Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Modified phenol formaldehyde resin, backing plate and preparation method thereof

A phenolic resin and modification technology, which is applied in chemical instruments and methods, synthetic resin layered products, and other household appliances, can solve the problems of inability to drill holes with small apertures, large holes, and low drilling accuracy. Solve the high rate of broken needles in drilling, improve production efficiency, and improve the effect of hardness

Active Publication Date: 2017-01-04
HUNAN LIUXIN ELECTRONICS NEW MATERIAL
View PDF12 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a modified phenolic resin, a backing plate and a preparation method thereof, aiming at solving the problem of low hardness, low density, and large drilling edge of the existing backing plate for drilling. , The drilling accuracy is low, and it cannot be used for small-diameter drilling and other problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Modified phenol formaldehyde resin, backing plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] 1. Preparation of modified phenolic resin:

[0053] a. According to the formula ratio, add 28% formaldehyde and 25% phenol into the reactor for the first stirring to obtain a preliminary mixed solution. The first stirring speed is 50 r / min, and the temperature of the preliminary mixed solution during stirring is 15 ℃, during the stirring process, the pH value of the preliminary mixed solution was adjusted to 8.0 by adding 1.8% sodium hydroxide; after adjusting the pH value of the preliminary mixed solution, the air pressure was 1 kg / cm 2 The gas is used to heat up the preliminary mixed solution to 53° C. within 30 minutes;

[0054] b. Add 15% calcium lignosulfonate and 20% distilled water to the preliminary mixed solution and stir for the second time to obtain an intermediate mixed solution. The second stirring speed is 50 r / min, and the intermediate The mixed solution was heated to a temperature of 70° C. and kept for 1 hour, and then the pH value of the intermediat...

Embodiment 2

[0061] 1. Preparation of modified phenolic resin:

[0062] a. According to the formula ratio, add 30% formaldehyde and 27% phenol into the reactor for the first stirring to obtain a preliminary mixed solution. The first stirring speed is 75 r / min, and the temperature of the preliminary mixed solution during stirring is 20 ℃, during the stirring process, the pH value of the preliminary mixed solution was adjusted to 8.0 by adding 2.0% sodium hydroxide; after adjusting the pH value of the preliminary mixed solution, the air pressure was 1.2 kg / cm 2 The gas is used to heat up the preliminary mixed solution to 55°C within 30 minutes;

[0063] b. Add 17% calcium lignosulfonate and 23% distilled water to the preliminary mixed solution and stir for the second time to obtain an intermediate mixed solution. The second stirring speed is 60 r / min, and the intermediate The mixed solution was heated to a temperature of 74° C. and kept for 1.5 hours, and then the pH value of the intermed...

Embodiment 3

[0070] 1. Preparation of modified phenolic resin:

[0071] a. According to the formula ratio, add 32% formaldehyde and 29% phenol into the reactor for the first stirring to obtain a preliminary mixed solution. The first stirring speed is 100 r / min, and the temperature of the preliminary mixed solution during stirring is 25 ℃, during the stirring process, the pH value of the preliminary mixed solution was adjusted to 8.0 by adding 2.2% sodium hydroxide; after adjusting the pH value of the preliminary mixed solution, the air pressure was 1.5 kg / cm 2 The gas is used to heat up the preliminary mixed solution to 57°C within 30min;

[0072] b. Add 19% calcium lignosulfonate and 26% distilled water to the preliminary mixed solution and stir for the second time to obtain an intermediate mixed solution. The second stirring speed is 70 r / min, and the intermediate The mixed solution was heated to a temperature of 76° C. and kept for 2 hours, and then the pH value of the intermediate m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Shore hardnessaaaaaaaaaa
Shore hardnessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a modified phenol formaldehyde resin, a backing plate and a preparation method thereof. The backing plate is prepared by hot compression of paper in the modified phenol formaldehyde resin through a gum dipping process, wherein toluenesulfonic acid is added in the modified phenol formaldehyde resin, so that the colloidizing time is effectively shortened, thus increasing the production efficiency; calcium lignosulfonate added in the resin is beneficial to reducing warpage of the backing plate, and effectively improves the hardness, density, smoothness and drilling precision of the backing plate; and meanwhile, the backing plate provided by the invention can also effectively solve the problem of high needle breakage rate in IC (integrated circuit) packaging substrate drilling.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a modified phenolic resin, a pad and a preparation method thereof. Background technique [0002] Printed circuit board drilling is usually to overlap one to several double-sided or multi-layer boards and use CNC machine tools to drill through holes of various diameters in order to connect the circuits of each layer of the printed circuit board to form a circuit. During the drilling process of the CNC machine tool, a backing plate is required at the bottom of each stack of printed circuit boards to ensure that the circuit boards are drilled through without damaging the CNC machine tool table. This backing board is the backing board for drilling holes in printed circuit boards. [0003] Traditional backing boards for drilling holes in printed circuit boards are mainly made of thermosetting resin mixed with various wood fibers, such as wood fiber boards, composite boards, mela...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/28B32B27/04B32B29/00B32B29/06B32B37/10
CPCB32B29/005B32B37/10B32B2260/028B32B2260/046B32B2307/536B32B2307/54B32B2307/72B32B2309/02B32B2309/04B32B2309/12B32B2457/08C08G8/28
Inventor 贺瑜罗小阳程小波唐甲林
Owner HUNAN LIUXIN ELECTRONICS NEW MATERIAL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com