A welding method for dual-interface smart card

Abstract

Disclosed is a welding method of a dual-interface smart card. The dual-interface smart card comprises a metal antenna, a module groove and welding grooves. The welding method is characterized by comprising the steps that tinned wire tubes which are spiral through winding are placed in the two welding grooves respectively, wherein the thickness of a tinned layer on the surface of each tinned wire tube ranges from 0.05mm to 0.15mm; and the high temperature ranging from 180 DEG C to 190DEG C is applied to the surface of a dual-interface module, and the heat is transferred to the tinned wire tubes to melt soldering tin on the surfaces of the tinned wire tubes, so that connection between dual-interface module welding pads and an antenna welding pad is achieved. According to the welding method of the dual-interface smart card, due to the fact that the tinned wire tubes serve as welding intermediate media, the problems that in the prior art, the stability is low, the rejection rate is relatively high, and hot compression deformation is obvious in the dual-interface smart card production process are solved, the time of the whole welding process is short, welding spots formed after welding are smooth, and the smart card is low in card body deformation and more attractive in appearance.

Description

technical field [0001] The invention relates to a smart card, in particular discloses a welding method for a dual-interface smart card, which is a smart card manufacturing method applied in the field of information technology. Background technique [0002] At present, the production method of dual-interface smart card generally includes the following steps: [0003] Use ultrasonic waves to implant copper enameled wires on card body materials (PVC, PETG, etc.) to form metal antennas. Some manufacturers also use bonding methods to bond enameled wire coils wound by winding machines to antenna substrates to form metal antennas. antenna. [0004] The dual-interface smart card base is a large semi-finished product formed by laminating the transparent film, printing layer and intermediate layer (including antenna), printing layer and surface film after binding, and then put it into the card cutting machine and die-cut it. [0005] The pads of the card base module are obtained by ...

AI Technical Summary

Problems solved by technology

This welding method is theoretically feasible, but there is an obvious disadvantage in actual production: this welding mode determines that there is too much solder left on the pad of the dual-interface module (solder thickness needs to reach about 0.3mm), melting these Soldering requires a long time and high temperature. For PVC, the base material of smart cards, such a high temperature and heating time are enough to deform PVC and have a great impact on the appearance of smart cards.

If the heating time is reduced or the heating temperature is lowered in order to avoid deformation, it will bring the hidden danger of virtual welding, which brings great uncertainty to the machine operators on the production site

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