GaAs-based solid-state plasma PiN diode and preparation method therefor

Abstract

The invention relates to a GaAs-based solid-state plasma PiN diode and a preparation method therefor. The preparation method comprises the steps of selecting a GeOI substrate of a certain crystal orientation, and depositing a GaAs layer and setting an isolation region on the GeOI substrate; etching the GeOI substrate to form a P type trench and an N type trench, wherein the depths of the P type trench and the N type trench are smaller than the thickness of top layer GaAs of the substrate; performing ion injection in the P type trench and the N type trench to form a first P type active region and a first N type active region; filling the P type trench and the N type trench, and adopting ion injection to form a second P type active region and a second N type active region in the top layer GaAs of the substrate; and forming leads on the substrate to complete the preparation of the GaAs-based solid-state plasma PiN diode. According to the embodiments, the high-performance GaAs-based solid-state plasma PiN diode, which is applicable to formation of a solid-state plasma antenna, can be prepared by adopting a deep trench isolation technology and the ion injection process.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a GaAs-based solid-state plasma PiN diode and a preparation method thereof. Background technique [0002] At present, the materials used in PiN diodes used in plasma reconfigurable antennas at home and abroad are all bulk silicon materials. This material has the problem of low carrier mobility in the intrinsic region, which affects the carrier concentration in the intrinsic region of the PiN diode, and thus Affect its solid-state plasma concentration; and the P region and N region of this structure are mostly formed by implantation process, which requires a large implant dose and energy, high requirements on equipment, and is incompatible with existing processes; and the diffusion process, Although the junction depth is deep, the areas of the P region and the N region are large, the integration degree is low, and the doping concentration is uneven, which affects the e...

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Problems solved by technology

[0002] At present, the materials used in PiN diodes used in plasma reconfigurable antennas at home and abroad are all bulk silicon materials. This material has the problem of low carrier mobility in the intrinsic region, which affects the carrier concentration in the intrinsic region of the PiN diode, and thus Affect its solid-state plasma concentration; and the P region and N region of this structure are mostly formed by implantation process, which requires a large implant dose and energy, high requirements on equipment, and is incompatible with existing processes; and the diffusion process, Although the junction depth is deep, but at the same time, the area of ​​the P region and the N region is large, the integration degree is low, and the doping concentration is uneven, which affects the electrical performance of the PiN diode, resulting in poor controllability of the solid-state plasma concentration and distribution.

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