Preparation method of ordered metal nano/micro ring
A metal ring, metal technology, applied in nanotechnology, metal material coating process, ion implantation plating and other directions, can solve the problems of disordered distribution of products and the inability to artificially control the geometric parameters of nanorings, and achieve the scientific preparation method. Effect
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Embodiment 1
[0027] The concrete steps of preparation are:
[0028] Step 1, first use magnetron sputtering (or electroplating or thermal evaporation) technology to deposit a metal film on the substrate; wherein, the substrate is a highly doped silicon substrate, and the metal film is an aluminum film (or iron film, or gold film) with a thickness of 1nm , or silver film, or nickel film, or titanium film). After using argon plasma to clean the substrate covered with the metal film for 1 min, arrange the colloidal balls in a single layer on the metal film and then heat the substrate; wherein, the colloidal balls are polystyrene colloidal balls with a diameter of 100nm, and the temperature when heating the substrate 110° C. for 8 s to obtain a substrate covered with a metal thin film and colloidal balls adhered to the film.
[0029] Step 2, first use oxygen plasma to etch the colloidal spheres for 1 s to obtain a substrate covered with a metal thin film and loosely arranged colloidal spheres ...
Embodiment 2
[0032] The concrete steps of preparation are:
[0033] Step 1, first use magnetron sputtering (or electroplating or thermal evaporation) technology to deposit a metal film on the substrate; wherein, the substrate is a highly doped silicon substrate, and the metal film is an aluminum film (or iron film, or gold film) with a thickness of 25nm , or silver film, or nickel film, or titanium film). After using argon plasma to clean the substrate covered with the metal film for 1.5 min, arrange the colloidal balls in a single layer on the metal film and then heat the substrate; wherein, the colloidal balls are polystyrene colloidal balls with a ball diameter of 500nm, and the heating time of the substrate is The temperature is 115° C. and the time is 7.5 s to obtain a substrate covered with a metal thin film and colloidal balls adhered to the film.
[0034] Step 2, first use oxygen plasma to etch the colloidal spheres for 15s to obtain a substrate covered with a metal thin film and ...
Embodiment 3
[0037] The concrete steps of preparation are:
[0038] Step 1, first use magnetron sputtering (or electroplating or thermal evaporation) technology to deposit a metal film on the substrate; wherein, the substrate is a highly doped silicon substrate, and the metal film is an aluminum film (or iron film, or gold film) with a thickness of 50nm , or silver film, or nickel film, or titanium film). Then use argon plasma to clean the substrate covered with the metal film for 2 minutes, arrange the colloidal balls in a single layer on the metal film and then heat the substrate; wherein, the colloidal balls are polystyrene colloidal balls with a diameter of 50 μm, and the temperature when heating the substrate at 120°C for 7s to obtain a substrate covered with a metal thin film and colloidal balls adhered to the film.
[0039] Step 2, first use oxygen plasma to etch the colloidal spheres for 30 seconds to obtain a substrate covered with a metal thin film and loosely arranged colloidal...
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