Adhesion promoter, curable silicone composition, and semiconductor device
A technology of adhesion promoter and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, adhesives, etc., can solve problems such as insufficient adhesion, and achieve the effect of excellent reliability
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preparation example Construction
[0040] In the above-mentioned preparation method, relative to the allyl group in the triallyl isocyanurate, it is necessary to make the hydrogen atom bonded to the silicon atom in the above-mentioned siloxane be less than an equivalent amount to react, relative to the triene The allyl group in propyl isocyanurate is 3 moles, and the hydrogen atom bonded to the silicon atom in the above-mentioned siloxane is preferably within the range of 0.5 moles to 2 moles, more preferably 0.75 moles to 1.5 moles. The amount in the range is reacted.
[0041] As the catalyst for hydrosilylation reaction used in the above-mentioned production method, a platinum-based catalyst, a rhodium-based catalyst, and a palladium-based catalyst can be exemplified, and a platinum-based catalyst is particularly preferable. As the platinum-based catalyst, platinum fine powder, platinum black, platinum-supported silica fine powder, platinum-supported activated carbon, chloroplatinic acid, ethanol solution of ...
Embodiment
[0108] The adhesion promoter, curable silicone composition, and semiconductor device of the present invention will be described in detail by way of examples. In addition, in the formula, Me, Vi, and Ph represent a methyl group, a vinyl group, and a phenyl group, respectively.
reference example 1
[0110] Put 400g (2.02mol) of phenyltrimethoxysilane and 93.5g (0.30mol) of 1,3-divinyl-1,3-diphenyldimethyldisiloxane into the reaction vessel, after pre-mixing, 1.74 g (11.6 mmol) of trifluoromethanesulfonic acid was added, and 110 g (6.1 mol) of water was added with stirring, and heated to reflux for 2 hours. Thereafter, heating and atmospheric distillation were performed so that the temperature was 85°C. Next, 89 g of toluene and 1.18 g (21.1 mmol) of potassium hydroxide were charged, heated and distilled at atmospheric pressure until the reaction temperature reached 120° C., and reacted at this temperature for 6 hours. Then, it cooled to room temperature, and 0.68 g (11.4 mmol) of acetic acid was injected|thrown-in and neutralized. After the generated salt was filtered off, low boiling point substances were removed by heating and reducing pressure from the obtained transparent solution, and an average unit formula was prepared:
[0111] (MePhViSiO 1 / 2 ) 0.23 (PhSiO 3 / ...
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