Energy-uniformly-distributed ultrasonic/megasonic cleaning device

Abstract

The invention discloses an energy-uniformly-distributed ultrasonic / megasonic cleaning device. A body is internally provided with an ultrasonic / megasonic generation mechanism and a bottom quartz component. The ultrasonic / megasonic generation mechanism is provided with a piezoelectric material. The bottom quartz component is provided with a quartz micro resonant cavity array. The quartz micro resonant cavity array extends from an opening in the lower end surface of the body; the ultrasonic / megasonic energy, the propagation direction of which is not vertical to the wafer surface direction, can be removed selectively through the quartz micro resonant cavity array; the output electrical signals of a signal source are adjusted through an ultrasonic / megasonic energy control unit according to relative position information of the body on the wafer surface collected by a real-time position feedback unit from a spray rotary motor; and after conversion through the piezoelectric material, any position of the surface of a wafer is allowed to obtain the same ultrasonic / megasonic energy within unit time, thereby realizing uniform distribution of the ultrasonic / megasonic energy in the whole wafer range.

Description

technical field [0001] The invention relates to the field of processing and cleaning equipment for semiconductor integrated circuits, and more particularly relates to an ultrasonic / megasonic cleaning device that realizes uniform and non-damaging cleaning of patterned wafers by dynamically changing the energy of ultrasonic / megasonic waves. Background technique [0002] With the rapid development of semiconductor integrated circuit manufacturing technology, the graphic feature size of integrated circuit chips has entered the deep sub-micron stage, and the feature size of key contaminants (such as particles) that cause failure or damage to ultra-fine circuits on the chip has also changed. greatly reduced. [0003] During the production and processing process of integrated circuits, semiconductor wafers usually go through multiple process steps such as film deposition, etching, and polishing. And these process steps just become the important place that the contamination produce...

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Problems solved by technology

[0009] However, the above two methods have their own problems. The method (1) has high requirements for the production of piezoelectric materials. For 300mm wafers and 450mm wafers to be adopted in the future, fan-shaped piezoelectric materials covering from the center of the wafer to the edge Multiple pieces of piezoelectric materials need to be spliced ​​together, and these piezoelectric materials need to have exactly the same natural frequency, which greatly increases the difficulty and cost of manufacturing the transducer of the cleaning device

In method (2), since the motion speed control of the spray arm is performed by the motor, fine regulation cannot be achieved, resulting in poor compensation for the difference in linear speed at different positions

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