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Photosensitive insulated resin composition and method of producing insulated film thereof

An insulating resin, photosensitivity technology, applied in the photoengraving process of the pattern surface, photosensitive materials for opto-mechanical equipment, optics, etc. problems, to achieve excellent resolution and insulation, to avoid uneven coverage thickness, and it is difficult for the film to flow.

Inactive Publication Date: 2017-03-08
ECHEM SOLUTIONS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

like figure 1 As shown, in the process of forming the protective film 12 on the surface of the component 10, the slope F1 on the surface of the component 10, the contact angle between the plane F2 and the slope F1, or the place with a large slope angle may not be completely covered due to the flow. It leads to problems of uneven surface thickness and incomplete coverage of the component, causing damage to the surface to be protected in the subsequent process, affecting product quality and performance
Especially when the unevenness of the surface of the component to be protected or the film layer is greater, the problems of uneven surface thickness and incomplete coverage are more likely to occur

Method used

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  • Photosensitive insulated resin composition and method of producing insulated film thereof
  • Photosensitive insulated resin composition and method of producing insulated film thereof
  • Photosensitive insulated resin composition and method of producing insulated film thereof

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no. 1 example

[0063] According to the first embodiment of the present invention, the photosensitive insulating resin composition comprises component (A1) phenolic resin (the molar ratio of m-cresol and p-cresol is 5:5, Mw: 8000) 100 parts by mass; ( B1) 4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylene]bis(phenol) and 1,2-naphthoquinone 30 parts by mass of azido-5-sulfonic acid condensate; (C1) 20 parts by mass of hexamethoxymethylmelamine; (E1) 0.05 parts by mass of fluorine-containing surfactant (model: F-554, manufactured by DIC); (D1) 900 parts by mass of acetone and (D2) 120 parts by mass of propylene glycol monomethyl ether acetate. Dissolving (A1), (B1), (C1), and (E1) in (D1) and (D2) (the sequence is not limited) to prepare a photosensitive insulating resin composition.

[0064]According to the second embodiment of the present invention, the photosensitive insulating resin composition comprises component (A2) phenolic resin (the molar ratio of m-cresol and p-cresol is ...

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Abstract

The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130 DEG C; and a low-boiling-point solvent having a boiling point of equal to or lower than 130 DEG C, wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30 DEG C-100 DEG C, and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92-40:60.

Description

technical field [0001] The present invention relates to a photosensitive insulating resin composition suitable for an interlayer hardened product (insulating film), a surface protective film (coating film), a hardened product for high-density packaging substrates, etc. of semiconductor components, and particularly relates to a A positive photosensitive insulating resin composition capable of forming an insulating film with good heat resistance, solvent resistance and coating uniformity. Background technique [0002] In semiconductor manufacturing processes, such as liquid crystal display components or optical components, forming a protective film on a substrate is an important process. Since the process needs to be processed under harsh conditions, such as immersing the surface of the substrate with an acidic solution or alkaline solution, or forming a wiring electrode layer on the surface of the substrate by sputtering (Sputtering), local high temperatures are generated, so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/004
CPCG03F7/0048G03F7/039G03F7/022G03F7/0226G03F7/0233G03F7/40G03F7/038
Inventor 张哲玮钟明哲
Owner ECHEM SOLUTIONS
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