Circuit board drilling and etching process

A circuit board and etching technology, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of short circuit scrapping and film sandwiching between lines, and achieve the effect of avoiding electrostatic interference, improving quality and ensuring stability.

Active Publication Date: 2017-01-18
惠州市永隆电路有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of prolonging the tinning time is easy to produce the film on the outer layer of the circuit, resulting in the short circuit between the lines and scrapping; and extending the time and increasing the current still cannot electroplate the tin thickness of the small hole to more than 7.6 μm

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board drilling and etching process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a circuit board drilling and etching process, comprising the following steps:

[0024] S1. After cutting the circuit board substrate, pasting the dry film for making the inner circuit pattern, and browning the inner layer;

[0025] S2. Combine three circuit boards into a stack, and place a pressure plate on the top and bottom of a stack of circuit boards. After fixing, place on a drilling machine with a drilling backing plate and a positioning hole for drilling;

[0026] S3. Immersion copper electroplating on the whole board, and transfer the outer layer pattern to the laminated plate after copper immersion electroplating, and electroplate copper and tin on the pattern;

[0027] S4. Carry out the film removal treatment for the first time on the board after graphic electroplating, and re-attach the dry film, and use the cover hole film for the exposure and development treatment of the outer circuit;

[0028] S5. Alkaline etching treatment is car...

Embodiment 2

[0036] This embodiment provides a circuit board drilling and etching process, comprising the following steps:

[0037] S1. After cutting the circuit board substrate, pasting the dry film for making the inner circuit pattern, and browning the inner layer;

[0038] S2. Combine at least three circuit boards into a stack, and place a pressure plate on the top and bottom of a stack of circuit boards. After fixing, place it on a drilling machine with a drilling backing plate and positioning holes for drilling ;

[0039] S3. Immersion copper electroplating on the whole board, and transfer the outer layer pattern to the laminated plate after copper immersion electroplating, and electroplate copper and tin on the pattern;

[0040] S4. Carry out the film removal treatment for the first time on the board after graphic electroplating, and re-attach the dry film, and use the cover hole film for the exposure and development treatment of the outer circuit;

[0041] S5. Alkaline etching tre...

Embodiment 3

[0049] This embodiment provides a circuit board drilling and etching process, comprising the following steps:

[0050] S1. After cutting the circuit board substrate, pasting the dry film for making the inner circuit pattern, and browning the inner layer;

[0051] S2. Combine at least three circuit boards into a stack, and place a pressure plate on the top and bottom of a stack of circuit boards. After fixing, place it on a drilling machine with a drilling backing plate and positioning holes for drilling ;

[0052] S3. Immersion copper electroplating on the whole board, and transfer the outer layer pattern to the laminated plate after copper immersion electroplating, and electroplate copper and tin on the pattern;

[0053] S4. Carry out the film removal treatment for the first time on the board after graphic electroplating, and re-attach the dry film, and use the cover hole film for the exposure and development treatment of the outer circuit;

[0054] S5. Alkaline etching tre...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a circuit board drilling and etching process. An optimized circuit board is used to etch a former time drilling and etching process, after the selection of a drill in each time, drill holes which need to be the processed by the drill are all completed, and the replacement of the drill to carry out the second time of drilling is not needed. The heat conduction effect of a pressing plate is good, the heat radiation is good, the insulation performance is good, the electrostatic interference during the processing can be effectively avoided, the stability in the processing can be ensured, and the quality of a produced product is improved further.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a drilling and etching process for a circuit board with a high aspect ratio. Background technique [0002] In the past ten years, my country's printed circuit board manufacturing industry has developed rapidly, and its total output value and total output both rank first in the world. Due to the ever-changing electronic products, the price war has changed the structure of the supply chain. my country has both industrial distribution, cost and market advantages, and has become the most important production base of printed circuit boards in the world. However, open and short circuits of PCB lines are problems encountered by PCB manufacturers almost every day, and have always troubled production and quality management personnel. It causes refilling due to insufficient shipments, delivery delays, and customer complaints. It is a difficult problem for in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/143H05K2203/1461
Inventor 叶钢华吴永强肖长林吴亮
Owner 惠州市永隆电路有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap