Flexible circuit board via hole forming method

A technology of flexible circuit boards and via holes, which is applied in the direction of electrical connection formation of printed components, can solve problems such as poor adhesion of photosensitive resist film, unrealizable wiring structure, and restricted wiring density, etc., to achieve excellent electrical performance, The effect of saving process and reducing production cost
CN106572610AInactive Publication Date: 2017-04-19GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
Publication Date
2017-04-19
Estimated Expiration
Not applicable Β· inactive patent
Patent Text Reader

Abstract

The invention provides a flexible circuit board via hole forming method. With the flexible circuit board via hole forming method of the invention adopted, the connection of solid via holes between conductor layers of an integrated circuit package substrate can be realized. Compared with a method according to which cut-through hollow via holes formed by a traditional mechanical hole forming technology are connected, the flexible circuit board via hole forming method enables less area occupation, upper and lower corresponding line rackets of the holes are integrally preserved and are not damaged by the via holes, and therefore, corresponding electrical properties are excellent, and high reliability can be realized, and lead bonding operation can be directly operated on the via holes. With the flexible circuit board via hole forming method of the invention, a production process is simplified, production cost is saved, processing efficiency is improved, and a guarantee is provided for subsequent production of a high-precision image.
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Description

technical field

[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for forming a through hole of a flexible circuit board. Background technique

[0002] With the development of integrated circuits, the requirements for integrated circuit packaging have also increased, and the requirements for printed circuit boards used in packaging are also developing towards higher wiring density, better electrical performance and thermal performance. In order to meet the above requirements, the development of high-reliability via hole technology is the key, which has a great impact on the density of wiring and the electrical and thermal performance after packaging.

[0003] As we all know, there must be several via holes on the printed circuit board to connect the circuits on the upper and lower adjacent conductive surfaces of the insulating medium layer. The via holes in the prior art will have a great negative impact on the subs...

Claims

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