Blackbody material for synthesis of large particle diamond
A diamond and large particle technology, applied in the application of ultra-high pressure process, etc., can solve the problems of small particles, complex structure, difficult processing, etc., achieve the effect of simple material composition, wide source of raw materials, and guaranteed synthesis temperature
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Embodiment 1
[0023] Such as figure 1 Shown is the structural representation of the large-grain diamond synthesis device in the present invention; as figure 2 Shown is a schematic diagram of the current flow during the synthesis process of the large-grain diamond synthesis device in the present invention. A device for synthesizing large-grain diamonds provided by the present invention includes a diamond generating unit, a conductive component unit, a sealing unit, a heat preservation unit and a black body 1 .
[0024] The diamond generating unit includes a first graphite piece 2 , a metal catalyst 3 , a first heat preservation component 4 , and a second heat preservation component 5 . The top of the first graphite piece 2 is in contact with the first heat preservation component 4, and the bottom end of the first graphite piece 2 is in contact with the metal catalyst 3. The first graphite piece 2, the metal catalyst 3 and the first heat preservation component 4 are all placed in the second...
Embodiment 2
[0046] The difference between this embodiment and Embodiment 1 is that the thermal insulation material components used in the third thermal insulation component 11, the fourth thermal insulation component 12 and the fifth thermal insulation component 13 are composed of two high temperature resistant solid metal halide salts and titanium dioxide, Wherein the high temperature resistant solid metal halide salt can be sodium bromide or sodium iodide or potassium iodide or potassium bromide. The preferred two high temperature resistant solid metal halide salts in this embodiment are sodium bromide and sodium iodide, the first high temperature resistant solid metal halide salt is sodium bromide, and the second high temperature resistant solid metal halide salt is iodide Sodium, the first high-temperature-resistant solid metal halide salt, the second high-temperature-resistant solid metal halide salt and titanium dioxide are mixed and compressed according to the weight ratio of 2:2:1 ...
Embodiment 3
[0052] The difference between this embodiment and Embodiment 1 is that the thermal insulation material components used in the third thermal insulation component 11, the fourth thermal insulation component 12 and the fifth thermal insulation component 13 are composed of two high temperature resistant solid metal halide salts and titanium dioxide, Wherein the high temperature resistant solid metal halide salt can be sodium bromide or sodium iodide or potassium iodide or potassium bromide. The preferred two high temperature resistant solid metal halide salts in this embodiment are sodium bromide and sodium iodide, the first high temperature resistant solid metal halide salt is sodium bromide, and the second high temperature resistant solid metal halide salt is iodide Sodium, the first high-temperature-resistant solid metal halide salt, the second high-temperature-resistant solid metal halide salt and titanium dioxide are mixed and compressed according to a weight ratio of 3:2:1 to...
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