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Thermosetting resin composition and molded body thereof

A resin composition, thermosetting technology, applied in the direction of semiconductor/solid-state device components, circuits, electrical components, etc., can solve the problems of increased internal stress of packaging materials, inability to obtain mechanical reliability, and inability to fully suppress bending and cracks, etc. To achieve the effect of suppressing internal stress

Inactive Publication Date: 2017-04-19
MITSUBISHI RAYON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, general epoxy-curable packaging materials have a very low linear expansion rate and high elasticity, so internal stress in the packaging material becomes large due to temperature changes during curing and use.
In particular, when used as an encapsulation material for devices with a size of several centimeters or more, warpage and cracks cannot be sufficiently suppressed
On the other hand, for silicone gel-based packaging materials, internal stress can be suppressed by designing the elastic modulus to a very low value, but mechanical reliability cannot be obtained, and the application is limited

Method used

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  • Thermosetting resin composition and molded body thereof
  • Thermosetting resin composition and molded body thereof
  • Thermosetting resin composition and molded body thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0275] 24.0 g of 2-(3,4-epoxycyclohexyl) ethyl trimethoxysilane, 72.6 g of hydroxyl-terminated dimethyl polysiloxane (XC96-723 manufactured by Momentive Advanced Materials Japan Co., Ltd.), and iso 20 g of propanol and 10.7 g of 1N hydrochloric acid were mixed and stirred at room temperature for 3 hours, then 0.67 g of potassium hydroxide, 22.4 g of isopropanol and 44.9 g of toluene were added, and heating and stirring were performed for 4 hours under reflux. Then, after neutralizing the reaction solution with an aqueous solution of sodium dihydrogen phosphate (10% by weight), wash with water until the water after washing becomes neutral, remove volatile components under reduced pressure to obtain Mw=2500, epoxy equivalent= 903g / eq of epoxy silicone EPSi-1.

Synthetic example 2

[0277] In addition to adding 28.8g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 45.1g of hydroxyl-terminated dimethyl polysiloxane, and making 14.1g of trimethylethoxysilane, isopropyl Except for 24g of alcohol and 12.9g of 1N hydrochloric acid, 0.81g of potassium hydroxide, 26.9g of isopropanol, and 53.9g of toluene, the others were operated as in Synthesis Example 1 to obtain epoxy silicon with Mw=1800 and epoxy equivalent=636g / eq Ketone EPSi-2.

Synthetic example 3

[0279] In addition to making 16.4g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 70.0g of hydroxyl-terminated dimethylpolysiloxane, 216.0g of isopropanol and 8.6g of 1N hydrochloric acid, the hydrogen Except for 0.54 g of potassium, 18.0 g of isopropanol, and 35.9 g of toluene, the operations were carried out in the same manner as in Synthesis Example 1 to obtain epoxy silicone EPSi-3 with Mw=8100 and epoxy equivalent=1200 g / eq.

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Abstract

The present invention addresses the problem of providing a highly reliable thermosetting resin composition which is suitable for use in a sealing material for a semiconductor device and in which warpage and cracks do not occur even when used in a power device, in particular. The problem is solved by a thermosetting resin composition that includes a thermosetting resin and a curing catalyst, wherein the cured product of the thermosetting resin composition has a storage modulus at 25 DEG C of 1.0*10<6>-1.0*10<10> Pa, inclusive, and has an average linear expansion coefficient at 70-210 DEG C of 100 ppm / K or less.

Description

technical field [0001] The present invention relates to a thermosetting resin composition. In more detail, the present invention relates to a thermosetting resin composition comprising a thermosetting resin and a curing catalyst and the cured product has a specific storage modulus and an average linear expansion rate, and a molding formed by curing the resin composition. Body, and power devices (power devices) formed by using the resin composition and encapsulating. Background technique [0002] Packaging materials for semiconductor devices are required to suppress warpage and cracks caused by shrinkage during curing and heat generation during use. In particular, in power device applications, warps and cracks are particularly prone to occur in semiconductors due to their large size. [0003] As sealing materials for semiconductor devices, various sealing materials such as epoxy curing systems and silicone gel systems have been proposed (for example, refer to Patent Document...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/00C08K3/36C08K5/09C08L63/00C08L83/04
CPCC08G59/00C08L63/00C08G59/306H01L23/296C08K3/36C08G77/14C08K7/18
Inventor 齐藤真纪田中俊行木村章则陶氏凤金五十岛健史
Owner MITSUBISHI RAYON CO LTD
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