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Preparation method for LED packaging material

A technology for LED packaging and preparation steps, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high initial viscosity, poor impact resistance, poor mechanical properties, etc., achieve good internal stress, good stability, and prevent cracking Effect

Active Publication Date: 2017-02-22
广东万木新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention: in view of the defects that the current traditional packaging materials have large initial viscosity, easy cracking, poor mechanical properties, poor internal stress after curing, poor impact resistance, and low temperature resistance, the present invention uses graphite oxide After mixing the olefin aqueous solution with the silane coupling agent and ultrasonically dispersing, adding hydrazine hydrate for modification to obtain modified graphene oxide, mixing it with tetrahydrofuran, polymethyltriethoxysilane, and oxalic acid, placing it in an oil bath and Add epoxy resin dropwise and heat, then heat and stir with dibutyltin dilaurate and deionized water, then add curing agent to obtain the packaging material. The packaging material obtained in the present invention has suitable viscosity before and after product packaging, without cracking, and After curing, the range of internal stress changes is small, the mechanical properties and impact resistance are excellent, and it can withstand high temperature, so it has a wider application prospect.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0015] First weigh 3g of graphene oxide and add it to 500mL of deionized water, and add 300mL of absolute ethanol, ultrasonically disperse at 200W power for 20min, add 5gKH-560 after dispersion, continue ultrasonically for 1h, and centrifuge at 4000r / min after dispersion Separate and wash the precipitate with deionization 3 times after obtaining the precipitate; add the above-mentioned washed precipitate into deionized water at a mass ratio of 1:20, ultrasonically disperse at 180W power for 30min, then add 15g of hydrazine hydrate, and continue at 60°C Sonicate for 3 hours, and then centrifuge to obtain a precipitate, wash it with deionized water until neutral, put it in an oven, and dry it at 100°C for 5 hours to obtain the modified graphene oxide; in a 500mL three-necked flask Add 80g of tetrahydrofuran, 6g of polymethyltriethoxysilane, 2g of oxalic acid and 2g of the above-mentioned modified graphene oxide in sequence, put them into an oil bath, heat to 70°C, and drop them i...

example 2

[0018] First weigh 5g of graphene oxide and add it to 800mL of deionized water, and add 500mL of absolute ethanol, ultrasonically disperse at 300W power for 30min, add 8gKH-560 after dispersing, continue ultrasonically dispersing for 2h, and centrifuge at 5000r / min after dispersing Separate and wash the precipitate with deionization for 5 times; add the above-mentioned washed precipitate into deionized water at a mass ratio of 1:20, ultrasonically disperse at 250W power for 40min, then add 25g of hydrazine hydrate, and continue at 70°C Sonicate for 5 hours, and then centrifuge to obtain a precipitate, wash it with deionized water until neutral, put it in an oven, and dry it at 120°C for 7 hours to obtain the modified graphene oxide; in a 500mL three-necked flask Add 85g of tetrahydrofuran, 8g of polymethyltriethoxysilane, 3g of oxalic acid and 4g of the above-mentioned modified graphene oxide in sequence, put them into an oil bath, heat to 80°C, and drop them into a three-necke...

example 3

[0021]First weigh 4g of graphene oxide and add it to 700mL of deionized water, and add 400mL of absolute ethanol, ultrasonically disperse at 250W power for 25min, add 7gKH-560 after dispersion, continue ultrasonically for 1.5h, and rotate at 4500r / min after dispersion After centrifugal separation, the precipitate was obtained and washed 4 times with deionization; the above-mentioned washed precipitate was added to deionized water at a mass ratio of 1:20, ultrasonically dispersed at 210W power for 35min, and then 20g of hydrazine hydrate was added. Continue to sonicate for 4 hours, and centrifuge after sonication to obtain a precipitate, wash it with deionized water until it is neutral, put it in an oven, and dry it at 110°C for 6 hours to obtain the modified graphene oxide; in a 500mL three-necked flask Add 83g of tetrahydrofuran, 7g of polymethyltriethoxysilane, 2.5g of oxalic acid and 3g of the above-mentioned modified graphene oxide in sequence, put them into an oil bath, he...

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PUM

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Abstract

The invention discloses a preparation method for an LED packaging material, and belongs to the technical field of the packaging material. The preparation method comprises the steps of enabling a graphene oxide solution and a silane coupling agent to be mixed and subjected to ultrasonic dispersion, then adding hydrazine hydrate to modify to obtain modified graphene oxide; enabling the modified graphene oxide to be mixed with tetrahydrofuran, polymethyl triethoxy silane and oxalic acid, then putting the mixture into an oil bath pan, and adding epoxy resin dropwise and heating; and next, enabling the obtained mixture to be stirred and reacted with dibutyltin dilaurate and deionized water while performing thermal insulation, and then adding a curing agent to obtain the packaging material. The packaging method obtained in the invention is proper in viscosity before and after product packaging without a crack phenomenon; and in addition, the packaging material is relatively small in internal stress variation value range after material curing, excellent in mechanical performance and impact resistance performance, high-temperature resistance, and relatively wide in application prospect.

Description

technical field [0001] The invention discloses a preparation method of an LED encapsulation material, belonging to the technical field of encapsulation materials. Background technique [0002] With the improvement of semiconductor materials and packaging technology, and the improvement of luminous flux and light output efficiency, power LEDs have been applied in special lighting fields such as urban landscapes, traffic signs, LED backlights, automotive lighting, and billboards, and are entering the general lighting market. . However, with the continuous improvement of the input power of LED chips, the unavoidable large heat generated undoubtedly puts forward higher requirements for LED packaging materials. In terms of system heat dissipation, especially for power LEDs, choosing a suitable substrate has an important impact on its heat dissipation and reliability. The power LED heat dissipation substrate material requires high electrical insulation, high stability, high ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56
CPCH01L33/56H01L2933/005
Inventor 周丽花徐越陆娜
Owner 广东万木新材料科技有限公司