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Solution and application for microfluidic chip bonding and surface modification of polymer materials

A microfluidic chip and surface modification technology, applied to laboratory containers, laboratory utensils, chemical instruments and methods, etc., can solve the problems of high equipment cost, complex control, high temperature, etc., and achieve simple equipment, The effect of simple equipment system and high bonding strength

Active Publication Date: 2018-10-30
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that a higher temperature is required; and due to heat transfer problems, thermocompression bonding often takes a long time; pressure control also has certain requirements
However, since vapor deposition often requires a vacuum environment, the equipment cost is very high
At the same time, in order to control the consistency of the surface modification everywhere, very complicated control is also required.

Method used

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  • Solution and application for microfluidic chip bonding and surface modification of polymer materials
  • Solution and application for microfluidic chip bonding and surface modification of polymer materials
  • Solution and application for microfluidic chip bonding and surface modification of polymer materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The change of embodiment one mixed solution to PMMA material hydrophilicity and hydrophobicity

[0031] Step 1: Take two PMMA chips with a flat surface, each about 3cm in length and width, and 5mm in thickness; place them in pure water, clean them with an ultrasonic cleaner, and dry them.

[0032] Step 2: Prepare 1 ml of mixed solution, including 500 μl of buffer component, 400 μl of bonding component, and 100 μl of surface modification component. Among them, the buffer component is n-hexane, the bonding component is chloroform, and the surface modification component is trichloro(1H,1H,2H,2H-perfluorooctyl)silane, whose structural formula is Then stir well.

[0033] Step 3: Perform oxygen plasma treatment on the two PMMA chips in Step 1 for 60 seconds.

[0034] Step 4: Lay the two PMMA chips flat, apply 1ml of the mixed solution evenly on the surface of one of the PMMA chips, and leave the other one untreated. Each of the two chips was placed in a ventilated contain...

Embodiment 2

[0036] Example 2 Using a mixed solution to bond a PC chip to realize the generation of droplets

[0037]Step 1: Take two PC chips with cross pipes. The length and width of the chips are 3cm, the depth of the pipe is 100 μm, and the width is 100 μm. The four branch ends of the cross pipe are connected with through holes, which will be used as the entrance and exit of the fluid. Take another PC chip that does not contain pipes and through-hole structures, and the length and width are both 3 cm. The four chips were cleaned with an ultrasonic cleaner and dried.

[0038] Step 2: Prepare 1 ml of mixed solution A, including 500 μl of buffer component, 400 μl of bonding component, and 100 μl of surface modification component. Wherein, the buffer component is 1-hexene, the bonding component is dichloromethane, and the surface modification component is trichloro(1H,1H,2H,2H-perfluorooctyl)silane. Prepare 1ml of mixed solution B without surface treatment components, including 600 μl of...

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Abstract

The invention discloses a solution used for bonding and surface modification of micro-fluidic chips made from polymer, and the solution comprises a solution buffering composition, a bonding composition and a surface modification composition; the solution buffering composition, the bonding composition and the surface modification composition are mutually soluble, reaction doesn't occur, and the chip cannot be corroded simultaneously. The solution used for bonding and surface modification of the micro-fluidic chips made from the polymer is suitable for large scale chip bonding, and the production flux is high; the bonding dead zones are few, and the strength is high; the equipment is simple, and the production cost is low; and after bonding, the pipeline deformation is small.

Description

technical field [0001] The invention relates to the field of microfluidic chips, in particular to a solution for bonding and surface modification of microfluidic chips made of polymer materials and an application thereof. Background technique [0002] The characteristics of microfluidic chip technology are based on micro-processing technology, and the structure that realizes the functions of sample injection, mixing, reaction and detection is integrated in a chip of several square centimeters. In the field of biochemical detection, microfluidic chip technology has potential advantages such as high throughput, high detection sensitivity, low cost and easy automation, so it has broad application prospects. [0003] Chip bonding is an important link in the production and processing of microfluidic chips. Chip bonding refers to the packaging of structures such as micro-channels, micro-pits, and through-holes obtained through micro-processing into airtight micro-pipes, micro-cav...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707
Inventor 郭永苏世圣杨文军
Owner TSINGHUA UNIV