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Method and system for joining semiconductor substrates

A technology of substrates and connectors, applied in the field of infrared cameras, can solve the problems of affecting the yield of detectors, negative unevenness of bumps, etc.

Inactive Publication Date: 2020-10-16
FLIR SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

A potential disadvantage of these conventional methods is that, if care is not taken, indium bump uniformity control (e.g., post-lift uniformity) can vary depending on indium bump height, indium bump base width, photoresist geometry and / or pattern loading effect (i.e. pattern loading effect in electroplating process)
In these approaches, bump non-uniformity can negatively impact detector yield more and more, if not careful, as detector pitches get smaller and smaller

Method used

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  • Method and system for joining semiconductor substrates
  • Method and system for joining semiconductor substrates
  • Method and system for joining semiconductor substrates

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Embodiment Construction

[0029] In accordance with one or more embodiments, systems and methods for providing semiconductor devices with improved bump contacts are disclosed herein. For example, the bump contacts may be formed on one or more semiconductor substrates in a wafer-level etch-back process. For example, the bump contacts may be formed from indium or other materials understood by those skilled in the art. In one embodiment, such an array of indium bumps can be used to mechanically and / or electrically couple an infrared detector to a readout integrated circuit in an infrared detector device. The infrared detector arrangement may be included in an electronic device or other imaging system.

[0030] now refer to figure 1 , a block diagram illustrating a system 100 for capturing and processing images (eg, an infrared camera) according to one or more embodiments. In one implementation, the system 100 can include a processing component 110 , a storage component 120 , an image capture component ...

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Abstract

Systems and methods for coupling semiconductor devices together may be provided. One or more semiconductor devices may be provided with an array of bump contacts formed in an etch-back process. The bump contacts may be indium bumps. The indium bumps can be formed by depositing a thin sheet of indium on the surface of the device substrate, depositing and patterning a photoresist layer over the indium layer, and selectively etching the indium layer into the surface of the substrate using the patterned photoresist layer. The substrate may be an infrared detector substrate. The infrared detector substrate can be coupled to the readout integrated circuit substrate using bumps.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of and priority to U.S. Provisional Patent Application No. 61 / 976,357, filed April 7, 2014, entitled "METHODS AND SYSTEMS FOR COUPLING SEMICONDUCTOR SUBSTRATES," which is hereby incorporated by reference in its entirety. technical field [0003] One or more embodiments of the invention relate generally to infrared cameras, and more particularly, to bump connectors for infrared cameras. Background technique [0004] During the manufacture of certain types of semiconductor devices, it may be desirable to couple or couple one semiconductor device to another. Coupled semiconductor devices are coupled to physically connect the devices to each other and to provide substantial electrical interconnection between the coupled semiconductor devices (eg, to allow signals to be electrically conducted between the semiconductor devices). [0005] For example, infrared components may use this type ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/027H01L21/3213H01L27/146
CPCH01L21/0272H01L21/32136H01L27/14634H01L27/14636H01L27/1465H01L27/14689H01L27/1469H01L2224/11622H01L24/11H01L24/13H01L2224/1147H01L2224/119H01L2224/13023H01L2224/13109H01L2224/16145H01L2224/81191H01L2224/81193H01L2224/14135H01L2224/14177H01L2224/14136H01L2924/00014H01L21/32133H01L23/544H01L2223/54426
Inventor R·E·玻恩弗洛恩德J·H·达拉姆
Owner FLIR SYST INC