Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip package structure and manufacturing method thereof, electrostatic powder coating device

A technology of chip packaging structure and electrostatic powder, which is applied in the direction of electrostatic spraying device, spraying device, spray discharge device, etc., can solve the problem of chip function failure, achieve the effect of improving quality, good corrosion resistance, and ensuring reliability

Active Publication Date: 2019-02-22
SEMICON MFG INT TIANJIN +1
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to provide a chip packaging structure and its manufacturing method, and an electrostatic powder spraying device to solve the problem of chip function failure caused by silver glue overflowing and covering the upper surface of the chip in the existing chip bonding process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip package structure and manufacturing method thereof, electrostatic powder coating device
  • Chip package structure and manufacturing method thereof, electrostatic powder coating device
  • Chip package structure and manufacturing method thereof, electrostatic powder coating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] See Picture 10 with Picture 11 The chip packaging structure of this embodiment includes a circuit substrate 21, an adhesive layer 22 provided on the circuit substrate 21, and a chip 23 provided on the adhesive layer 22, wherein the sidewall of the chip 23 is provided with Non-stick material layer 24.

[0052] The adhesive layer 22 is a conductive adhesive layer, such as conductive silver adhesive. The conductive silver adhesive includes epoxy resin, acid anhydride curing agent and modified imidazole compound accelerator.

[0053] The non-stick material layer 24 is preferably a polytetrafluoroethylene (PTFE) material. Of course, the present invention includes but is not limited to polytetrafluoroethylene materials, as long as other non-stick materials with similar properties to polytetrafluoroethylene materials can also be used.

[0054] Using polytetrafluoroethylene material, on the one hand it has excellent heat resistance characteristics, can withstand high temperature t...

Embodiment 2

[0074] This embodiment provides an electrostatic powder spraying device for spraying electrostatic powder on the sidewall of the chip during the chip packaging process to form a non-stick material layer. Using electrostatic spraying can not only save paint, improve chip packaging efficiency, but also save labor costs.

[0075] Such as Figure 14 As shown, the electrostatic powder spraying device of this embodiment includes a powder supply unit 30 and a spray unit 40 connected to the powder supply unit 30, wherein the powder supply unit 30 is used to provide powder 31, and the spray unit 40 is used to spray The powder 31 is atomized or atomized more uniformly, and then electrostatically adsorbed on the side wall of the chip 51 to be sprayed. Here, the atomization means that the particles in the powder contain the same kind of electric charge, so that the powders repel each other on the transmission path, thereby forming a uniform cloud-like spray, and the spraying effect is good. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a chip encapsulation structure, a manufacture method thereof and an electrostatic powder spraying device. The chip encapsulation structure includes a circuit substrate, an adhesive layer arranged on the circuit substrate, and a chip arranged on the adhesive layer; and the side wall of the chip is provided with a non-stick material layer. The manufacture method of the chip encapsulation structure includes the following steps that: a chip for encapsulation is provided; a non-stick material layer is arranged on the side wall of the chip; a circuit substrate for carrying the chip is provided; an adhesive layer is arranged on the circuit substrate; the chip is arranged on the adhesive layer, and the bottom of the chip is completely covered with the adhesive layer; and the adhesive layer is heated, so that the adhesive layer can be cured. According to the chip encapsulation structure, the manufacture method thereof and the electrostatic powder spraying device of the invention, the non-stick material layer is arranged on the side wall of the chip, so that the overflowed adhesive layer will not adhere to the upper surface of the chip, and therefore, the malfunctioning of the chip can be avoided, the reliability of the chip can be ensured, and the quality of the chip encapsulation structure can be improved.

Description

Technical field [0001] The invention relates to semiconductor chip packaging technology, in particular to a chip packaging structure and a manufacturing method thereof, and an electrostatic powder spraying device. Background technique [0002] In semiconductor technology, the production of substrates generally uses materials such as silicon, quartz, lithium niobate, lithium tantalate, etc. After cleaning, coating, and photolithography, the substrate is made to contain multiple chips with complete electrical properties. The substrate, and then through the packaging process to achieve product molding. The packaging process directly determines the reliability of the product, which usually includes the steps of attaching a blue film, cutting and slicing the substrate, and bonding the chip. [0003] Existing chip packaging processes such as Figure 1-9 Shown, including: [0004] Step S1: Paste the blue film 11 on the back of the wafer frame 12 to protect the wafer 13, such as figure 2 S...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/31H01L21/56B05B5/00B05B5/025
Inventor 牛刚
Owner SEMICON MFG INT TIANJIN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com