A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it

A technology of polyphenylene ether resin and composition, applied in the fields of prepreg, polyphenylene ether resin composition, laminate and printed circuit board, can solve the problem of poor thermal oxidation resistance, low dielectric constant, low dielectric Loss and other issues, to achieve the effect of good thermal oxidation resistance, small absolute value of change, and low dielectric loss

Inactive Publication Date: 2018-11-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The above-mentioned prior art has the following problems: in order to obtain lower dielectric constant and lower dielectric loss, it is necessary to increase the use ratio of vinyl resin crosslinking agent such as polybutadiene
Although the prepared base material has lower low dielectric constant and lower dielectric loss, the styrene active groups carried by the bifunctional or tetrafunctional vinyl benzyl ether modified thermosetting polyphenylene ether resin are limited, Can not completely react the excess vinyl resin crosslinking agent such as polybutadiene side chain double bond
Incompletely reacted vinyl resin crosslinking agents such as polybutadiene side chain double bonds have poor thermal and oxidative aging resistance, which seriously affects the stability of the dielectric constant and dielectric loss of the substrate during long-term use, thereby making the substrate The signal integrity performance deteriorates and cannot meet customer needs

Method used

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  • A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it
  • A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it
  • A polyphenylene ether resin composition and prepreg, laminate and printed circuit board containing it

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0063] Synthesis of Pentafunctional Vinylbenzyl Ether Modified Thermosetting Polyphenylene Ether Resin VBMP-1:

[0064] Add 32.4g of methylphenol, 24.4g of 2,6-dimethylphenol, 50.0g of formaldehyde solution (the content of formaldehyde is (24wt%)), 1.0g of aqueous hydrochloric acid solution (the content of HCL is 32wt%) is equipped with mechanical stirring, and the cooling tube In a four-necked reaction flask, heat it to 80-90°C, wash it with water three times after reacting for 6 hours, and distill off the water under reduced pressure. Cool to 50°C and add 125g of polyphenylene ether (number average molecular weight = 2500), 300g of toluene, and heat to 80~ At 90°C, add 2 g of benzoyl peroxide in batches, wash with water three times after reacting for 8 hours, distill under reduced pressure to remove toluene and water, and the number average molecular weight of polyphenylene ether detected by GPC is 1340. Dissolve the obtained polyphenylene ether in toluene solution (the poly...

preparation example 2

[0066] Synthesis of Pentafunctional Vinylbenzyl Ether Modified Thermosetting Polyphenylene Ether Resin VBMP-2:

[0067] Add 32.4g of methylphenol, 24.4g of 2,6-dimethylphenol, 50.0g of formaldehyde solution (the content of formaldehyde is (24wt%)), 1.0g of aqueous hydrochloric acid solution (the content of HCL is 32wt%) is equipped with mechanical stirring, and the cooling tube In a four-necked reaction flask, heat it to 80-90°C, wash it with water three times after reacting for 6 hours, and remove the water by distillation under reduced pressure. Cool to 50°C and add 125g of polyphenylene ether (number average molecular weight = 10000), 300g of toluene, and heat to 80~ At 90°C, add 2 g of benzoyl peroxide in batches, wash with water three times after reacting for 8 hours, distill under reduced pressure to remove toluene and water, and the number average molecular weight of polyphenylene ether detected by GPC is 1340. Dissolve the obtained polyphenylene ether in toluene solutio...

preparation example 3

[0069] Synthesis of Pentafunctional Vinylbenzyl Ether Modified Thermosetting Polyphenylene Ether Resin VBMP-3:

[0070] Add 32.4g of methylphenol, 24.4g of 2,6-dimethylphenol, 50.0g of formaldehyde solution (the content of formaldehyde is (24wt%)), 1.0g of aqueous hydrochloric acid solution (the content of HCL is 32wt%), and add the In a four-necked reaction flask, heat it to 80-90°C, wash it with water three times after reacting for 6 hours, and remove the water by distillation under reduced pressure. Cool to 50°C and add 125g of polyphenylene ether (number average molecular weight = 15000), 300g of toluene, and heat to 80~ At 90°C, add 2 g of benzoyl peroxide in batches, wash with water three times after reacting for 8 hours, distill under reduced pressure to remove toluene and water, and the number average molecular weight of polyphenylene ether detected by GPC is 1340. Dissolve the obtained polyphenylene ether in toluene solution (the polyphenylene ether content is 40wt%),...

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Abstract

Provided are a thermosetting polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises: (1) a pentafunctional or higher multifunctional vinylbenzyl ether-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the pentafunctional or higher multifunctional vinylbenzyl ether-modified thermosetting polyphenyl ether resin. The vinylbenzyl ether-modified thermosetting polyphenyl ether resin, due to containing a pentafunctional or higher multifunctional styrene active group, can cross-link more vinyl resin cross-linking agents. The prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, so that the high-speed electronic circuit substrate has a better thermo-oxidative ageing resistance; furthermore, the stability of the dielectric constant and dielectric loss of the substrate is good during long-term use.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a polyphenylene ether resin composition and prepregs, laminates and printed circuit boards containing it. Background technique [0002] In recent years, with the development of electronic information technology, the miniaturization and high density of electronic equipment installation, the large capacity of information, and the high frequency and high speed of transmission signals have been applied to high-end communication network hardware equipment such as routers, switches, and servers. The transmission lines of electronic circuit boards used by etc. are getting longer and longer, requiring electronic circuit substrates to have lower dielectric constant and lower dielectric loss. [0003] For high-speed electronic circuit substrates, maintaining the stability of the dielectric constant and dielectric loss of the substrate during long-term use will hav...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L25/10C08K5/14C08G65/48B32B15/08B32B15/20B32B27/04H05K1/03
CPCB32B27/04C08G65/48C08L9/06C08L71/00C08L71/12H05K1/02
Inventor 陈广兵曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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