nano / micron rings ranges from 50 nm to 50 microns, the ring height is smaller than or equal to 100 nm, and the ring cycle ranges from 100 nm to 100 microns. The preparing method is extremely easily and widely applied to the fields such as photovoltaic and biological sensor and orderly nano material manufacturing and cell migration and adhering.

Description

technical field [0001] The invention relates to a preparation method of a nano / micro ring, in particular to a preparation method of an ordered metal nano / micro ring. Background technique [0002] In recent years, the study of ordered metallic nano / microrings has attracted extensive attention due to their great application prospects in photovoltaics, biosensors, fabrication of ordered nanomaterials, cell migration, and adhesion. At present, people have made unremitting efforts to obtain metal nano / micro rings, such as a method for preparing silver nano rings published on September 12, 2012 in Chinese invention patent application CN 102658373 A. The method adopts a high-temperature stirring and heating method, uses ethylene glycol as a solvent and a reducing agent, and polyvinylpyrrolidone as a surface protection agent, and the reaction product is cleaned by centrifugation to obtain a solution containing silver nano-rings. Although this preparation method has the advantages o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/00C23C14/02C23C14/35C23C14/14B82Y40/00
CPCB22F9/00B82Y40/00C23C14/022C23C14/14C23C14/35
Inventor 李新化史同飞张晖李劲松李建龙陆今朝
Owner YUHUAN ZHONGKE APPL TECH ACCOMPLISHMENT CENT