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High temperature and die cutting resistant pressure-sensitive adhesive and preparation method thereof

A pressure-sensitive adhesive and high-temperature-resistant technology, applied in the field of pressure-sensitive adhesives, can solve problems such as difficult cleaning, high cost, and inability to use on a large scale, and achieve the effects of good adhesion, good film-forming properties, and increased bond energy

Inactive Publication Date: 2017-04-26
NINGBO SOKEN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the tape made of a separate silicone adhesive has no problems such as die-cut overflow, the separate silicone adhesive has problems such as high cost and difficulty in cleaning after coating, and cannot be used on a large scale in the pressure-sensitive adhesive industry.

Method used

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  • High temperature and die cutting resistant pressure-sensitive adhesive and preparation method thereof
  • High temperature and die cutting resistant pressure-sensitive adhesive and preparation method thereof
  • High temperature and die cutting resistant pressure-sensitive adhesive and preparation method thereof

Examples

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Effect test

preparation example Construction

[0031] The preparation method of the pressure-sensitive adhesive in the present invention is as follows: the main monomer is configured according to the above mass ratio, and then 100 parts of the configured main monomer, 0.1 to 1.0 parts of the initiator and 0.1 to 5.0 parts of the crosslinking agent are put into a single kettle, Stir while feeding, and get the mixed material after stirring evenly;

[0032] Take 10-15 parts of organic solvent and add it to the reaction kettle, stir and heat up to 78-82°C (preferably 82°C), add 1 / 4 of the above-mentioned mixed material, and react at 78-82°C (preferably 82°C) for 1.5-2.0h (preferably 1.5h);

[0033] Add the rest of the above-mentioned mixed material to the reaction kettle dropwise, and the dropping time is controlled at 1.5-2.0h (preferably 2.0h). 2.0h), then lower the temperature of the reaction kettle to 40-45°C (preferably 40°C), add the remaining organic solvent, stir for 4-5min, and then discharge to obtain the desired pr...

Embodiment 1

[0049] The components and parts by mass of the pressure-sensitive adhesive in the present embodiment are as follows:

[0050] 60 parts of butyl acrylate, 30 parts of methyl methacrylate, 6 parts of acrylic acid, 4 parts of vinyltrimethoxysilane, 0.5 parts of dibenzoyl peroxide, 40 parts of toluene, and 2 parts of crosslinking agent.

Embodiment 2

[0052] The components and parts by mass of the pressure-sensitive adhesive in the present embodiment are as follows:

[0053] 80 parts of butyl acrylate, 10 parts of methyl methacrylate, 6 parts of acrylic acid, 4 parts of acryltrimethoxysilane, 0.5 parts of dibenzoyl peroxide, 50 parts of toluene, and 1 part of crosslinking agent.

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Abstract

The invention relates to a high temperature and die cutting resistant pressure-sensitive adhesive. The adhesive is characterized in that adhesive comprises, by mass, 100 parts of a main monomer, 0.1-1.0 part of an initiator, 0.1-5.0 parts of a cross-linking agent, and 40-60 parts of an organic solvent, wherein the main monomer comprises a soft monomer, a hard monomer, a cross-linking monomer and organic silicon resin, and a mass ratio of the soft monomer to the hard monomer to the cross-linking monomer to the organic silicon resin is (60-80):(8-35):(5-15):(1-10). The invention also relates to a preparation method of the pressure-sensitive adhesive. The pressure-sensitive adhesive has the advantages of excellent high temperature resistance, good die cutting performance, and no die cleaning after 20,000 or above time die cutting. The pressure-sensitive adhesive has the common characteristics of an organosilicone adhesive and an acrylic acid adhesive, has good film forming property, has good adhesion strength (1000-2000g / 25mm), and has good adhesion to a substrate. A preparation method of the pressure-sensitive adhesive has the advantages of simplicity, easiness in control, and facilitation of reduction of the production cost of the pressure-sensitive adhesive.

Description

technical field [0001] The invention relates to the field of pressure-sensitive adhesives, in particular to a high-temperature-resistant, die-cutting-resistant pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] Smart phones, handheld computers, etc. have become indispensable tools in our daily life, and the HOME button is an accessory for operation on many smart phones and handheld computers. The HOME button is a very complicated assembly, and one of the accessories is die-cut with pressure-sensitive adhesive to form a ring structure, which plays the role of bonding and cushioning the FPC sheet. With the optimization of mobile phone motherboards and the expansion of memory, mobile phone software developers have also made mobile phone software very gorgeous, which leads to obvious heating of mobile phones when playing some large-scale games or opening multiple software at the same time. Heat resistance places new demands. [0003] In...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/18C08F220/14C08F220/06C08F230/08C09J133/08
CPCC08F220/18C08F220/1804C09J143/04C08F220/14C08F220/06C08F230/08
Inventor 朱敏芳谢琼颖虞竺君
Owner NINGBO SOKEN CHEM
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